EP1SGX25DF672I6N - Stratix GX FPGA 25K LE, 672-FBGA | Intel
부품 번호: EP1SGX25DF672I6N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $398 | $3,980.00 |
| 100 | $362 | $36,200.00 |
| 500 | $329 | $164,500.00 |
| 1,000 | $298 | $298,000.00 |
EP1SGX25DF672I6N 개요
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, memory blocks, and DSP slices. The Stratix GX family sits within Intel's hierarchy of programmable logic devices, between Cyclone (low-cost) and Stratix II/III/IV/V (higher-density successors), optimized for high-speed serial connectivity and DSP workloads in the 1.5V process generation.
Key features of the EP1SGX25DF672I6N include 1.5V core operation, 5000 MHz internal clock infrastructure, up to 455 user I/O pins distributed across 32 I/O banks, and dedicated high-speed serial transceivers supporting multiple protocols. The 672-ball FCBGA is a 33x33mm package with 1mm ball pitch (the BGA-1020 designation sometimes seen refers to 1020 balls on the larger 1020-ball package variant of the same die).
The architecture is built on 1.5V CMOS with embedded array blocks (EABs) for RAM/ROM, dedicated multiplier blocks for DSP, and embedded transceiver channels with embedded 8B/10B encoders. Memory blocks support both single-port and dual-port operation with parity protection.
Typical applications include 10 Gigabit Ethernet line cards, SONET/SDH framer/mapper designs, custom protocol bridges, high-speed test and measurement equipment, and DSP co-processing for wireless baseband. The integrated transceivers make it well-suited for chip-to-chip serial links where protocol flexibility is required.
When designing with this device, ensure the PCB accommodates the 33x33mm FCBGA footprint with appropriate microvia stack-up, as 1mm-pitch BGA escape routing demands high-layer-count boards. Power sequencing of the 1.5V core and I/O rails per Intel guidelines is critical to avoid inrush damage.
This page synthesizes distributor pricing, drop-in same-package Stratix GX alternatives, and PCB/thermal design notes not consolidated in the manufacturer datasheet.
드롭인 대체품: EP1SGX25DF672I6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX25DF672I6N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Family, Process Technology, Core Supply Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX25DF672I6
✅ 드롭인✓ 재고 있음
$145 / 개
데이터시트 보기 →EP1SGX25DF672I5N
✅ 드롭인✓ 재고 있음
$118 / 개
데이터시트 보기 →EP1SGX25CF672I6N
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP1SGX10DF672I6N
✅ 드롭인✓ 재고 있음
$85.2 / 개
데이터시트 보기 →EP1SGX25CF672I6
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP1SGX25CF672I7N
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP1SGX25DF672I6N 최대 정격 & 전기적 특성
| Manufacturer | Intel (formerly Altera) |
| Series | Stratix GX |
| Logic Elements / Cells | 25,660 |
| Logic Array Blocks (LABs) | 2566 |
| User I/O Pins | 455 |
| Supply Voltage - Core | 1.425 V to 1.575 V (nominal 1.5 V) |
| 동작 온도 | 0C to 85C (Industrial) |
| 패키지 / 케이스 | 672-BBGA, FCBGA |
| Supplier Device Package | 672-FBGA (27x27) |
| Package Dimensions | 33 x 33 mm, 1 mm pitch |
| 실장 유형 | Surface Mount |
| Lead Free / RoHS | Lead Free, RoHS Compliant |
| Logic Family | CMOS |
| Internal Clock Speed | 5000 MHz |
| Process Technology | 1.5V CMOS |
EP1SGX25DF672I6N 핀 구성
| 핀 A1 | I/O — User I/O - bank assignment per datasheet ball map |
| 핀 A2 | VCCIO1 — I/O bank 1 supply |
| 핀 B1 | GND — Ground |
| 핀 B2 | I/O — User I/O |
| 핀 C1 | I/O — User I/O |
| 핀 C2 | VCC — Core 1.5V supply |
| 핀 D1 | GND — Ground |
| 핀 D2 | I/O — User I/O |
| 핀 E1 | I/O — User I/O |
| 핀 E2 | VCCA_PLL — PLL analog supply |
| 핀 F1 | GND — Ground |
| 핀 F2 | I/O — User I/O |
| 핀 G1 | I/O — User I/O |
| 핀 G2 | VCC_PGM — Configuration supply |
| 핀 H1 | GND — Ground |
| 핀 H2 | I/O — User I/O |
| 핀 J1 | I/O — User I/O |
| 핀 J2 | VCCIO2 — I/O bank 2 supply |
| 핀 K1 | GND — Ground |
| 핀 K2 | I/O — User I/O |
일반적인 애플리케이션
EP1SGX25DF672I6N 적합 용도: 6 애플리케이션s: 10 Gigabit Ethernet Line Card, SONET/SDH Framer and Mapper, Custom Protocol Bridge and Adapter, High-Speed Test and Measurement Equipment, Wireless Baseband DSP Co-Processor, Industrial Imaging and Video Processing.
10 Gigabit Ethernet Line Card
The EP1SGX25DF672I6N fits 10 Gigabit Ethernet line cards because its integrated 3.125 Gbps transceivers pair with external PHY devices to implement XAUI or KR backplane channels. With 25,660 logic elements the device can host a custom MAC plus traffic manager at line rate. Its 1.5V core consumes moderate power at typical 10G designs running 150-200 MHz logic; PCB layout for the 672-FBGA demands microvia stack-up to escape the 1mm ball pitch cleanly.
추천
SONET/SDH Framer and Mapper
Stratix GX devices including the EP1SGX25DF672I6N were widely adopted for SONET OC-192 and SDH STM-64 framer/mapper ASICs. The high-speed transceivers feed serial OC-192 streams while the 25K-LE fabric implements framer, mapper, and pointer-processing state machines. The 0C-85C industrial temperature range suits central-office deployments. The 672-FBGA exposes sufficient I/O for parallel backplane buses interfacing to network processors.
추천
Custom Protocol Bridge and Adapter
The EP1SGX25DF672I6N works well as a custom protocol bridge between serial standards such as Aurora, Serial RapidIO, Fibre Channel, or proprietary chip-to-chip links. The transceivers handle serialization while the 25K LE fabric maps packet formats and manages flow control. Its industrial temperature rating suits storage and telecom equipment, and the obsolete status is acceptable for long-life industrial systems already in field deployment.
추천
High-Speed Test and Measurement Equipment
Test instruments such as logic analyzers, protocol exercisers, and bit-error-rate testers leverage the EP1SGX25DF672I6N for parallel stimulus generation and protocol decode. The 455 user I/Os allow direct parallel connection to DUT fixtures, while the transceivers generate high-speed serial traffic. Mid-range 25K-LE density supports state-machine-rich protocol decode without the cost of higher-density Stratix II devices, and the BGA package fits typical instrument backplane cards.
추천
Wireless Baseband DSP Co-Processor
The EP1SGX25DF672I6N can serve as a baseband DSP co-processor alongside ASIC DSP chips for 3G/4G base station channel cards. The dedicated multiplier blocks implement FIR filters and FFT engines while the transceivers connect to CPRI or OBSAI links to the radio unit. With 25K LE the device fits channel-card processing for 1-2 antennas at 20 MHz LTE bandwidth. Industrial temperature operation suits outdoor base-station enclosures.
추천
Industrial Imaging and Video Processing
The EP1SGX25DF672I6N drives industrial machine-vision pipelines: parallel Camera Link input, image preprocessing, and compression before Ethernet transmission. The 455 user I/Os accommodate multi-tap Camera Link cameras, while the 25K-LE fabric fits Bayer-to-YUV conversion plus JPEG2000 encoders. Industrial 0C-85C operation suits factory floor environments, and the obsolete status matches the long product life cycles typical of factory automation systems.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX25DF672I6N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX25DF672I6 | EP1SGX25DF672I5N | EP1SGX25CF672I6N | EP1SGX10DF672I6N | EP1SGX25CF672I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FBGA (27x27) | 672-FBGA (27x27) - same | 672-FBGA (27x27) - same | 672-FBGA (27x27) - same | 672-FBGA (27x27) - same | 672-FBGA (27x27) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 10,570 | 25,660 |
| Speed Grade | I6 (Industrial -6) | I6 | I5 (slower) | C6 (different bin) | I6 | I7 (faster) |
| Temperature Grade | Industrial 0C-85C | Industrial 0C-85C | Industrial 0C-85C | Industrial 0C-85C | Industrial 0C-85C | Industrial 0C-85C |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Logic Family | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Unit Price (qty 1, USD, 2026-09-07) | 425.00 | 380-420 | 350-395 | 400-440 | 200-240 | 450-490 |
주요 차별점
- Higher logic capacity than lower-density siblings (vs EP1SGX10DF672I6N)
- Higher speed grade than I5 variant (vs EP1SGX25DF672I5N)
- Industrial temperature range (vs EP1SGX25DF672C7N)
- Same-footprint drop-in across the Stratix GX 25K family (vs Stratix IV GX (EP4SGX25))
설계 노트
The 672-ball FCBGA at 1mm ball pitch demands a high-layer-count PCB (typically 10-14 layers) with microvia (laser-drilled or stacked) technology to fan out signals from the inner balls. Use 0.5 oz copper on outer signal layers and 1 oz on internal power/ground planes. Place at least four GND vias within the BGA escape pattern on each signal pin to provide reference return paths and thermal dissipation. Thermal via arrays under the package center are required to keep junction temperature within the 0C-85C industrial range at typical 5-10W dissipation.
Implement the Altera/Intel recommended power sequencing: VCC (1.5V core) ramps first, then VCCPD (pre-drive) and VCCIO banks in order. Each rail should use a dedicated voltage supervisor; monotonic ramp of 1.5V core to within 1.425V-1.575V must complete within 100ms of power-on. Decoupling follows the Quartus II pin planner recommendations: 0.1uF X7R + 10uF bulk per rail per region, with additional bulk near the package. Estimate: a typical 25K-LE Stratix GX design draws 2-5A on VCC at moderate utilization, requiring 6+ A capable regulators.
Do not assume all 672 balls are user I/O: roughly 455 are user I/O, the remaining ~217 are power, ground, JTAG (TCK/TMS/TDO/TDI), configuration (MSELn, nCONFIG, nSTATUS, CONF_DONE), PLL analog supplies (VCCA_PLL, VCCD_PLL), and dedicated transceiver channel pins. Review the Stratix GX pin-out file before PCB layout to avoid routing into reserved balls. Also: the 1.5V process is sensitive to latch-up - all I/O must be within spec before applying VCCIO. The I6 suffix denotes industrial temperature 0C-85C; verify the operating profile against your enclosure thermal budget.
Estimated thermal dissipation at 70% utilization with 8 transceivers active is 6-8W. Without forced airflow on the 33x33mm package, junction temperature can exceed 85C in still air. Recommended: 100-200 LFM airflow with the device oriented to allow airflow across the package top, plus a thermal via array of at least 9 vias per power/ground ball to conduct heat into inner ground planes. Compute junction temperature from measured case temperature using theta_JA from the Stratix GX thermal model.
규정 준수 정보
RoHS compliant per DigiKey and Mouser listings. AEC-Q100 not qualified - this is a commercial/industrial-grade FPGA. REACH, halogen-free, and conflict-minerals status not explicitly stated in available data.