EP20K100FC196-1X - 100K-Gate APEX-20K FPGA, 196-BGA | Altera/Intel
MPN: EP20K100FC196-1X ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118.2 | $11,820.00 |
| 500 | $105.8 | $52,900.00 |
| 1,000 | $96.4 | $96,400.00 |
Drop-in alternatives for EP20K100FC196-1X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP20K100FC196-2X
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View Datasheet →EP20K100FC196-1
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EP20K100FC196-1X Maximum Ratings & Electrical Characteristics
| Family | APEX 20K |
| Typical Gates | 100,000 |
| Package | 196-ball FineLine BGA |
| Speed Grade | -1 (slowest in APEX 20K family) |
| Process Technology | 0.18-micron CMOS, SRAM-based |
| Supply Voltage - Core | 1.8 V |
| I/O Standards | 1.8V / 2.5V / 3.3V LVTTL/LVCMOS, PCI |
| Configuration Interface | Passive Serial, JTAG (IEEE 1149.1) |
| Operating Temperature | -40C to +85C (industrial) |
| RoHS Status | unknown |
| MSL Level | 3 (per JEDEC J-STD-020) |
EP20K100FC196-1X 196-ball fineline bga Pin Configuration Guide
Complete pinout information for EP20K100FC196-1X (196-ball fineline bga package) with [DATA_NEEDED: max user I/O] pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K100FC196-1X.
Refer to the datasheet for full pin configuration.
Estimated pin count: [DATA_NEEDED: max user I/O] pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP20K100FC196-1X is suitable for 7 applications: Telecommunications Line Card Glue Logic, ASIC Prototyping and Design Verification, Industrial Factory Automation Controllers, Legacy System Maintenance and Repair, Glue Logic Around Embedded Processors, Test and Measurement Front-End Logic, Aerospace and Defense Line-Replaceable Units.
Telecommunications Line Card Glue Logic
The EP20K100FC196-1X is well suited for legacy telecom line-card glue logic where 100K gates of LUT-based logic and a small amount of block memory (via EABs configured as FIFO/RAM) are required. Its multi-voltage I/O banks (1.8V, 2.5V, 3.3V) interface directly to legacy TDM framers, LIU devices, and backplane transceivers without external level shifters. The PCI-compatible I/O standard simplifies bridging between an MPC860/MPC8260 PowerQUICC and a peripheral bus. Industrial temperature grade (-40C to +85C) makes it acceptable for outdoor cabinet environments. Designers should keep critical paths inside the -1 speed-grade slack envelope; the slow bin is fine for control-plane glue rather than high-speed serial aggregation.
Recommended
ASIC Prototyping and Design Verification
With approximately 100K typical gates plus embedded array blocks (EABs) that emulate SRAM/ROM blocks, the EP20K100FC196-1X is a credible vehicle for ASIC prototyping of mid-density designs. Engineers map ASIC standard cells into APEX 20K logic elements using synthesis libraries shipped with Quartus II, and use EABs to prototype compiled SRAM blocks. The 196-ball FineLine BGA exposes a sufficient number of user I/O (typically ~150) to replicate the pad ring of small to mid ASICs. Caveat: this is a -1 speed-grade part, so timing closure for gigahertz-class ASICs is unrealistic; plan to validate at slower clocks or migrate to a faster speed grade for production prototype runs.
Recommended
Industrial Factory Automation Controllers
Industrial controllers with multi-protocol fieldbus interfaces (Profibus, DeviceNet, CANopen) and deterministic logic benefit from the EP20K100FC196-1X because it integrates bus arbiters, protocol-framing state machines, and small FIFO buffers (via EABs) into a single device. The 1.8V core plus 3.3V PCI-compatible I/O bank allows direct connection to PowerPC, ARM7, and ColdFire host processors. Industrial temperature grade is essential for factory-floor thermal envelopes. The MultiTrack interconnect provides deterministic routing for hand-tuned timing paths required by motion-control loops. Long-lifecycle support is a strong fit because factory-automation systems are typically deployed for 10-15 years.
Recommended
Legacy System Maintenance and Repair
The EP20K100FC196-1X is most often procured today to sustain installed equipment - telecom switches, industrial controllers, medical imaging subsystems, and military/aerospace line-replaceable units - that originally shipped with APEX 20K devices. Because the bitstream and JTAG ID are tied to the APEX 20K family, the only true drop-in replacements are other APEX 20K speed grades in the same package. The 196-ball FineLine BGA footprint is the qualifying constraint; PCBs designed for a 196-ball BGA cannot accept a 240-pin QFP or 324-ball BGA from the same family. Bonded-stock distributors (Micro-Semiconductor, Heisener, Brilltron) supply this market, typically with 1-2 week lead time.
Recommended
Glue Logic Around Embedded Processors
When a CPU or DSP lacks a peripheral or exposes a non-standard bus, the EP20K100FC196-1X serves as flexible glue logic: register interfaces, custom DMA controllers, interrupt aggregators, and small protocol bridges. The 196-ball FineLine BGA exposes enough user I/O to bridge a 32-bit local bus plus several chip selects and interrupts. Embedded array blocks can be used as dual-port RAM to implement a small mailbox between two processor cores. Industrial temperature and long-term support from Intel PSG make this part appropriate for industrial-embedded designs with multi-decade service lifetimes.
Recommended
Test and Measurement Front-End Logic
Test equipment such as protocol analyzers, oscilloscope acquisition front-ends, and bench-top instrumentation has historically used APEX 20K FPGAs for high-density trigger logic and small data-path buffers. The EP20K100FC196-1X provides enough logic for parallel trigger comparators and timing generators while keeping the bill-of-materials cost manageable. EABs configured as FIFO decouple the analog front-end from a downstream processor or USB controller. The PCI-compatible I/O bank simplifies interface to a desktop-PCI capture card. Because test-equipment designs are typically low-volume, the higher unit price of legacy Altera parts is acceptable.
Recommended
Aerospace and Defense Line-Replaceable Units
Defense and aerospace programs with 15-25 year field-service obligations are reluctant to redesign around newer FPGAs once an APEX 20K design has passed DO-254 or MIL-STD-810 qualification. The EP20K100FC196-1X is therefore procured to support LRUs originally qualified with this exact part. Bonded-stock distributors, certificate-of-conformance paperwork, and traceability through the Altera-to-Intel PSG transition are key supply-chain considerations. The 196-ball FineLine BGA is a familiar footprint for board rework houses in the defense industrial base.
Recommended
Recommended Products Summary
Engineering reference data for EP20K100FC196-1X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K100FC196-2X | EP20K100FC196-1 | EP20K100EQC208-3N |
|---|---|---|---|---|
| Package | 196-ball FineLine BGA | 196-ball FineLine BGA - same | 196-ball FineLine BGA - same | 208-pin PQFP - different footprint |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) - same | Altera (Intel PSG) - same | Altera (Intel PSG) - same |
| Family | APEX 20K | APEX 20K - same | APEX 20K - same | APEX 20K - same |
| Typical Gates | 100,000 | 100,000 | 100,000 | 100,000 |
| Speed Grade | -1 (slowest) | -2 (faster) | -1 (same speed) | -3 (fastest) |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | 0C to +85C (commercial) | -40C to +85C (industrial) |
| Process Technology | 0.18-micron CMOS, SRAM | 0.18-micron CMOS, SRAM - same | 0.18-micron CMOS, SRAM - same | 0.18-micron CMOS, SRAM - same |
| Configuration Interface | Passive Serial + JTAG | Passive Serial + JTAG | Passive Serial + JTAG | Passive Serial + JTAG |
| Approx. Unit Price (qty 1) | USD 145 | USD 165 (faster grade commands premium) | USD 130 (commercial temp) | USD 175 (different package) |
Key Differentiators
- Industrial temperature grade with same speed grade (vs EP20K100FC196-1)
- Pin-compatible upgrade path to faster speed grade (vs EP20K100FC196-2X)
- Same silicon, different package - more I/O available (vs EP20K100EQC208-3N)
- Mature APEX 20K toolchain and IP library support (vs Lattice ECP5 / Xilinx Spartan-6)
Design Notes
Estimated: Core supply is 1.8V at typical ICC around 100-300 mA depending on utilization and clock frequency; I/O supply is 3.3V or 2.5V or 1.8V per bank. Decouple each VCCINT pin with a 0.1 uF X7R ceramic placed within 100 mil of the pin, and add a single 10 uF bulk capacitor per VCCIO bank. APEX 20K static current is non-trivial; design the regulator for at least 2x the steady-state estimate to accommodate inrush during configuration.
The 196-ball FineLine BGA is a 1.0 mm pitch package that demands reflow-profile control to JEDEC J-STD-020 MSL-3 floor-life rules (168 hours). Use NSMD (non-solder-mask-defined) pads with via-in-pad or microvia fan-out to escape the inner rows. Keep at least 4 routing layers under the BGA; layer stackup should dedicate one solid plane to GND and one to VCCINT below the device. Match trace lengths within each byte lane if you use the LVDS or PCI I/O standards.
Pair the EP20K100FC196-1X with an EPC2LC20 or EPC8QC100 serial configuration memory for standalone boot. The nSTATUS and CONF_DONE pins must be pulled up to VCCIO (typically 3.3V) with 10 kohm resistors. If JTAG is used for in-system programming, ensure the JTAG chain order matches the Quartus II programming file; otherwise the programmer will report IDCODE mismatch. Use the MSEL pins to select between passive serial and JTAG-only configuration modes.
Common pitfalls: (1) using the -1 speed grade for paths that need >100 MHz internal Fmax -1 is the slowest APEX 20K bin; (2) omitting the decoupling on the PLL supply pins (VCC_PLL) - this leads to jitter; (3) assuming industrial temperature suffix 'X' is interchangeable with the commercial part - it is, but the reverse is not; (4) forgetting that Quartus II is the last-supported toolchain and MAX+PLUS II projects must be imported.
The APEX 20K family is on the Intel PSG last-time-buy trajectory. Engineers designing new products should plan a migration to Cyclone IV, Cyclone 10 LP, or Lattice ECP5 depending on the application. For legacy maintenance, document bonded-stock suppliers and consider second-sourcing through franchised distributors. Reference: APEX 20K device handbook Errata and PCN archive on Altera/Intel Literature site.
Compliance Information
Compliance information was not returned in the Verified Web Data. RoHS/REACH status for the EP20K100FC196-1X should be cross-checked against the manufacturer datasheet or by requesting a Certificate of Compliance from the franchised distributor.
