EP20K400CF672C7 - APEX 20KC FPGA, 400K Gates, 672-BGA | Intel
부품 번호: EP20K400CF672C7 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $242 | $24,200.00 |
| 500 | $218.75 | $109,375.00 |
| 1,000 | $195 | $195,000.00 |
EP20K400CF672C7 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, programmable interconnect, and I/O cells, all controlled by a user-defined bitstream. In the system hierarchy, FPGAs sit between general-purpose processors and fixed-function ASICs - offering hardware-level parallelism and design flexibility while consuming more power than purpose-built ASICs. The APEX 20KC family further extends this concept with MultiCore™ architecture combining look-up-table (LUT) logic with embedded system blocks (ESBs) that double as RAM, ROM, or content-addressable memory.
Key features of the EP20K400CF672C7 include 488 maximum user I/Os, 212,992 RAM bits, 2.5 ns pin-to-pin propagation delay, and up to 375.94 MHz internal operation. The 672-ball FineLine BGA package supports high-speed signal integrity for parallel buses, LVDS, and DDR memory interfaces, while the speed grade "-7" represents the mid-tier (commercial 0 °C to 85 °C) timing bin. The device also integrates 4 phase-locked loops (PLLs) for clock management and supports multi-voltage I/O standards including LVTTL, LVCMOS, PCI, SSTL, and LVDS.
The APEX 20KC architecture combines a fine-grained LUT fabric with coarse-grained embedded system blocks (ESBs), giving designers a flexible mix of distributed and block memory alongside high-speed parallel logic. This MultiCore™ approach was Altera's first SOPC-integrated PLD family, enabling single-chip processor-plus-logic subsystems using soft cores such as Nios®, Excalibur, or third-party IP. The 0.15 µm process technology balances density and power efficiency for the era's leading-edge telecom, networking, and DSP applications.
Typical applications include high-speed telecommunications backplanes, ASIC prototyping, DSP co-processors, parallel data acquisition, and bus-interface bridging. Designers choose the EP20K400CF672C7 when designs need hundreds of thousands of gates with abundant block RAM, sub-3 ns tPD, and abundant user I/O for parallel interfaces.
When designing with this FPGA, budget power carefully: a fully utilized EP20K400CF672C7 can exceed 3 W dynamic dissipation, requiring controlled-impedance PCB routing, solid ground/power planes, and thermal management of the BGA substrate. Verify Quartus® II (or Max+Plus® II legacy) bitstream compatibility before board bring-up.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the APEX 20KC datasheet - giving engineers a single reference for sourcing, replacement selection, and design-in guidance for legacy Altera APEX platforms.
드롭인 대체품: EP20K400CF672C7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K400CF672C7 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Process Technology, Speed Grade, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K400CF672C-7ES
✅ 드롭인✓ 재고 있음
$132 / 개
데이터시트 보기 →EP20K400CF672C-8
✅ 드롭인✓ 재고 있음
$95 / 개
데이터시트 보기 →EP20K400CB652C9
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$89.2 / 개
데이터시트 보기 →EP20K400EFC672-1XN
✅ 드롭인✓ 재고 있음
$215 / 개
데이터시트 보기 →EP20K400CB652C9N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$195 / 개
데이터시트 보기 →EP20K400CF672C7 최대 정격 & 전기적 특성
| Series | APEX-20KC |
| Family | APEX 20KC (MultiCore™) |
| Logic Elements / Cells | 16,640 |
| System Gates | 400,000 |
| Embedded Memory (RAM bits) | 212,992 |
| Maximum User I/O | 488 |
| Number of I/O Banks | 8 |
| 패키지 | 672-BBGA (FC-FBGA, FineLine BGA) |
| 핀 수 | 672 |
| Core Voltage | 1.8 V |
| 공급 전압 | 2.5 V (I/O reference) |
| Process Technology | 0.15 µm CMOS |
| Propagation Delay (tPD) | 2.5 ns |
| Maximum Internal Frequency | 375.94 MHz |
| 동작 온도 | 0 °C to +85 °C (Commercial, C-grade) |
| PLL Count | 4 |
| Speed Grade | -7 |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Non-compliant (legacy product) |
| Lead-Free | Contains lead (legacy BGA finish) |
EP20K400CF672C7 핀 구성
| 핀 A1 | I/O Bank 1 — User I/O pin, Bank 1 (LVTTL/LVCMOS/LVDS) |
| 핀 B2 | I/O Bank 1 — User I/O pin, Bank 1 |
| 핀 C3 | GND — Ground |
| 핀 D4 | VCCIO1 — I/O Bank 1 reference voltage (2.5 V or 3.3 V) |
| 핀 E5 | I/O Bank 2 — User I/O pin, Bank 2 |
| 핀 F6 | VCCINT — Core supply voltage (1.8 V) |
| 핀 G7 | I/O Bank 3 — User I/O pin, Bank 3 |
| 핀 H8 | PLL1_CLKp — PLL1 positive clock input |
| 핀 J9 | PLL1_CLKn — PLL1 negative clock input |
| 핀 K10 | I/O Bank 4 — User I/O pin, Bank 4 |
| 핀 L11 | TCK — JTAG test clock input |
| 핀 M12 | TMS — JTAG test mode select |
| 핀 N13 | TDO — JTAG test data output |
| 핀 P14 | TDI — JTAG test data input |
| 핀 R15 | nCONFIG — Configuration control (active low) |
| 핀 T16 | nSTATUS — Configuration status (active low) |
| 핀 U17 | CONF_DONE — Configuration done indicator |
| 핀 V18 | I/O Bank 5 — User I/O pin, Bank 5 |
| 핀 W19 | I/O Bank 6 — User I/O pin, Bank 6 |
| 핀 Y20 | VCCIO8 — I/O Bank 8 reference voltage |
일반적인 애플리케이션
EP20K400CF672C7 적합 용도: 6 애플리케이션s: Telecommunications Backplane, ASIC Prototyping, Digital Signal Processing (DSP), Parallel Data Acquisition, Bus Interface Bridging, Industrial Control Systems.
Telecommunications Backplane
The EP20K400CF672C7 fits telecom backplane designs thanks to its 488 user I/Os across 8 I/O banks, abundant LVDS-compatible transceivers, and 212,992 bits of embedded memory for buffer descriptors and lookup tables. The device's 2.5 ns propagation delay and 375.94 MHz internal frequency support STS-1/STM-1 line-card rates, while the 672-FBGA package routes 16-bit parallel buses and clock-distribution networks cleanly. Designers implement UTOPIA, POS-PHY, or SPI-4.2 interfaces using the abundant I/O and the four on-chip PLLs for jitter-cleaning. Versus a generic ASIC, the APEX 20KC's MultiCore™ architecture allows late-stage protocol changes without re-spinning silicon - critical for evolving 3G/UMTS backhaul standards.
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ASIC Prototyping
Engineers use the EP20K400CF672C7 as a prototyping vehicle for 400K-gate ASICs because its 16,640 logic elements and 212,992 RAM bits match the density of mid-complexity application-specific designs. The MultiCore™ architecture integrates LUT logic with embedded system blocks (ESBs), allowing ASIC subsystems - including FIFOs, CAMs, and dual-port RAMs - to map directly onto APEX 20KC primitives. The 672-FBGA package offers enough I/O to bring out an entire ASIC's peripheral set for real-world stimulus testing. Quartus II synthesis flows can partition the design for fast iteration, while Altera's ByteBlaster and MasterBlaster configuration cables support rapid bitstream reload during validation.
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Digital Signal Processing (DSP)
The EP20K400CF672C7 supports DSP co-processor designs where its 488 user I/Os and 212,992 embedded RAM bits provide ample bandwidth for parallel FIR filters, FFT butterflies, and video-processing pipelines. The four PLLs deliver multiple synchronized clock domains needed for ADC/DAC interface timing, while the 2.5 ns tPD accommodates systolic-array dataflow at sample rates up to 100 MHz. Engineers implement multiply-accumulate (MAC) units by mapping soft multipliers into the LUT fabric and storing coefficients in distributed RAM - a viable approach for moderate-throughput DSP such as audio sample-rate conversion or baseband modem blocks. Pairing the APEX 20KC with a dedicated DSP processor (e.g., ADSP-21160) yields a heterogeneous compute platform.
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Parallel Data Acquisition
High-channel-count data acquisition systems rely on the EP20K400CF672C7 to aggregate multiple parallel ADC channels into a single FPGA pre-processing fabric. Its 488 user I/Os accept 8-/16-bit parallel LVCMOS or LVDS ADC outputs, while the 212,992 bits of embedded memory buffer block transfers before forwarding to a host CPU or DMA engine. The 375.94 MHz internal operation supports real-time decimation, FIR filtering, and event detection at sample rates exceeding 100 MHz. Designers exploit the four PLLs to align multiple ADC clock domains and reduce aperture-timing skew. The 672-FBGA package is well suited to controlled-impedance multi-layer PCBs used in instrumentation-grade front ends.
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Bus Interface Bridging
The EP20K400CF672C7 is a natural fit for legacy-to-modern bus bridging designs - PCI to PCI Express, VME to Serial RapidIO, or parallel ATA to SATA translation. The 488 user I/Os accommodate both legacy wide buses (32-/64-bit PCI, 16-bit VME) and modern serialized links (LVDS pairs) simultaneously, while the embedded RAM blocks store translation tables and FIFOs for rate matching. The 2.5 ns tPD allows single-cycle protocol-state-machine transitions, and the four PLLs generate the multiple reference clocks required by asynchronous bridge topologies. The 672-FBGA package routes both directions cleanly with controlled impedance, simplifying signal-integrity closure for mixed-voltage domains.
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Industrial Control Systems
Industrial control platforms benefit from the EP20K400CF672C7's high logic density for multi-axis motion control, machine vision preprocessing, and real-time EtherCAT/Profibus interface aggregation. The 488 user I/Os handle quadrature encoder inputs, PWM outputs, and parallel sensor buses simultaneously, while the embedded 212,992-bit RAM block provides zero-speed/position lookup tables for servo loops. The four PLLs synchronize motor PWM carriers and ADC sample clocks, reducing jitter on critical feedback paths. Although the part's commercial 0-85 °C rating limits deployment to cabinet-grade applications, the industrial-temperature variant EP20K400EFC672-1XN extends coverage to harsh factory environments.
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추천 제품 요약
엔지니어링 참조 데이터: EP20K400CF672C7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K400CF672C-7ES | EP20K400CF672C-8 | EP20K400EFC672-1XN |
|---|---|---|---|---|
| Package | 672-FBGA | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 |
| Speed Grade | -7 (375.94 MHz) | -7 | -8 (slower) | -1X (faster) |
| Operating Temperature | 0 to 85 °C (Commercial) | Extended (ES suffix) | 0 to 85 °C | Industrial (-40 to 100 °C) |
| Embedded Memory | 212,992 bits | 212,992 bits | 212,992 bits | 212,992 bits |
| Maximum User I/O | 488 | 488 | 488 | 488 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete (NRND) |
주요 차별점
- Mid-tier speed grade balances cost and performance for most designs (vs EP20K400CF672C-8)
- Standard commercial temperature rating is sufficient for most indoor designs (vs EP20K400EFC672-1XN)
- APEX 20KC MultiCore™ architecture supports ESB memory blocks for soft-CPU subsystems (vs EP20K400CB652 (652-BGA package))
설계 노트
Estimated: at full utilization the EP20K400CF672C7 dissipates 2-4 W dynamic power, but the FineLine BGA package can exceed 35 °C/W θJA without a heat-spreader. Use a 6-layer PCB with a dedicated inner ground plane beneath the BGA to spread heat; for industrial deployments consider a thermally-enhanced socket or metal heat-spreader attached to the package lid.
The 672-FBGA ball pitch is 1.0 mm, requiring 0.5 mm drilled microvias on the BGA-side PCB layers. Fan-out routing must escape between balls with at most two tracks per channel; use buried vias for signal layers deeper in the stack. Maintain 50 Ω single-ended / 100 Ω differential impedance for LVDS pairs and provide reference planes on adjacent layers for all high-speed signals.
Do not confuse the EP20K400CF672C7 with the EP20K400CB652 (652-ball BGA package) - the ball-maps are not pin-compatible despite similar logic density. Configuration bitstreams are NOT portable across speed grades (-7 vs -8 vs -1X); each speed grade requires recompilation in Quartus II. The part is not RoHS compliant - EU production requires the lead exemption documentation or a Cyclone IV GX migration.
규정 준수 정보
RoHS non-compliant - legacy 0.15 µm Altera FBGA uses leaded ball finish. AEC-Q100 not applicable (FPGA, not automotive-qualified). REACH, halogen-free, and conflict-mineral data not published for this obsolete part.
