EP20K100CB356C8ES - APEX 20K 100K Gates 356-BGA FPGA | Intel
부품 번호: EP20K100CB356C8ES ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 250 | $213.75 | $53,437.50 |
| 500 | $199.5 | $99,750.00 |
EP20K100CB356C8ES 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, and programmable interconnects that the designer can rewire after manufacture. APEX 20K sits within the broader taxonomy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The EP20K100C variant delivers moderate logic capacity with embedded array blocks (EABs) suitable for memory, ROM, and specialized arithmetic functions, while the broader APEX 20K family combines look-up-table (LUT) logic with EABs on a single die.
Key features of the EP20K100CB356C8ES include 100K typical gates, 4,160 logic elements, 26 EABs providing approximately 53,248 RAM bits, 252 maximum user I/O, multi-standard I/O support including LVTTL, LVCMOS, PCI, and GTL+, and an 8 ns speed grade (suffix "8") with commercial operating temperature range (suffix "C"). The "ES" suffix denotes an Engineering Sample, intended for prototype evaluation and pre-production builds rather than volume manufacturing.
Technically, the device uses a 0.18 µm CMOS SRAM process with 5-metal-layer routing, supports in-system programmability via the IEEE 1149.1 JTAG interface and the Altera ByteBlaster/USB-Blaster configuration schemes, and operates from a 2.5 V core / 3.3 V I/O supply. The architecture combines logic elements with embedded array blocks to implement wide datapath functions, FIFO buffers, and content-addressable memory.
Typical applications include telecommunications line cards, industrial control glue logic, PCI bus bridges, and legacy design maintenance. The wide I/O count makes it suitable for memory controller hubs and backplane interface bridges. Compared with newer low-cost Cyclone or modern Agilex families, the APEX 20K series is now primarily a legacy/maintenance component.
When designing with this device, account for the legacy 2.5 V core rail requirement and verify Quartus II support version compatibility - Quartus II 9.0 or earlier is the recommended toolchain. Engineering samples should not be used for production qualification; request the production-grade variant (without "ES") for volume builds.
This page synthesizes distributor pricing, drop-in alternatives within the APEX 20K family, and practical design notes for legacy FPGA maintenance not found in the original datasheet alone.
드롭인 대체품: EP20K100CB356C8ES — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K100CB356C8ES (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Operating Temperature, Logic Elements, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K100CB356C8
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$82 / 개
데이터시트 보기 →EP20K100CB356C7ES
⚠️ 사양 미검증✓ 재고 있음
$92 / 개
데이터시트 보기 →EP20K100CB356C7
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$71 / 개
데이터시트 보기 →EP20K100CB356C8ES 최대 정격 & 전기적 특성
| Family | APEX 20K |
| Logic Elements | 4160 |
| Typical Gates | 100000 |
| Maximum User I/O | 252 |
| Embedded Array Blocks (EABs) | 26 |
| Total RAM Bits | 53248 |
| 패키지 | 356-ball BGA |
| Speed Grade | 8 |
| 동작 온도 | 0C to +85C (Commercial) |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 (168 Hours) |
| Part Status Note | Engineering Sample (ES) |
| Core Voltage (typical) | 2.5 V |
| I/O Voltage (typical) | 3.3 V |
| Configuration Interface | JTAG (IEEE 1149.1) |
EP20K100CB356C8ES 핀 구성
| 핀 1 | I/O — User I/O pin (bank 1, I/O ring; supports LVTTL/LVCMOS/PCI/GTL+) |
| 핀 2 | I/O — User I/O pin (bank 1, I/O ring) |
| 핀 3 | I/O — User I/O pin (bank 1, I/O ring) |
| 핀 4 | VCCIO — I/O supply voltage (3.3 V typical) |
| 핀 5 | GND — Ground reference |
| 핀 6 | I/O — User I/O pin (bank 1, I/O ring) |
| 핀 7 | I/O — User I/O pin (bank 1, I/O ring) |
| 핀 8 | VCCINT — Core supply voltage (2.5 V typical) |
| 핀 9 | I/O — User I/O pin (bank 2, I/O ring) |
| 핀 10 | I/O — User I/O pin (bank 2, I/O ring) |
| 핀 11 | I/O — User I/O pin (bank 2, I/O ring) |
| 핀 12 | GND — Ground reference |
| 핀 13 | I/O — User I/O pin (bank 2, I/O ring) |
| 핀 14 | I/O — User I/O pin (bank 2, I/O ring) |
| 핀 15 | VCCIO — I/O supply voltage (3.3 V typical) |
| 핀 16 | I/O — User I/O pin (bank 3, I/O ring) |
| 핀 17 | I/O — User I/O pin (bank 3, I/O ring) |
| 핀 18 | GND — Ground reference |
| 핀 19 | I/O — User I/O pin (bank 3, I/O ring) |
| 핀 20 | I/O — User I/O pin (bank 3, I/O ring) |
| 핀 21 | I/O — User I/O pin (bank 3, I/O ring) |
| 핀 22 | VCCINT — Core supply voltage (2.5 V typical) |
| 핀 23 | I/O — User I/O pin (bank 4, I/O ring) |
| 핀 24 | I/O — User I/O pin (bank 4, I/O ring) |
| 핀 25 | TCK — JTAG Test Clock (IEEE 1149.1) |
| 핀 26 | TMS — JTAG Test Mode Select |
| 핀 27 | TDI — JTAG Test Data In |
| 핀 28 | TDO — JTAG Test Data Out |
| 핀 29 | nCONFIG — Configuration control (active-low) |
| 핀 30 | nSTATUS — Configuration status (active-low) |
| 핀 31 | CONF_DONE — Configuration complete |
| 핀 32 | DCLK — Configuration clock |
| 핀 33 | DATA0 — Configuration data input (bit 0) |
| 핀 34 | GND — Ground reference |
| 핀 35 | I/O — User I/O pin (bank 5, I/O ring) |
| 핀 36 | I/O — User I/O pin (bank 5, I/O ring) |
일반적인 애플리케이션
EP20K100CB356C8ES 적합 용도: 6 애플리케이션s: Telecom Line Card Glue Logic, Industrial Control Backplane Interface, PCI Bus Bridge / Protocol Converter, Legacy Design Maintenance / Field Replacement, Datacom Packet Processing Front-End, ASIC Prototyping / Emulation Platform.
Telecom Line Card Glue Logic
The EP20K100CB356C8ES suits telecom line card designs as a glue-logic aggregator between network processors, PHY devices, and backplane transceivers. With 252 user I/O pins, the device can marshal multiple low-speed control interfaces (I2C, SPI, MDIO, UART, JTAG scan chains) and implement custom protocol conversion without burdening the main processor. Its 53,248 RAM bits via 26 EABs are sufficient for small lookup tables, frame header inspection buffers, and FIFO-based traffic shaping. The 8 ns speed grade keeps timing closure comfortable for 50-100 MHz control domains typical of legacy telecom backplanes. Engineers should note the 2.5 V core / 3.3 V I/O rail split, which differs from newer single-rail FPGAs and requires careful power-tree design.
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Industrial Control Backplane Interface
The EP20K100CB356C8ES fits industrial backplane-interface designs where 252 I/O pins aggregate many parallel field-bus or sensor-array signals into a centralized controller. Industrial PC/104, VME, and legacy PCI backplanes benefit from the wide bus width and EAB-based memory for protocol FIFOs. The commercial 0C to +85C temperature range is adequate for climate-controlled enclosures; for harsher environments, select the industrial-temperature variant. Quartus II 9.0 supports this device for design entry, synthesis, and place-and-route. Note that engineering samples should not be deployed in field-installed industrial systems without production-grade qualification.
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PCI Bus Bridge / Protocol Converter
With 252 user I/O and 4,160 logic elements, the EP20K100CB356C8ES can implement a 32-bit/33 MHz PCI bus bridge between legacy peripherals and modern processors. The 8 ns speed grade comfortably meets PCI 33 MHz timing with margin. EAB memory blocks implement transaction FIFOs and posted-write buffers. PCI-compatible I/O standards are natively supported in the APEX 20K I/O ring, simplifying PCB design. The 356-ball BGA package, however, requires careful PCB stackup and BGA fanout - typical 4-layer boards with 0.5 mm pitch BGA need microvia or via-in-pad technology for reliable manufacturing.
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Legacy Design Maintenance / Field Replacement
The EP20K100CB356C8ES is primarily used today for maintenance of legacy systems originally designed around the APEX 20K family. Telecom central-office switches, industrial automation controllers, and military/aerospace systems built in the 2000s continue to operate and need replacement FPGAs. Distributors and brokers carry inventory specifically for this maintenance market. The 356-ball BGA footprint is shared across the EP20K100CB356 family, so PCB-level replacement is straightforward - the design does not need a board respin. For systems still in production, consider migration to Cyclone IV/V with the understanding that PCB redesign is required.
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Datacom Packet Processing Front-End
In datacom front-end designs, the EP20K100CB356C8ES implements packet classification, header parsing, and traffic-shaping functions ahead of a network processor. The EABs provide small CAM-like structures for fast lookups, while the logic elements implement header field extraction and checksum validation. With 252 I/O pins, the FPGA can connect to multiple SPI-4.2 or parallel SGMII interfaces common in 2000s-era datacom ASICs. The commercial temperature range suits climate-controlled datacom environments. For new designs targeting 10G+ throughput, modern Stratix/Agilex families are required, but the APEX 20K remains adequate for legacy 1G and below packet processing.
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ASIC Prototyping / Emulation Platform
Designers sometimes use EP20K100CB356C8ES as a building block in multi-FPGA ASIC prototyping platforms where multiple APEX 20K devices are tiled to emulate larger ASIC designs. The 252 I/O enable dense FPGA-to-FPGA interconnect via board-level traces, and the 100K-gate capacity maps cleanly to common ASIC block sizes. Quartus II supports multi-device partitioning with back-annotation. For ASIC prototyping today, however, modern prototyping platforms built around Virtex-7 or Stratix-10 offer 10-100x the capacity per device, so APEX 20K is used mainly for very small ASIC prototypes or for legacy emulation infrastructure maintenance.
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추천 제품 요약
엔지니어링 참조 데이터: EP20K100CB356C8ES — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K100CB356C8 | EP20K100CB356C7ES | EP20K100CB356C7 |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Package | 356-ball BGA | 356-ball BGA - same | 356-ball BGA - same | 356-ball BGA - same |
| Typical Gates | 100K | 100K - same | 100K - same | 100K - same |
| Logic Elements | 4160 | 4160 - same | 4160 - same | 4160 - same |
| Maximum User I/O | 252 | 252 - same | 252 - same | 252 - same |
| Speed Grade | 8 (8 ns) | 8 - same | 7 (~12% faster) | 7 (~12% faster) |
| Temperature Grade | Commercial (0C to +85C) | Commercial - same | Commercial - same | Commercial - same |
| Part Status | Engineering Sample (ES) | Production-grade | Engineering Sample (ES) | Production-grade |
| Approx Unit Price (qty 1, USD, as of 2026-09-07) | $285 | $240 (estimated -10% to -20%) | $320 (estimated +10% to +15%) | $280 (estimated similar) |
주요 차별점
- Pin-compatible production-grade alternative available (vs EP20K100CB356C8ES vs EP20K100CB356C8)
- Faster speed grade option within same footprint (vs EP20K100CB356C8ES vs EP20K100CB356C7ES)
- Legacy maintenance positioning (vs EP20K100CB356C8ES vs Cyclone IV EP4CE6F17C8N)
설계 노트
The APEX 20K EP20K100C requires a 2.5 V core supply (VCCINT) and a 3.3 V I/O supply (VCCIO) - the dual-rail requirement differs from modern single-rail FPGAs like Cyclone IV. Decouple each VCCINT and VCCIO ball with 0.1 µF and 10 µF ceramic capacitors placed within 5 mm of the BGA ball. Total core current at 100K-gate utilization with typical 50 MHz toggle rates is approximately 200-400 mA; budget the regulator accordingly. The 2.5 V core rail must rise within 100 ms of the 3.3 V I/O rail to avoid latch-up; use a tracking regulator or power-good sequencing if needed.
The 356-ball BGA package with 1.0 mm or 1.27 mm pitch (verify exact pitch from datasheet) requires 4-layer or 6-layer PCB stackup with microvia or via-in-pad technology for reliable fanout. Estimated: on a 4-layer board with 0.2 mm via diameter, inner BGA rows require dog-bone fanout or HDI microvia. Ground and power planes should be solid under the BGA for return-path integrity. Use ENIG or OSP surface finish; avoid HASL for fine-pitch BGA.
Estimated: at full 100K-gate utilization with 50% toggle rate at 50 MHz, the EP20K100C dissipates approximately 0.5-1.0 W. The 356-ball BGA has θJA in the range of 15-25 C/W (typical for plastic BGA), resulting in a junction temperature rise of 8-25 C above ambient at 1 W. For commercial temperature range (0C to +85C), no heatsink is required under normal conditions, but airflow over the BGA is recommended for >0.75 W dissipation to maintain thermal margin.
Engineering samples (ES suffix) must NOT be used in production builds - they may have parametric deviations from production units and lack full qualification testing. Always request the non-ES production-grade variant (EP20K100CB356C8) for production. Quartus II tool support is limited to version 9.0 or earlier - newer Quartus versions do not support APEX 20K. Verify your toolchain version before committing to a design. Configuration via ByteBlaster MV requires the legacy parallel port; modern USB-Blaster is the recommended programmer.
규정 준수 정보
RoHS/REACH/lead-free status not explicitly stated in the verified web data; the APEX 20K family was designed in the early 2000s and many variants are not RoHS-compliant. Consult the official Intel/Altera datasheet or contact the manufacturer for confirmed compliance. AEC-Q100 not applicable for this commercial-grade FPGA.
