EP20K100FC196-1X - 100K-Gate APEX-20K FPGA, 196-BGA | Altera/Intel
부품 번호: EP20K100FC196-1X ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118.2 | $11,820.00 |
| 500 | $105.8 | $52,900.00 |
| 1,000 | $96.4 | $96,400.00 |
EP20K100FC196-1X 개요
An FPGA (Field-Programmable Gate Array) is a programmable logic device that contains an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O and memory resources. FPGAs belong to the broader category of programmable logic devices (PLDs) which also includes CPLDs (Complex Programmable Logic Devices); FPGAs typically offer higher logic density and richer on-chip memory than CPLDs, at the cost of non-volatile configuration (SRAM-based FPGAs require a configuration memory at every power-up). The APEX 20K family sits at the intersection of FPGA and CPLD architectures, sometimes described as a "programmable logic device with embedded memory."
Key features of the EP20K100FC196-1X include a multi-voltage I/O bank structure (1.8V/2.5V/3.3V PCI-compatible interface support), dedicated high-speed interconnect (MultiTrack Interconnect), embedded array blocks that can be configured as RAM, ROM, or FIFO, and built-in clock-management circuitry. The -1X suffix indicates an industrial temperature range with the slowest of the APEX 20K speed grades, trading timing margin for cost savings in non-timing-critical designs.
Typical applications include telecommunications line cards, industrial control and factory automation, ASIC prototyping, glue logic integration around microprocessors, and legacy system upgrades. Because the APEX 20K family has been in long-term production and is supported by the Quartus II design software (with project-import paths from MAX+PLUS II), it remains popular for maintenance of installed industrial and telecom systems.
When designing with this device, ensure that the configuration memory (typically an EPC2 or EPC8 serial configuration device, or a microcontroller-driven passive serial stream) is correctly sized for the chosen bitstream compression mode, and that the JTAG chain order is preserved across multi-device boards. The 196-BGA package requires careful PCB layout to maintain signal integrity on the high-speed MultiTrack interconnect.
드롭인 대체품: EP20K100FC196-1X — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K100FC196-1X (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K100FC196-2X
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP20K100FC196-1
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP20K100FC196-1X 최대 정격 & 전기적 특성
| Family | APEX 20K |
| Typical Gates | 100,000 |
| 패키지 | 196-ball FineLine BGA |
| Speed Grade | -1 (slowest in APEX 20K family) |
| Process Technology | 0.18-micron CMOS, SRAM-based |
| Supply Voltage - Core | 1.8 V |
| I/O Standards | 1.8V / 2.5V / 3.3V LVTTL/LVCMOS, PCI |
| Configuration Interface | Passive Serial, JTAG (IEEE 1149.1) |
| 동작 온도 | -40C to +85C (industrial) |
| RoHS 상태 | unknown |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
EP20K100FC196-1X 196-ball fineline bga 핀 구성 가이드
EP20K100FC196-1X(196-ball fineline bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K100FC196-1X.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K100FC196-1X 적합 용도: 7 애플리케이션s: Telecommunications Line Card Glue Logic, ASIC Prototyping and Design Verification, Industrial Factory Automation Controllers, Legacy System Maintenance and Repair, Glue Logic Around Embedded Processors, Test and Measurement Front-End Logic, Aerospace and Defense Line-Replaceable Units.
Telecommunications Line Card Glue Logic
The EP20K100FC196-1X is well suited for legacy telecom line-card glue logic where 100K gates of LUT-based logic and a small amount of block memory (via EABs configured as FIFO/RAM) are required. Its multi-voltage I/O banks (1.8V, 2.5V, 3.3V) interface directly to legacy TDM framers, LIU devices, and backplane transceivers without external level shifters. The PCI-compatible I/O standard simplifies bridging between an MPC860/MPC8260 PowerQUICC and a peripheral bus. Industrial temperature grade (-40C to +85C) makes it acceptable for outdoor cabinet environments. Designers should keep critical paths inside the -1 speed-grade slack envelope; the slow bin is fine for control-plane glue rather than high-speed serial aggregation.
추천
ASIC Prototyping and Design Verification
With approximately 100K typical gates plus embedded array blocks (EABs) that emulate SRAM/ROM blocks, the EP20K100FC196-1X is a credible vehicle for ASIC prototyping of mid-density designs. Engineers map ASIC standard cells into APEX 20K logic elements using synthesis libraries shipped with Quartus II, and use EABs to prototype compiled SRAM blocks. The 196-ball FineLine BGA exposes a sufficient number of user I/O (typically ~150) to replicate the pad ring of small to mid ASICs. Caveat: this is a -1 speed-grade part, so timing closure for gigahertz-class ASICs is unrealistic; plan to validate at slower clocks or migrate to a faster speed grade for production prototype runs.
추천
Industrial Factory Automation Controllers
Industrial controllers with multi-protocol fieldbus interfaces (Profibus, DeviceNet, CANopen) and deterministic logic benefit from the EP20K100FC196-1X because it integrates bus arbiters, protocol-framing state machines, and small FIFO buffers (via EABs) into a single device. The 1.8V core plus 3.3V PCI-compatible I/O bank allows direct connection to PowerPC, ARM7, and ColdFire host processors. Industrial temperature grade is essential for factory-floor thermal envelopes. The MultiTrack interconnect provides deterministic routing for hand-tuned timing paths required by motion-control loops. Long-lifecycle support is a strong fit because factory-automation systems are typically deployed for 10-15 years.
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Legacy System Maintenance and Repair
The EP20K100FC196-1X is most often procured today to sustain installed equipment - telecom switches, industrial controllers, medical imaging subsystems, and military/aerospace line-replaceable units - that originally shipped with APEX 20K devices. Because the bitstream and JTAG ID are tied to the APEX 20K family, the only true drop-in replacements are other APEX 20K speed grades in the same package. The 196-ball FineLine BGA footprint is the qualifying constraint; PCBs designed for a 196-ball BGA cannot accept a 240-pin QFP or 324-ball BGA from the same family. Bonded-stock distributors (Micro-Semiconductor, Heisener, Brilltron) supply this market, typically with 1-2 week lead time.
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Glue Logic Around Embedded Processors
When a CPU or DSP lacks a peripheral or exposes a non-standard bus, the EP20K100FC196-1X serves as flexible glue logic: register interfaces, custom DMA controllers, interrupt aggregators, and small protocol bridges. The 196-ball FineLine BGA exposes enough user I/O to bridge a 32-bit local bus plus several chip selects and interrupts. Embedded array blocks can be used as dual-port RAM to implement a small mailbox between two processor cores. Industrial temperature and long-term support from Intel PSG make this part appropriate for industrial-embedded designs with multi-decade service lifetimes.
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Test and Measurement Front-End Logic
Test equipment such as protocol analyzers, oscilloscope acquisition front-ends, and bench-top instrumentation has historically used APEX 20K FPGAs for high-density trigger logic and small data-path buffers. The EP20K100FC196-1X provides enough logic for parallel trigger comparators and timing generators while keeping the bill-of-materials cost manageable. EABs configured as FIFO decouple the analog front-end from a downstream processor or USB controller. The PCI-compatible I/O bank simplifies interface to a desktop-PCI capture card. Because test-equipment designs are typically low-volume, the higher unit price of legacy Altera parts is acceptable.
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Aerospace and Defense Line-Replaceable Units
Defense and aerospace programs with 15-25 year field-service obligations are reluctant to redesign around newer FPGAs once an APEX 20K design has passed DO-254 or MIL-STD-810 qualification. The EP20K100FC196-1X is therefore procured to support LRUs originally qualified with this exact part. Bonded-stock distributors, certificate-of-conformance paperwork, and traceability through the Altera-to-Intel PSG transition are key supply-chain considerations. The 196-ball FineLine BGA is a familiar footprint for board rework houses in the defense industrial base.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K100FC196-1X — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K100FC196-2X | EP20K100FC196-1 | EP20K100EQC208-3N |
|---|---|---|---|---|
| Package | 196-ball FineLine BGA | 196-ball FineLine BGA - same | 196-ball FineLine BGA - same | 208-pin PQFP - different footprint |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) - same | Altera (Intel PSG) - same | Altera (Intel PSG) - same |
| Family | APEX 20K | APEX 20K - same | APEX 20K - same | APEX 20K - same |
| Typical Gates | 100,000 | 100,000 | 100,000 | 100,000 |
| Speed Grade | -1 (slowest) | -2 (faster) | -1 (same speed) | -3 (fastest) |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | 0C to +85C (commercial) | -40C to +85C (industrial) |
| Process Technology | 0.18-micron CMOS, SRAM | 0.18-micron CMOS, SRAM - same | 0.18-micron CMOS, SRAM - same | 0.18-micron CMOS, SRAM - same |
| Configuration Interface | Passive Serial + JTAG | Passive Serial + JTAG | Passive Serial + JTAG | Passive Serial + JTAG |
| Approx. Unit Price (qty 1) | USD 145 | USD 165 (faster grade commands premium) | USD 130 (commercial temp) | USD 175 (different package) |
주요 차별점
- Industrial temperature grade with same speed grade (vs EP20K100FC196-1)
- Pin-compatible upgrade path to faster speed grade (vs EP20K100FC196-2X)
- Same silicon, different package - more I/O available (vs EP20K100EQC208-3N)
- Mature APEX 20K toolchain and IP library support (vs Lattice ECP5 / Xilinx Spartan-6)
설계 노트
Estimated: Core supply is 1.8V at typical ICC around 100-300 mA depending on utilization and clock frequency; I/O supply is 3.3V or 2.5V or 1.8V per bank. Decouple each VCCINT pin with a 0.1 uF X7R ceramic placed within 100 mil of the pin, and add a single 10 uF bulk capacitor per VCCIO bank. APEX 20K static current is non-trivial; design the regulator for at least 2x the steady-state estimate to accommodate inrush during configuration.
The 196-ball FineLine BGA is a 1.0 mm pitch package that demands reflow-profile control to JEDEC J-STD-020 MSL-3 floor-life rules (168 hours). Use NSMD (non-solder-mask-defined) pads with via-in-pad or microvia fan-out to escape the inner rows. Keep at least 4 routing layers under the BGA; layer stackup should dedicate one solid plane to GND and one to VCCINT below the device. Match trace lengths within each byte lane if you use the LVDS or PCI I/O standards.
Pair the EP20K100FC196-1X with an EPC2LC20 or EPC8QC100 serial configuration memory for standalone boot. The nSTATUS and CONF_DONE pins must be pulled up to VCCIO (typically 3.3V) with 10 kohm resistors. If JTAG is used for in-system programming, ensure the JTAG chain order matches the Quartus II programming file; otherwise the programmer will report IDCODE mismatch. Use the MSEL pins to select between passive serial and JTAG-only configuration modes.
Common pitfalls: (1) using the -1 speed grade for paths that need >100 MHz internal Fmax -1 is the slowest APEX 20K bin; (2) omitting the decoupling on the PLL supply pins (VCC_PLL) - this leads to jitter; (3) assuming industrial temperature suffix 'X' is interchangeable with the commercial part - it is, but the reverse is not; (4) forgetting that Quartus II is the last-supported toolchain and MAX+PLUS II projects must be imported.
The APEX 20K family is on the Intel PSG last-time-buy trajectory. Engineers designing new products should plan a migration to Cyclone IV, Cyclone 10 LP, or Lattice ECP5 depending on the application. For legacy maintenance, document bonded-stock suppliers and consider second-sourcing through franchised distributors. Reference: APEX 20K device handbook Errata and PCN archive on Altera/Intel Literature site.
규정 준수 정보
Compliance information was not returned in the Verified Web Data. RoHS/REACH status for the EP20K100FC196-1X should be cross-checked against the manufacturer datasheet or by requesting a Certificate of Compliance from the franchised distributor.
