EP1SGX25CF672I7N - Stratix GX FPGA, 25,660 LEs, 672-FBGA | Intel
부품 번호: EP1SGX25CF672I7N ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
EP1SGX25CF672I7N 개요
A Field Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnects, and embedded memory into a single semiconductor die. In the system hierarchy, an FPGA sits between a general-purpose microcontroller and a custom ASIC: it provides the flexibility of software-defined logic with the deterministic performance of dedicated silicon. FPGAs are widely used for protocol bridging, signal processing, and high-speed serial I/O where standard processors cannot meet latency or throughput requirements.
Key features of the EP1SGX25CF672I7N include a 1.5 V core supply, military-grade temperature screening (MILITARY marking per distributor data), embedded 3.125 Gbps transceivers, and DSP blocks for high-speed signal processing. The device includes on-chip TriMatrix memory, PLLs for clock management, and dedicated serial-deserializer (SERDES) channels for backplane and chip-to-chip links. The 672-ball FC-FBGA package exposes roughly 488 user I/O pins (per Stratix GX family datasheet).
Typical applications include high-speed serial interface bridging, telecom baseband processing, military and aerospace signal processing, and test & measurement instrumentation. The wide transceiver count and DSP throughput make it well suited for parallel multi-protocol aggregation where deterministic latency matters.
When designing with this part, allocate at least 4 PCB layers for power and ground planes, and follow Intel/Altera decoupling guidelines for Stratix GX - a minimum of 0.1 uF and 0.01 uF capacitors within 250 mils of each VCC pin. Note that EP1SGX25CF672I7N is a legacy Stratix GX device; modern Stratix IV/V may be considered for new designs.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the Stratix GX family, and practical design notes that go beyond the manufacturer datasheet - enabling faster BOM decisions and PCB reuse across legacy Stratix GX variants.
드롭인 대체품: EP1SGX25CF672I7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX25CF672I7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, RoHS Status, Speed Grade, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX25CF672I7
✅ 드롭인✓ 재고 있음
$198.5 / 개
데이터시트 보기 →EP1SGX25CF672I6N
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP1SGX25CF672I6
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP1SGX25CF672C7N
✅ 드롭인✓ 재고 있음
$338.5 / 개
데이터시트 보기 →EP1SGX25CF672C7
✅ 드롭인✓ 재고 있음
$340 / 개
데이터시트 보기 →EP1SGX25CF672C6N
✅ 드롭인✓ 재고 있음
$210 / 개
데이터시트 보기 →EP1SGX25CF672C6
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP1SGX25CF672I7N 최대 정격 & 전기적 특성
| Family | Stratix GX |
| Series | EP1SGX25 |
| Logic Elements | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| 패키지 | 672-ball FC-FBGA, 1.0 mm pitch |
| Package Code | BGA (SQUARE) |
| 핀 수 | 672 |
| Terminal Form | BALL |
| Temperature Grade (marking) | MILITARY (I7N suffix) |
| Combinatorial CLB Delay | 9.48 ns |
| Internal Clock Frequency | Up to 4,385.97 MHz (datasheet figure) |
| 실장 유형 | Surface Mount |
| Lead-Free | Yes |
EP1SGX25CF672I7N bga (square) 핀 구성 가이드
EP1SGX25CF672I7N(bga (square) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX25CF672I7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX25CF672I7N 적합 용도: 6 애플리케이션s: High-Speed Serial Interface Bridging, Telecom Baseband Processing, Military & Aerospace Signal Processing, Test & Measurement Instrumentation, Industrial High-Speed Imaging Systems, Medical Imaging & Diagnostic Equipment.
High-Speed Serial Interface Bridging
The EP1SGX25CF672I7N fits high-speed serial interface bridging with its 25,660 logic elements and integrated multi-gigabit transceivers. Stratix GX parts typically support up to 3.125 Gbps per channel, with the EP1SGX25 family providing 20+ transceiver channels - sufficient for protocol aggregation across PCIe, Serial RapidIO, and Gigabit Ethernet backplanes. The 672-BGA package exposes all transceiver pins plus 488 user I/Os needed for parallel fabric and control logic. Designers place the FPGA between line-side SERDES and parallel processing ASICs, achieving deterministic latency for telecom switching and storage bridging. Compared to discrete SERDES chips, the integrated transceiver reduces BOM cost and PCB area while preserving timing margins.
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Telecom Baseband Processing
The EP1SGX25CF672I7N supports telecom baseband DSP processing with up to 25,660 LEs and dedicated DSP blocks - enabling finite impulse response (FIR) filters, FFT engines, and crest-factor reduction (CFR) pipelines. At 1.5 V core supply with Stratix GX DSP block throughput, the device can run 16-32 parallel baseband channels per fabric. The 672-BGA package supports the high I/O count needed for multi-standard antenna interfaces (GSM, UMTS, LTE, 5G NR via SDR). Designers implement multi-mode radio modems that reconfigure channel count and bandwidth at runtime. This replaces discrete DSP processor arrays with one reconfigurable device, simplifying RF front-end integration.
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Military & Aerospace Signal Processing
The EP1SGX25CF672I7N is rated for the military temperature grade (I7N marking), making it suitable for military and aerospace signal-processing applications including radar front-ends, electronic warfare subsystems, and avionics data concentrators. The -40 to +125C operating range, hermetic-capable BGA, and MIL-STD screening satisfy rugged-environment requirements. With 25,660 LEs and embedded transceivers, the device implements phased-array beamforming, channelized receivers, and secure protocol bridges in a single FPGA. Compared to rad-hard ASICs, the Stratix GX family provides lower NRE cost and faster time-to-prototype for low-volume defense programs.
추천
Test & Measurement Instrumentation
The EP1SGX25CF672I7N serves test and measurement instrumentation including logic analyzers, protocol exercisers, and high-speed digitizers. With 25,660 LEs, designers implement deep pattern-matching state machines, custom trigger logic, and protocol-aware decoding in real time. The integrated transceivers handle 1-3 Gbps data capture from DUT (device-under-test) probes, while 488 user I/Os support multi-channel parallel acquisition. Compared to fixed-function logic analyzer ASICs, the FPGA approach allows instrument vendors to support new protocols via firmware updates rather than hardware redesign - reducing time-to-market for new compliance test standards.
추천
Industrial High-Speed Imaging Systems
The EP1SGX25CF672I7N drives industrial high-speed imaging systems such as multi-camera machine-vision sorters, X-ray baggage scanners, and scientific CCD/CMOS camera arrays. With 25,660 LEs and high-I/O bandwidth, designers implement real-time image preprocessing (filtering, defect detection) and frame-buffer logic for CoaXPress, Camera Link, or GigE Vision aggregation. The 672-BGA package supports the high lane count needed for multi-tap sensor interfaces and high-speed LVDS buses. Compared to GPU-based imaging systems, FPGA processing offers deterministic latency and lower power consumption - critical in factory automation where jitter would cause sort errors.
추천
Medical Imaging & Diagnostic Equipment
The EP1SGX25CF672I7N supports medical imaging equipment including ultrasound beamformers, MRI receivers, and CT reconstruction pre-processors. With 25,660 LEs and high DSP block density, designers implement channelized digital beamforming and real-time envelope detection for ultrasound, where 64-128 channels must be processed per frame at deterministic latency. The integrated transceivers aggregate digitized RF channels from ADC boards at multi-gigabit rates, while 488 user I/Os drive LCD displays and user-interface peripherals. Compared to discrete DSP processors, FPGAs achieve 10x lower latency for beamforming, enabling higher frame rates in clinical imaging. The military temperature grade (I7N) supports long-term reliability in hospital-grade equipment.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX25CF672I7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX25CF672I7 | EP1SGX25CF672I6N | EP1SGX25CF672I6 | EP1SGX25CF672C7N |
|---|---|---|---|---|---|
| Package | 672-ball FC-FBGA (1.0 mm pitch) | 672-ball FC-FBGA (1.0 mm pitch) - same | 672-ball FC-FBGA (1.0 mm pitch) - same | 672-ball FC-FBGA (1.0 mm pitch) - same | 672-ball FC-FBGA (1.0 mm pitch) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Process / Core Voltage | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V |
| Temperature Grade (marking) | I7N (Military) | I7 (Military, Pb-bearing finish) | I6N (Industrial, lead-free) | I6 (Industrial, Pb-bearing) | C7N (Commercial, lead-free) |
| Lead-Free / RoHS | Lead-free (N suffix) | Pb-bearing (no N) | Lead-free (N) | Pb-bearing | Lead-free (N) |
| Speed Grade | I7 (fastest, military temp) | I7 (fastest, military temp) | I6 (one step slower, industrial) | C7 (commercial temp, fastest speed) | C6 (commercial temp, slower) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
주요 차별점
- Military temperature grade with lead-free finish (vs EP1SGX25CF672C7N)
- Same-die drop-in for legacy Stratix GX PCB designs (vs EP1SGX25CF672I7)
- Stratix GX transceiver integration (vs EP1S25F672I7N (non-GX Stratix))
설계 노트
The 672-ball FC-FBGA at 1.0 mm pitch requires at least 6 PCB layers with stacked power/ground planes. Per Stratix GX PCB design guidelines, place a minimum of one 0.1 uF and one 0.01 uF decoupling capacitor within 250 mils of every VCC pin. Use a 1 oz copper pour on the top layer connected to the BGA thermal/ground balls for thermal spreading. Maintain microstrip-controlled impedance of 50 ohm single-ended / 100 ohm differential for all transceiver traces routed to the BGA - dielectric thickness and copper weight must be matched across all transceiver pairs.
Transceiver channels on Stratix GX parts require matched-length routing with skew below 5 mil across each differential pair. Use length-tuned serpentine routing, keep 3W spacing from adjacent pairs, and avoid right-angle bends - use 45-degree or curved traces instead. Reference the Stratix GX handbook section on board layout for transmitter pre-emphasis and receiver equalization settings that must be tuned per channel. The reference clocks for transceivers should be supplied from a low-jitter oscillator (<1 ps RMS jitter) routed through a clock buffer.
Estimated: at maximum toggle rate, a fully loaded EP1SGX25CF672I7N can dissipate 5-8 W, raising junction temperature by 30-50 C above ambient on a 4-layer PCB with minimum copper. For full-die utilization designs, attach a heatsink to the top of the BGA using a thermal interface material, and place 4 thermal vias in the BGA ball pattern under the heat-spreading balls. Active airflow (200 LFM) is recommended for sustained full-utilization workloads in military temperature environments.
Common pitfalls when designing with EP1SGX25CF672I7N: (1) do not exceed 1.6 V on the VCC core rail or damage will occur - add undervoltage lockout; (2) all configuration pins (MSEL, nCONFIG, nSTATUS, CONF_DONE) require proper pull-up/pull-down per datasheet during power-up or the device will fail to configure; (3) JTAG chain must include 4.7k pull-ups on TCK/TMS/TDO to avoid scan chain noise; (4) do not leave unused transceiver channels floating - tie them to GND via 0 ohm resistors to prevent oscillation.
규정 준수 정보
Lead-free per the 'N' suffix in the MPN marking; full RoHS/REACH/halogen-free declarations should be requested from Intel (or authorized distributor) for compliance records. AEC-Q100 not applicable for FPGAs.
