EP20K100CB356C8ES - APEX 20K 100K Gates 356-BGA FPGA | Intel
MPN： EP20K100CB356C8ES ✗ 停產EP20K100CB356C8ES 概覽
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, and programmable interconnects that the designer can rewire after manufacture. APEX 20K sits within the broader taxonomy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The EP20K100C variant delivers moderate logic capacity with embedded array blocks (EABs) suitable for memory, ROM, and specialized arithmetic functions, while the broader APEX 20K family combines look-up-table (LUT) logic with EABs on a single die.
Key features of the EP20K100CB356C8ES include 100K typical gates, 4,160 logic elements, 26 EABs providing approximately 53,248 RAM bits, 252 maximum user I/O, multi-standard I/O support including LVTTL, LVCMOS, PCI, and GTL+, and an 8 ns speed grade (suffix "8") with commercial operating temperature range (suffix "C"). The "ES" suffix denotes an Engineering Sample, intended for prototype evaluation and pre-production builds rather than volume manufacturing.
Technically, the device uses a 0.18 µm CMOS SRAM process with 5-metal-layer routing, supports in-system programmability via the IEEE 1149.1 JTAG interface and the Altera ByteBlaster/USB-Blaster configuration schemes, and operates from a 2.5 V core / 3.3 V I/O supply. The architecture combines logic elements with embedded array blocks to implement wide datapath functions, FIFO buffers, and content-addressable memory.
Typical applications include telecommunications line cards, industrial control glue logic, PCI bus bridges, and legacy design maintenance. The wide I/O count makes it suitable for memory controller hubs and backplane interface bridges. Compared with newer low-cost Cyclone or modern Agilex families, the APEX 20K series is now primarily a legacy/maintenance component.
When designing with this device, account for the legacy 2.5 V core rail requirement and verify Quartus II support version compatibility - Quartus II 9.0 or earlier is the recommended toolchain. Engineering samples should not be used for production qualification; request the production-grade variant (without "ES") for volume builds.
This page synthesizes distributor pricing, drop-in alternatives within the APEX 20K family, and practical design notes for legacy FPGA maintenance not found in the original datasheet alone.
直接替換替代品，適用於 EP20K100CB356C8ES — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP20K100CB356C8ES （相同外形與佔位） — 差異在於 Speed Grade, Package, Operating Temperature, Logic Elements, Process Technology.
EP20K100CB356C8
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP20K100CB356C7ES
⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP20K100CB356C7
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP20K100CB356C8ES 最大額定值與電氣特性
| Family | APEX 20K |
| Logic Elements | 4160 |
| Typical Gates | 100000 |
| Maximum User I/O | 252 |
| Embedded Array Blocks (EABs) | 26 |
| Total RAM Bits | 53248 |
| 封裝 | 356-ball BGA |
| Speed Grade | 8 |
| 工作溫度 | 0C to +85C (Commercial) |
| 安裝類型 | Surface Mount |
| MSL 等級 | 3 (168 Hours) |
| Part Status Note | Engineering Sample (ES) |
| Core Voltage (typical) | 2.5 V |
| I/O Voltage (typical) | 3.3 V |
| Configuration Interface | JTAG (IEEE 1149.1) |
EP20K100CB356C8ES 腳位配置
| 腳位 1 | I/O — User I/O pin (bank 1, I/O ring; supports LVTTL/LVCMOS/PCI/GTL+) |
| 腳位 2 | I/O — User I/O pin (bank 1, I/O ring) |
| 腳位 3 | I/O — User I/O pin (bank 1, I/O ring) |
| 腳位 4 | VCCIO — I/O supply voltage (3.3 V typical) |
| 腳位 5 | GND — Ground reference |
| 腳位 6 | I/O — User I/O pin (bank 1, I/O ring) |
| 腳位 7 | I/O — User I/O pin (bank 1, I/O ring) |
| 腳位 8 | VCCINT — Core supply voltage (2.5 V typical) |
| 腳位 9 | I/O — User I/O pin (bank 2, I/O ring) |
| 腳位 10 | I/O — User I/O pin (bank 2, I/O ring) |
| 腳位 11 | I/O — User I/O pin (bank 2, I/O ring) |
| 腳位 12 | GND — Ground reference |
| 腳位 13 | I/O — User I/O pin (bank 2, I/O ring) |
| 腳位 14 | I/O — User I/O pin (bank 2, I/O ring) |
| 腳位 15 | VCCIO — I/O supply voltage (3.3 V typical) |
| 腳位 16 | I/O — User I/O pin (bank 3, I/O ring) |
| 腳位 17 | I/O — User I/O pin (bank 3, I/O ring) |
| 腳位 18 | GND — Ground reference |
| 腳位 19 | I/O — User I/O pin (bank 3, I/O ring) |
| 腳位 20 | I/O — User I/O pin (bank 3, I/O ring) |
| 腳位 21 | I/O — User I/O pin (bank 3, I/O ring) |
| 腳位 22 | VCCINT — Core supply voltage (2.5 V typical) |
| 腳位 23 | I/O — User I/O pin (bank 4, I/O ring) |
| 腳位 24 | I/O — User I/O pin (bank 4, I/O ring) |
| 腳位 25 | TCK — JTAG Test Clock (IEEE 1149.1) |
| 腳位 26 | TMS — JTAG Test Mode Select |
| 腳位 27 | TDI — JTAG Test Data In |
| 腳位 28 | TDO — JTAG Test Data Out |
| 腳位 29 | nCONFIG — Configuration control (active-low) |
| 腳位 30 | nSTATUS — Configuration status (active-low) |
| 腳位 31 | CONF_DONE — Configuration complete |
| 腳位 32 | DCLK — Configuration clock |
| 腳位 33 | DATA0 — Configuration data input (bit 0) |
| 腳位 34 | GND — Ground reference |
| 腳位 35 | I/O — User I/O pin (bank 5, I/O ring) |
| 腳位 36 | I/O — User I/O pin (bank 5, I/O ring) |
典型應用
EP20K100CB356C8ES 適用於 6 應用s: Telecom Line Card Glue Logic, Industrial Control Backplane Interface, PCI Bus Bridge / Protocol Converter, Legacy Design Maintenance / Field Replacement, Datacom Packet Processing Front-End, ASIC Prototyping / Emulation Platform.
Telecom Line Card Glue Logic
The EP20K100CB356C8ES suits telecom line card designs as a glue-logic aggregator between network processors, PHY devices, and backplane transceivers. With 252 user I/O pins, the device can marshal multiple low-speed control interfaces (I2C, SPI, MDIO, UART, JTAG scan chains) and implement custom protocol conversion without burdening the main processor. Its 53,248 RAM bits via 26 EABs are sufficient for small lookup tables, frame header inspection buffers, and FIFO-based traffic shaping. The 8 ns speed grade keeps timing closure comfortable for 50-100 MHz control domains typical of legacy telecom backplanes. Engineers should note the 2.5 V core / 3.3 V I/O rail split, which differs from newer single-rail FPGAs and requires careful power-tree design.
推薦
Industrial Control Backplane Interface
The EP20K100CB356C8ES fits industrial backplane-interface designs where 252 I/O pins aggregate many parallel field-bus or sensor-array signals into a centralized controller. Industrial PC/104, VME, and legacy PCI backplanes benefit from the wide bus width and EAB-based memory for protocol FIFOs. The commercial 0C to +85C temperature range is adequate for climate-controlled enclosures; for harsher environments, select the industrial-temperature variant. Quartus II 9.0 supports this device for design entry, synthesis, and place-and-route. Note that engineering samples should not be deployed in field-installed industrial systems without production-grade qualification.
推薦
PCI Bus Bridge / Protocol Converter
With 252 user I/O and 4,160 logic elements, the EP20K100CB356C8ES can implement a 32-bit/33 MHz PCI bus bridge between legacy peripherals and modern processors. The 8 ns speed grade comfortably meets PCI 33 MHz timing with margin. EAB memory blocks implement transaction FIFOs and posted-write buffers. PCI-compatible I/O standards are natively supported in the APEX 20K I/O ring, simplifying PCB design. The 356-ball BGA package, however, requires careful PCB stackup and BGA fanout - typical 4-layer boards with 0.5 mm pitch BGA need microvia or via-in-pad technology for reliable manufacturing.
推薦
Legacy Design Maintenance / Field Replacement
The EP20K100CB356C8ES is primarily used today for maintenance of legacy systems originally designed around the APEX 20K family. Telecom central-office switches, industrial automation controllers, and military/aerospace systems built in the 2000s continue to operate and need replacement FPGAs. Distributors and brokers carry inventory specifically for this maintenance market. The 356-ball BGA footprint is shared across the EP20K100CB356 family, so PCB-level replacement is straightforward - the design does not need a board respin. For systems still in production, consider migration to Cyclone IV/V with the understanding that PCB redesign is required.
推薦
Datacom Packet Processing Front-End
In datacom front-end designs, the EP20K100CB356C8ES implements packet classification, header parsing, and traffic-shaping functions ahead of a network processor. The EABs provide small CAM-like structures for fast lookups, while the logic elements implement header field extraction and checksum validation. With 252 I/O pins, the FPGA can connect to multiple SPI-4.2 or parallel SGMII interfaces common in 2000s-era datacom ASICs. The commercial temperature range suits climate-controlled datacom environments. For new designs targeting 10G+ throughput, modern Stratix/Agilex families are required, but the APEX 20K remains adequate for legacy 1G and below packet processing.
推薦
ASIC Prototyping / Emulation Platform
Designers sometimes use EP20K100CB356C8ES as a building block in multi-FPGA ASIC prototyping platforms where multiple APEX 20K devices are tiled to emulate larger ASIC designs. The 252 I/O enable dense FPGA-to-FPGA interconnect via board-level traces, and the 100K-gate capacity maps cleanly to common ASIC block sizes. Quartus II supports multi-device partitioning with back-annotation. For ASIC prototyping today, however, modern prototyping platforms built around Virtex-7 or Stratix-10 offer 10-100x the capacity per device, so APEX 20K is used mainly for very small ASIC prototypes or for legacy emulation infrastructure maintenance.
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推薦產品摘要
工程參考資料，適用於 EP20K100CB356C8ES — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP20K100CB356C8 | EP20K100CB356C7ES | EP20K100CB356C7 |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Package | 356-ball BGA | 356-ball BGA - same | 356-ball BGA - same | 356-ball BGA - same |
| Typical Gates | 100K | 100K - same | 100K - same | 100K - same |
| Logic Elements | 4160 | 4160 - same | 4160 - same | 4160 - same |
| Maximum User I/O | 252 | 252 - same | 252 - same | 252 - same |
| Speed Grade | 8 (8 ns) | 8 - same | 7 (~12% faster) | 7 (~12% faster) |
| Temperature Grade | Commercial (0C to +85C) | Commercial - same | Commercial - same | Commercial - same |
| Part Status | Engineering Sample (ES) | Production-grade | Engineering Sample (ES) | Production-grade |
| Approx Unit Price (qty 1, USD, as of 2026-09-07) | $285 | $240 (estimated -10% to -20%) | $320 (estimated +10% to +15%) | $280 (estimated similar) |
主要差異化特點
- Pin-compatible production-grade alternative available (對比EP20K100CB356C8ES vs EP20K100CB356C8)
- Faster speed grade option within same footprint (對比EP20K100CB356C8ES vs EP20K100CB356C7ES)
- Legacy maintenance positioning (對比EP20K100CB356C8ES vs Cyclone IV EP4CE6F17C8N)
設計說明
The APEX 20K EP20K100C requires a 2.5 V core supply (VCCINT) and a 3.3 V I/O supply (VCCIO) - the dual-rail requirement differs from modern single-rail FPGAs like Cyclone IV. Decouple each VCCINT and VCCIO ball with 0.1 µF and 10 µF ceramic capacitors placed within 5 mm of the BGA ball. Total core current at 100K-gate utilization with typical 50 MHz toggle rates is approximately 200-400 mA; budget the regulator accordingly. The 2.5 V core rail must rise within 100 ms of the 3.3 V I/O rail to avoid latch-up; use a tracking regulator or power-good sequencing if needed.
The 356-ball BGA package with 1.0 mm or 1.27 mm pitch (verify exact pitch from datasheet) requires 4-layer or 6-layer PCB stackup with microvia or via-in-pad technology for reliable fanout. Estimated: on a 4-layer board with 0.2 mm via diameter, inner BGA rows require dog-bone fanout or HDI microvia. Ground and power planes should be solid under the BGA for return-path integrity. Use ENIG or OSP surface finish; avoid HASL for fine-pitch BGA.
Estimated: at full 100K-gate utilization with 50% toggle rate at 50 MHz, the EP20K100C dissipates approximately 0.5-1.0 W. The 356-ball BGA has θJA in the range of 15-25 C/W (typical for plastic BGA), resulting in a junction temperature rise of 8-25 C above ambient at 1 W. For commercial temperature range (0C to +85C), no heatsink is required under normal conditions, but airflow over the BGA is recommended for >0.75 W dissipation to maintain thermal margin.
Engineering samples (ES suffix) must NOT be used in production builds - they may have parametric deviations from production units and lack full qualification testing. Always request the non-ES production-grade variant (EP20K100CB356C8) for production. Quartus II tool support is limited to version 9.0 or earlier - newer Quartus versions do not support APEX 20K. Verify your toolchain version before committing to a design. Configuration via ByteBlaster MV requires the legacy parallel port; modern USB-Blaster is the recommended programmer.
合規資訊
RoHS/REACH/lead-free status not explicitly stated in the verified web data; the APEX 20K family was designed in the early 2000s and many variants are not RoHS-compliant. Consult the official Intel/Altera datasheet or contact the manufacturer for confirmed compliance. AEC-Q100 not applicable for this commercial-grade FPGA.
