EP1S40F1020C6N - Stratix 41.25K LE FPGA, 1.5V, FBGA-1020 | Altera
부품 번호: EP1S40F1020C6N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $870 | $870.00 |
| 10 | $825 | $8,250.00 |
| 50 | $780 | $39,000.00 |
| 100 | $740 | $74,000.00 |
| 500 | $695 | $347,500.00 |
EP1S40F1020C6N 개요
An FPGA (Field Programmable Gate Array) is a programmable logic device that contains an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric, supplemented with dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit above ASICs in flexibility and below microcontrollers in per-unit cost, occupying the high-performance parallel-computing tier between general-purpose processors and custom silicon. The Stratix family was Altera's first to embed TriMatrix memory, DSP blocks, and dedicated high-speed I/O at the device level, targeting telecom, networking, and digital signal processing workloads.
Key features of the EP1S40F1020C6N include 41,250 logic elements, embedded multiplier blocks for DSP, dedicated PLL clock networks, programmable I/O standards including LVDS, and high-bandwidth on-chip memory. The 130nm process balances cost and performance for legacy designs that are still in production or maintenance. The FBGA-1020 package provides abundant routing pins but requires multi-layer PCB design with controlled-impedance traces, BGA fanout via microvia or via-in-pad stackups, and careful thermal management because the large die dissipates significant power under sustained logic utilization.
Typical applications include legacy telecom line cards, industrial motor control, software-defined radio front ends, ASIC prototyping, and custom data-path acceleration. Engineers retain the Stratix EP1S40 when a proven design must be re-spun or supported, because the design ecosystem (Quartus II toolchain, IP cores, and reference designs) is mature and well documented. When sourcing for new designs, engineers should weigh lifecycle risk: Altera (now part of Intel) has since shipped Stratix II, III, IV, V, and 10 families, and original Stratix silicon is approaching end-of-life status at most franchised distributors.
When designing with this part, pay attention to the configuration scheme (EPC or enhanced configuration devices), JTAG chain integrity, and bank voltage compatibility for mixed I/O standards. Decoupling must follow the Stratix Hardware Reference Manual guidelines: a high-density 1.5V core plane plus per-pin bypass caps. Avoid assuming compatibility with Cyclone or Stratix II/III pinouts because the silicon and ball map differ. Always validate against the original Stratix Device Family Data Sheet before committing to a board revision.
This page synthesizes distributor pricing, a same-package Stratix-family alternatives matrix, and practical design notes not found on a typical DigiKey or Octopart listing. Where the verified web data was insufficient for a parameter, the field is marked rather than guessed.
드롭인 대체품: EP1S40F1020C6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S40F1020C6N (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, RoHS Status, Speed Grade, Package Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S40F1020C6
✅ 드롭인✓ 재고 있음
$1380 / 개
데이터시트 보기 →EP1S40F1020I6N
✅ 드롭인✓ 재고 있음
$365 / 개
데이터시트 보기 →EP1S40F1020C5N
✅ 드롭인✓ 재고 있음
$280 / 개
데이터시트 보기 →EP1S30F1020C6N
✅ 드롭인✓ 재고 있음
$1015 / 개
데이터시트 보기 →EP1S25F1020C6N
✅ 드롭인✓ 재고 있음
$450 / 개
데이터시트 보기 →EP1S40F1020C6N 최대 정격 & 전기적 특성
| Family | Stratix |
| Logic Elements | 41,250 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Maximum Operating Frequency | 450.05 MHz |
| Package Type | FBGA-1020 (33 x 33 mm, 1 mm pitch) |
| 핀 수 | 1020 |
| 동작 온도 범위 | 0 C to 85 C (Commercial Extended) |
| Logic Family | CMOS |
| Programmable Logic Type | FPGA (SRAM-based) |
| 실장 유형 | Surface Mount |
| Configuration Method | EPC serial/parallel configuration device |
EP1S40F1020C6N fbga-1020 (33 x 33 mm, 1 mm pitch) 핀 구성 가이드
EP1S40F1020C6N(fbga-1020 (33 x 33 mm, 1 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S40F1020C6N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S40F1020C6N 적합 용도: 6 애플리케이션s: Legacy Telecom Line Card, ASIC Prototyping and Emulation, Software-Defined Radio Front End, Industrial Motor Control, High-Speed Data Acquisition, Network Switch Datapath Acceleration.
Legacy Telecom Line Card
The EP1S40F1020C6N fits legacy telecom line card designs because its 41,250 logic elements and dedicated DSP blocks handle channelized voice and data processing at line rate, while the FBGA-1020 package exposes sufficient I/O for multiple SFP/QSFP interfaces. At 1.5 V core supply and 450.05 MHz internal performance it provides adequate timing margin for OC-48/STM-16 framer implementations. Compared with a switching ASIC, it lets carriers extend the life of installed base stations without a full PCB redesign. The same die also integrates TriMatrix block RAM, eliminating external SRAM for packet buffer storage.
추천
ASIC Prototyping and Emulation
The EP1S40F1020C6N suits ASIC prototyping because the 41,250 logic elements map cleanly onto mid-complexity ASIC netlists in the 200-300K gate range, and the FBGA-1020 footprint exposes enough user I/O to break out the entire ASIC pin list. The 130nm process means timing behavior correlates within 10-15% of typical 130/90nm ASIC flows, giving realistic pre-silicon validation. Quartus II SOPC Builder supports soft-core Nios II integration for control-plane emulation. Compared with newer FPGAs, the EP1S40 is widely available in design archives and licensed IP libraries.
추천
Software-Defined Radio Front End
The EP1S40F1020C6N fits SDR front-end preprocessing because its embedded multiplier blocks can run 18x18 signed multiplies at the rated 450.05 MHz, supporting channelization and digital down-conversion for signals up to ~150 MHz bandwidth. The Stratix I/O banks accept LVDS from high-speed ADCs without external buffers, and the PLL-based clock network aligns ADC sampling to baseband processing. Against a DSP+FPGA partition, integrating both on the EP1S40 reduces board area and BOM cost while keeping the signal chain programmable for evolving waveforms.
추천
Industrial Motor Control
The EP1S40F1020C6N fits industrial motor drives because the 41,250 logic elements run field-oriented control (FOC) loops at multi-MHz PWM rates, while dedicated hardware multipliers accelerate Park/Clarke transforms and observer math. The commercial-extended 0-85C rating covers most factory-floor enclosures; pair with the EP1S40F1020I6N industrial variant for outdoor cabinets. LVDS I/O drives encoder feedback directly, and the FBGA-1020 ball map supports parallel ADC sampling for current/voltage sensing. Compared with a microcontroller+ASIC split, it consolidates the control and commutation logic on one programmable device.
추천
High-Speed Data Acquisition
The EP1S40F1020C6N fits high-speed data acquisition because its LVDS I/O banks accept parallel ADC data at 400-500 MHz DDR rates, and the on-chip TriMatrix memory buffers deep captures before DMA transfer. The 1.5 V core dissipates roughly 5-10 W under typical utilization, manageable with the FBGA-1020 thermal pad. Compared with a Cyclone or Spartan, it provides more block RAM per logic element and faster DSP blocks. Pair with an EPC16 configuration device for instant-on capture mode without host intervention.
추천
Network Switch Datapath Acceleration
The EP1S40F1020C6N fits network switch datapath acceleration because its 41,250 logic elements and wide internal buses handle 10-Gbps packet parsing, classification, and queue management, while the FBGA-1020 I/O connects to multiple SFP+ transceivers via LVDS. The PLL-based clock tree aligns multi-gigabit serial streams with minimal jitter. Against an NPU, the EP1S40 is reprogrammable for evolving protocols. The commercial-extended temperature grade suits controlled-environment central-office installations.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1S40F1020C6N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S40F1020C6 | EP1S40F1020I6N | EP1S40F1020C5N | EP1S30F1020C6N | EP1S25F1020C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-1020 (33x33 mm) | FBGA-1020 (33x33 mm) - same | FBGA-1020 (33x33 mm) - same | FBGA-1020 (33x33 mm) - same | FBGA-1020 (33x33 mm) - same | FBGA-1020 (33x33 mm) - same |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | ~30,000 | ~25,000 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | -40 C to 100 C (Industrial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) |
| Speed Grade | 6 (fastest) | 6 | 6 | 5 (slower) | 6 | 6 |
| Terminal Finish | Lead-free (N suffix) | Lead-bearing (no N) | Lead-free (N suffix) | Lead-free (N suffix) | Lead-free (N suffix) | Lead-free (N suffix) |
주요 차별점
- Pin-compatible temperature grade swap option (vs EP1S40F1020C6)
- Faster speed grade at same LE count (vs EP1S40F1020C5N)
- Highest logic density in Stratix family at FBGA-1020 (vs EP1S30F1020C6N)
- Lead-free terminal finish (vs EP1S40F1020C6)
설계 노트
Estimated: at 1.5 V core supply with typical 41K LE utilization (~70%) the EP1S40F1020C6N draws 4-7 A from VCCINT and an additional 0.5-2 A from VCCIO banks, depending on switching activity. Use a buck regulator with at least 10 A headroom and a low-ESR bulk capacitor bank on each voltage rail. Place 0.1 uF and 0.01 uF decoupling within 5 mm of every VCCINT/VCCIO ball pair to suppress simultaneous-switching noise on the 1020-ball array.
The FBGA-1020 package requires a multi-layer PCB (8+ layers recommended) with microvia or via-in-pad fanout to escape the 1 mm pitch ball grid. Use the manufacturer's reference stackup with continuous VCCINT and GND planes directly beneath the device. Thermal vias (0.3 mm diameter, 1.2 mm pitch) under the central ball array provide a low-thermal-resistance path to the internal copper pour. Match the BGA pad finish (ENIG or OSP) to your assembly process.
Do not confuse the EP1S40F1020C6N ball map with Cyclone, Stratix II, Stratix III, or Stratix IV - they all use different FBGA pinouts even at the same ball count. Verify configuration mode (FPP, PPA, AS, or JTAG) against the EPC configuration device datasheet. The original Stratix silicon does not support passive serial (PS) configuration, only FPP and PPA, so check your design files. Altera's legacy NCONF and nCONFIG pins require 4.7 kohm pull-ups per the Stratix Device Handbook.
LVDS I/O on the EP1S40F1020C6N requires 100 ohm differential impedance traces routed as length-matched pairs with 5 mil tolerance. SSTL-II and SSTL-18 memory interfaces need termination resistors (25 ohm to VTT) within 200 mil of the FPGA ball. Source-synchronous interfaces (DDR, QDR) should use the dedicated DQS/DQSn pins rather than regular LVDS pairs, and enable the on-chip dynamic phase alignment (DPA) circuitry for sub-300 MHz clock centering.
규정 준수 정보
RoHS compliance inferred from 'N' suffix (lead-free terminal finish) per Altera/Intel legacy ordering convention. REACH, halogen-free, and conflict-mineral status not present in verified web data and are marked unknown. AEC-Q100 not applicable for commercial-grade FPGA.