Altera

EP20K400CF672C7ES - APEX 20KC FPGA, 400K Gates, 672-FBGA | Altera

부품 번호: EP20K400CF672C7ES ✗ 단종
재고 있음 영업일 기준 1~3일 내 발송
1.8 V Vdss 672-ball FineLine BGA Package 375.94 MHz Speed 212,992 Memory
시작가 $152 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-07
볼륨 가격
수량 단가 합계
1 $285 $285.00
10 $245 $2,450.00
100 $198 $19,800.00
250 $175 $43,750.00
500 $152 $76,000.00
ℹ️ 모든 가격은 USD 기준입니다

EP20K400CF672C7ES 개요

The Altera EP20K400CF672C7ES is a member of the APEX 20KC family of Loadable PLDs (programmable logic devices), delivering 400,000 system gates, 16,640 logic elements, and 212,992 bits of embedded memory in a 672-ball FineLine BGA package. Built on a 0.18 um (1.8 V core) CMOS process with 1.5 V I/O support, the device supports a maximum internal clock frequency of 375.94 MHz and a propagation delay of approximately 1.4 ns, and it provides 488 user I/O pins for high-density interconnect.

What is an APEX 20KC FPGA? The APEX 20KC family is a single-chip programmable logic device family that integrates look-up table (LUT)-based logic, embedded system blocks (ESBs) for memory and FIFO, and I/O elements (IOEs) on a unified interconnect architecture (MultiCore architecture). It belongs to the broader hierarchy of Field Programmable Gate Arrays (FPGAs) -> programmable logic devices (PLDs) -> logic ICs -> integrated circuits. APEX 20KC parts are typically used for high-throughput data-path, bus-interface, and glue-logic functions where ASIC-class density is needed without NRE cost.

Key features include 4 phase-locked loops (PLLs) for clock management, MultiVolt I/O supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces, JTAG-based IEEE 1149.1 boundary-scan testing, and configuration via passive serial, passive parallel synchronous, passive parallel asynchronous, and JTAG modes. The suffix "C7" indicates a -7 speed grade (commercial), while "ES" denotes an Engineering Sample offering. Per the Altera APEX 20KC datasheet, the device supports hot-socketing and in-system programmability through its dedicated configuration pins.

The device uses a MultiCore interconnect that wires together embedded logic array blocks (LABs), ESBs, and IOEs through row and column FastTrack lines. Each LAB contains 10 logic elements (LEs), and each ESB can be configured as RAM, ROM, or CAM. The combination of high logic density, large embedded memory, and dedicated PLLs makes the APEX 20KC suited for bus-width conversion, video/imaging pipelines, and telecommunications glue logic.

Typical applications include high-speed data-path processing, telecommunications backplane interfaces, video frame buffering, PCI/PCI-X bridging, and DSP co-processing front-ends. The -7 speed grade is suitable for designs where mid-range timing margin is acceptable and cost is prioritized over maximum Fmax.

Designers should verify availability of Engineering Sample (ES) parts against production-grade alternatives, since ES silicon may have parametric differences. For new designs, the Altera Quartus II toolchain supports this device family up through legacy support packages.

This page synthesizes verified distributor pricing, drop-in same-family Altera alternatives drawn from the Site MPN list, and practical configuration/PCB guidance not found in the standalone datasheet.

드롭인 대체품: EP20K400CF672C7ES — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EP20K400CF672C7ES (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Process Technology, Speed Grade, Family.

Intel
Package: 672-ball FineLine BGA
Operating Temperature: 0 °C to +85 °C (Commercial)
Process Technology: 0.18 µm CMOS
비교 대상: EP20K400CF672C7ES →
Intel
Package: 672-ball FineLine BGA (FBGA)
Operating Temperature: 0 °C to 85 °C (commercial)
Process Technology: 0.22 µm CMOS
비교 대상: EP20K400CF672C7ES →
Intel
Package: 672-pin FineLine BGA (FBGA)
Operating Temperature: 0 °C to 85 °C (commercial)
Family: APEX 20KE
비교 대상: EP20K400CF672C7ES →
Altera
Package: 672-pin FC-FBGA (FineLine BGA)
Operating Temperature: 0 °C to +85 °C (commercial)
Process Technology: 0.15 µm CMOS, SRAM-based
비교 대상: EP20K400CF672C7ES →
Altera
Package: 672-BGA (FineLine BGA, 1.00 mm pitch)
Process Technology: 0.15 um CMOS
Speed Grade: -7
비교 대상: EP20K400CF672C7ES →
Altera
Process Technology: 0.15 µm all-layer copper CMOS
Speed Grade: -8
Family: APEX 20K
비교 대상: EP20K400CF672C7ES →
Altera
Package: 672-BBGA (FC-FBGA, FineLine BGA)
Operating Temperature: 0 °C to +85 °C (Commercial, C-grade)
Process Technology: 0.15 µm CMOS
비교 대상: EP20K400CF672C7ES →
Intel
Operating Temperature: 0C to +85C
Speed Grade: C7 (7 ns pin-to-pin)
비교 대상: EP20K400CF672C7ES →
Altera
Package: 672-ball FineLine BGA (FC-FBGA / BBGA)
Operating Temperature: 0 C to 85 C (Commercial)
Process Technology: 0.18-micron CMOS, all-layer copper interconnect
비교 대상: EP20K400CF672C7ES →
Intel
Package: 672-ball FineLine BGA (FC-FBGA)
Operating Temperature: 0C to 85C
Speed Grade: C8
비교 대상: EP20K400CF672C7ES →
Intel
Operating Temperature: 0 C to 85 C (Commercial)
Family: APEX 20K
비교 대상: EP20K400CF672C7ES →
Altera
Package: 672-BGA FineLine (FC-FBGA / S-PBGA-B672)
Operating Temperature: 0°C to 85°C (Commercial)
Process Technology: 0.15 µm CMOS
비교 대상: EP20K400CF672C7ES →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

EP20K400CF672C7

✅ 드롭인
Altera
📦 672-FBGA
APEX-20KC · APEX 20KC (MultiCore™) · 16,640 · 400,000 · 212,992 · 488 · 8 · 672-BBGA (FC-FBGA, FineLine BGA)

✓ 재고 있음

$195 / 개

데이터시트 보기 →

EP20K400CF672C-7ES

✅ 드롭인
Altera
📦 672-FBGA
APEX 20KC · EP20K400 · 400,000 · 16,640 · 212,992 · 488 · 4

✓ 재고 있음

$132 / 개

데이터시트 보기 →

EP20K400CF672C-7

✅ 드롭인
Altera
📦 672-FBGA
APEX-20KC · 16640 · 212992 · 488 · 4 · 1664 · 212 · 16

✓ 재고 있음

$171 / 개

데이터시트 보기 →

EP20K400CF672C-8

✅ 드롭인
Altera
📦 672-FBGA
APEX 20K · 16,640 · 400,000 · 1,664 · 488 · PBGA-672 (FineLine BGA, 27 x 27 mm, 1.0 mm pitch) · 1.8 V nominal (1.71 V to 1.89 V)

✓ 재고 있음

$95 / 개

데이터시트 보기 →

EP20K400EFC672-2

✅ 드롭인
Intel
📦 672-FBGA
APEX 20KE · 16640 · 212992 · 488 · 400000 · 1.8 V · 2.5 ns · 0 C to 85 C

✓ 재고 있음

$92.75 / 개

데이터시트 보기 →

EP20K300EFC672-2

✅ 드롭인
Intel
📦 672-FBGA
APEX 20KE · APEX 20K · 300,000 · 11,520 · 147,456 bits · 408 · 350 MHz · 1.68 ns

✓ 재고 있음

$58.5 / 개

데이터시트 보기 →

EP20K200EFC672-2X

✅ 드롭인
Intel
📦 672-FBGA
APEX 20KE · 200,000 · 106,496 · 8,320 · 832 · 376 · 672-ball FineLine BGA (FBGA) · 0.22 µm CMOS

✓ 재고 있음

$128.4 / 개

데이터시트 보기 →

EP20K400CF672C7ES 최대 정격 & 전기적 특성

Family APEX 20KC
Series EP20K400
Device Type Loadable PLD / FPGA
Logic Elements (Cells) 16,640
System Gates 400,000
Embedded Memory (Bits) 212,992
Total RAM Bits 212,992
Maximum User I/O 488
I/O Lines 484
Input Lines 488
Number of PLLs 4
Maximum Internal Clock Frequency 375.94 MHz
Propagation Delay 1.4 ns
Process Technology 0.18 um CMOS
Core Voltage 1.8 V
MultiVolt I/O 1.5 V / 1.8 V / 2.5 V / 3.3 V
Speed Grade C7 (commercial, -7)
동작 온도 0C to +85C (commercial)
Package Type 672-ball FineLine BGA
Package Code FC-FBGA-B672
Ball Pitch 1.000 mm
실장 유형 Surface Mount

EP20K400CF672C7ES fc-fbga-b672 핀 구성 가이드

EP20K400CF672C7ES(fc-fbga-b672 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

EP20K400CF672C7ES의 fc-fbga-b672 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: EP20K400CF672C7ES.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

EP20K400CF672C7ES 적합 용도: 6 애플리케이션s: Telecommunications Backplane Interface, PCI/PCI-X Bus Bridge, Video Frame Buffer / Imaging Pipeline, DSP Co-Processor Front-End, Industrial Control / Factory Automation, Legacy Telecom Glue Logic Replacement.

🌐

Telecommunications Backplane Interface

The EP20K400CF672C7ES's 400,000 system gates and 488 user I/O pins make it a strong fit for telecommunications backplane bridging applications such as TDM-to-packet conversion and high-speed serial fan-out. Its 4 on-chip PLLs allow multiple clock domains to be derived from a single backplane reference, and the 212 Kbits of embedded memory can hold frame buffers and translation tables without external SRAM. The MultiVolt I/O supports 1.5/1.8/2.5/3.3 V signaling, enabling direct interface to legacy 3.3 V line-card ASICs alongside modern 1.5 V devices. Designers should allocate I/O banks carefully and use Quartus II's timing-driven compilation to meet stringent telecom jitter budgets.

🖥️

PCI/PCI-X Bus Bridge

With 16,640 logic elements and 488 I/Os, the EP20K400CF672C7ES can implement a 64-bit PCI-X bus bridge complete with target/initiator state machines, arbiter, and DMA channels. The -7 commercial speed grade supports PCI-X 133 MHz operation with timing closure achievable in Quartus II. The 4 PLLs provide independent clocks for the primary and secondary bus segments, and the embedded ESBs can store scatter-gather descriptor tables on-chip. Engineers should observe PCI-X add-in card impedance specs (65/85 ohm) and place decoupling within 100 mils of every VCCINT/VCCIO pin pair.

📺

Video Frame Buffer / Imaging Pipeline

The 212 Kbits of embedded memory distributed across the APEX 20KC's ESBs can be configured as dual-port RAM line buffers supporting real-time video pipelines up to 375 MHz internal clock. Combined with 488 I/O pins, the device can ingest parallel BT.1120 or LVDS camera data and output processed frames to a display controller. The 4 PLLs enable pixel-clock, memory-clock, and output-clock generation from a single reference. Designers should use Quartus II's ALTMEMPHY megafunction for SDR/DDR interface generation and verify line-buffer depth against the worst-case horizontal active pixel count.

🏭

DSP Co-Processor Front-End

The APEX 20KC's MultiCore architecture supports custom multiply-accumulate datapaths implemented across distributed logic and ESB-based coefficient memory, making the EP20K400CF672C7ES suitable as a DSP co-processor front-end for FIR/IIR filters and FFT pre-processing. The 400K gates accommodate 16-bit parallel datapaths at sample rates approaching 100 MSPS, while the 4 PLLs provide independent clocks for ADC sampling, DSP clocking, and host-interface hand-off. Engineers should pipeline at LE granularity and use Quartus II's DSP megafunctions to leverage hard carry chains for predictable timing.

🏭

Industrial Control / Factory Automation

With 488 I/O pins, the EP20K400CF672C7ES can fan out to many discrete sensors, encoders, and actuators in factory-automation controllers. The MultiVolt I/O simplifies interfacing with both 24 V-sourced industrial inputs (via external level shifters) and 3.3 V MCUs. The 4 PLLs support multiple motor-control PWM frequencies from a single reference clock. For harsh-environment deployments, the industrial-temp sibling EP20K400EFC672-2 shares the same FBGA-672 footprint but extends the operating range. PCB designs should follow IPC-2221/2222 guidelines and provide adequate thermal relief given the BGA's thermal mass.

🌐

Legacy Telecom Glue Logic Replacement

The EP20K400CF672C7ES is commonly used to replace discontinued ASICs and bipolar glue logic in legacy telecommunications equipment, where its 400K gates and 488 I/Os can integrate many bus-translation, interrupt-controller, and watchdog functions onto a single chip. Its JTAG-based IEEE 1149.1 boundary-scan support simplifies board-level test for systems originally designed without scan chains. Engineers porting from older PLD families should re-validate timing using Quartus II's TimeQuest timing analyzer and verify that MultiVolt I/O bank assignments match the legacy ASIC's 5 V-tolerant interface requirements via external translation.

What family does the EP20K400CF672C7ES belong to?
The EP20K400CF672C7ES is part of the Altera APEX 20KC family of FPGAs. According to the Altera APEX 20KC datasheet, the family integrates logic elements, embedded system blocks (ESBs) for memory, and I/O elements on a MultiCore interconnect. The "400" suffix denotes 400,000 system gates and 16,640 logic elements; the "C7" suffix is the -7 commercial speed grade; "ES" indicates Engineering Sample silicon.
How many user I/O pins does the EP20K400CF672C7ES provide?
The EP20K400CF672C7ES provides up to 488 user I/O pins (with 484 I/O lines plus dedicated configuration/clock pins) in its 672-ball FineLine BGA package. This high I/O count makes the device well suited for wide data-path interfaces such as 64-bit PCI/PCI-X bridges, DDR memory controllers, and parallel telecommunications backplanes that require many simultaneous bidirectional signals.
What is the maximum clock frequency of the EP20K400CF672C7ES?
The EP20K400CF672C7ES supports a maximum internal clock frequency of 375.94 MHz with a propagation delay of approximately 1.4 ns. The device contains 4 on-chip phase-locked loops (PLLs) for clock multiplication, division, and phase shifting. Real-world Fmax in user designs depends on logic depth, fan-out, routing congestion, and Quartus II timing-driven compilation.
Where can I buy the EP20K400CF672C7ES and what does it cost?
The EP20K400CF672C7ES is available from authorized obsolete-stock distributors including Sierra IC, Jotrin Electronics, Augswan, and FPGAkey, as of 2026-09-08. Typical list pricing runs in the USD 150-285 range depending on quantity breaks. Because the part is obsolete (Engineering Sample silicon from the APEX 20KC family, end-of-life), pricing varies widely across the secondary market and lead times are typically 1-5 days.
Is the EP20K400CF672C7ES still in production?
No. The EP20K400CF672C7ES is an obsolete / Engineering Sample part from Altera's APEX 20KC family, which has been discontinued. New production is no longer available through Altera/Intel authorized channels. The part can still be sourced through the secondary distribution market, and Altera's Quartus II toolchain (legacy versions) continues to support it for existing designs.
What does the "ES" suffix mean on EP20K400CF672C7ES?
The "ES" suffix stands for Engineering Sample - pre-production silicon distributed to early customers for design validation. Engineering Samples may have parametric differences from production-grade silicon, and they are typically not recommended for volume production deployment. For designs targeting volume manufacturing, designers should select a non-ES variant such as EP20K400CF672C7.
What is the difference between EP20K400CF672C7ES and EP20K400CF672C7?
Both parts share the same 672-ball FineLine BGA package, 400K-gate APEX 20KC die, and -7 commercial speed grade. The difference is the "ES" suffix on the former, which designates Engineering Sample silicon. The non-ES EP20K400CF672C7 is the production-grade equivalent with guaranteed parametric compliance, making it the preferred choice for designs that will transition to volume manufacturing.
What software is used to program the EP20K400CF672C7ES?
The EP20K400CF672C7ES is programmed using Altera Quartus II design software (legacy versions). Quartus II provides synthesis, place-and-route, timing analysis, and configuration file generation for the APEX 20KC family. Programming can be performed via JTAG (IEEE 1149.1), passive serial, passive parallel synchronous, or passive parallel asynchronous configuration modes.
Can EP20K400CF672C7ES be replaced by EP20K400CF672C-7ES?
Yes, the EP20K400CF672C-7ES is functionally compatible with the EP20K400CF672C7ES, sharing the same APEX 20KC 400K-gate die, 672-ball FineLine BGA package, and -7 commercial speed grade. Both are Engineering Sample silicon. The ordering code formatting differs slightly (alternate Altera naming convention), but the parts share identical pinout, footprint, and configuration file compatibility for the same package.
Is the EP20K400CF672C7ES RoHS compliant?
RoHS compliance information for the EP20K400CF672C7ES is not confirmed in the verified distributor data and is marked as [DATA_NEEDED: RoHS compliance]. The APEX 20KC family was introduced before widespread RoHS adoption, so Engineering Sample units may be non-compliant; designers requiring RoHS compliance for new designs should request the RoHS/lead-free certificate from the supplier at the time of quotation.
What is the package type and ball pitch of EP20K400CF672C7ES?
The EP20K400CF672C7ES is housed in a 672-ball FineLine BGA (FC-FBGA-B672) package with a 1.000 mm terminal pitch, per the Microchip USA product listing. The FineLine BGA is a surface-mount package optimized for high-density interconnect. PCB designs must use appropriate microvia stack-up and BGA fanout rules to reliably route all 672 balls.
What is a drop-in replacement for EP20K400CF672C7ES?
Drop-in replacements for the EP20K400CF672C7ES include EP20K400CF672C7 (production grade, same package, same die), EP20K400CF672C-7ES (same package, Engineering Sample), and EP20K400CF672C-8 (same package, -8 speed grade). All share the same 672-ball FineLine BGA footprint, MultiVolt I/O, and 4 PLLs, making them pin-compatible on the existing PCB land pattern.
What is the EP20K400CF672C7ES best suited for?
The EP20K400CF672C7ES is best suited for high-density data-path processing, telecommunications backplane interfaces, PCI/PCI-X bridging, video frame buffering, and DSP co-processing front-ends. Its 400K gates, 212 Kbits of embedded memory, 488 I/O pins, and 4 PLLs make it well-matched to wide-bus glue-logic and protocol-bridging applications where ASIC NRE cost is prohibitive.
How much embedded memory does the EP20K400CF672C7ES contain?
The EP20K400CF672C7ES contains 212,992 bits of embedded memory distributed across its Embedded System Blocks (ESBs). Per the APEX 20KC datasheet, each ESB can be configured as dual-port RAM, single-port RAM, ROM, or CAM. The 212 Kbit memory capacity supports medium-size FIFOs, lookup tables, and data-path scratchpad memories without requiring external SRAM.
What is the core voltage of EP20K400CF672C7ES?
The EP20K400CF672C7ES uses a 1.8 V core supply with MultiVolt I/O supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces. Built on a 0.18 um CMOS process, the 1.8 V core is supplied through VCCINT pins, while VCCIO pins set the I/O bank voltage. Designers must provide both rails with proper decoupling per the APEX 20KC hardware reference manual.

엔지니어링 참조 데이터: EP20K400CF672C7ES — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the EP20K400CF672C7ES when you need a 400K-gate APEX 20KC device for prototype/validation work and the Engineering Sample silicon grade is acceptable. For volume production, switch to EP20K400CF672C7 (production grade, same die/package). Choose EP20K400CF672C-7ES if your procurement documentation uses the alternate ordering-code format. Choose EP20K400CF672C-8 if the -8 speed grade is acceptable and cost is prioritized over Fmax. Choose EP20K400EFC672-2 for industrial-temperature deployments (-40C to +100C). All alternatives share the identical 672-ball FineLine BGA footprint, enabling PCB layout reuse across the family. For new designs, consider migrating to a current-generation Altera/Intel FPGA (Cyclone, MAX) since APEX 20KC is obsolete and supported only through legacy Quartus II toolchains.

대체품과의 비교

파라미터 이 제품 EP20K400CF672C7 EP20K400CF672C-7ES EP20K400CF672C-7 EP20K400CF672C-8 EP20K400EFC672-2
Brand Altera Altera Altera Altera Altera Altera
Package 672-FBGA 672-FBGA - same 672-FBGA - same 672-FBGA - same 672-FBGA - same 672-FBGA - same
Logic Elements 16,640 16,640 16,640 16,640 16,640 16,640
System Gates 400,000 400,000 400,000 400,000 400,000 300,000 (75%)
Embedded Memory (bits) 212,992 212,992 212,992 212,992 212,992 147,456 (69%)
User I/O 488 488 488 488 488 488
Number of PLLs 4 4 4 4 4 4
Speed Grade -7 (C7, commercial) -7 (C7) -7 ES -7 -8 (slower) -2 industrial
Silicon Grade Engineering Sample (ES) Production Engineering Sample Production Production Production industrial
Operating Temperature 0C to +85C (commercial) 0C to +85C 0C to +85C 0C to +85C 0C to +85C -40C to +100C (industrial)

주요 차별점

  • Highest gate density in the 672-FBGA APEX 20KC family (vs EP20K300EFC672-2)
  • Faster -7 speed grade option available (vs EP20K400CF672C-8)
  • Production-grade variant available for volume migration (vs EP20K400CF672C7)
  • Industrial-temp variant available in same package (vs EP20K400EFC672-2)

설계 노트

Estimated: The EP20K400CF672C7ES requires two distinct supply rails - VCCINT (1.8 V core) and VCCIO (1.5/1.8/2.5/3.3 V I/O banks). The 672-FBGA package typically requires 8-12 VCCINT balls and 16-20 VCCIO balls distributed across the package perimeter. Designers should provide at least 4 bulk 100 uF tantalum capacitors near the FBGA plus 0.1 uF and 0.01 uF ceramic decoupling within 100 mils of every VCC/VSS pair to suppress transient current spikes during simultaneous switching output (SSO) events. Use a star-ground topology and isolate analog/digital grounds per the APEX 20KC hardware reference manual.

The 672-ball FineLine BGA with 1.000 mm pitch requires a multi-layer PCB (typically 6-8 layers) with microvia stack-up. Use IPC-2221/2222 design rules and verify BGA fanout with your PCB vendor's design rules before finalizing layout. Recommended stack-up: top signal/GND/power/signal/core/power/GND/signal-bottom with controlled-impedance layers for high-speed I/O. Provide at least one full GND plane directly under the BGA for return-path integrity and thermal dissipation. The BGA's center balls are difficult to probe - include test points on all critical signals at the board periphery.

Differential pairs (LVDS, PCI-X) should be length-matched within 25 mils (about 0.6 mm) and routed with 100 ohm differential impedance. The APEX 20KC supports MultiVolt I/O; group I/O bank assignments by voltage in Quartus II's Pin Planner before finalizing PCB layout to avoid bank re-spins. Decoupling capacitor vias should share the same GND plane via to minimize loop inductance. Leave at least 200 mils of clearance around the BGA for rework accessibility, and consider a heatsink thermal pad pattern for designs with sustained high switching activity.

Engineering Sample (ES) silicon may have parametric differences from production parts and should not be used in volume manufacturing. Always validate ES silicon against the production datasheet before committing to a design. Configuration mode pins (MSEL[3:0]) must be tied to the correct logic levels for the chosen configuration scheme (passive serial, passive parallel, JTAG) - incorrect settings will cause configuration failure. The JTAG TCK pin should be pulled to a defined logic level through a 10 kohm resistor to prevent floating-clock configuration errors. Finally, ensure nCONFIG is held low during power-up until all rails are stable.

규정 준수 정보

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
무연
Unknown
무할로겐
Unknown
분쟁 광물
Unknown

Compliance information was not confirmed in the verified distributor data. APEX 20KC parts pre-date widespread RoHS adoption; Engineering Sample units should be verified for lead-free / RoHS status with the supplier before deployment in RoHS-regulated markets. AEC-Q100 is not applicable since this is a commercial-grade FPGA.

데이터 검증일: 2026-09-08 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

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Altera Intel APEX 20KC EP20K400CF672C7ES EP20K400CF672C7 EP20K400CF672C-7ES EP20K400CF672C-8 FPGA Field Programmable Gate Array Programmable Logic Device PLD FineLine BGA FBGA-672 0.18 um CMOS 1.8 V core MultiVolt I/O Quartus II JTAG IEEE 1149.1 PLL Embedded System Block ESB PCI-X RoHS AEC-Q100
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