EP20K400CF672I7 - APEX 20KC FPGA 400K Gates 672-BGA | Intel
부품 번호: EP20K400CF672I7 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 250 | $209 | $52,250.00 |
| 500 | $190.5 | $95,250.00 |
EP20K400CF672I7 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor IC built from configurable logic blocks, embedded memory, routing interconnects, and I/O cells that designers can program post-fabrication using a hardware description language. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs, occupying the niche between fixed-function ASICs and software-driven microcontrollers, and are widely used in telecom infrastructure, video processing, and ASIC prototyping where throughput and reconfigurability dominate cost.
Key features of the EP20K400CF672I7 include 212,992 bits of embedded SRAM distributed as ESBs (Embedded System Blocks), up to four phase-locked loops for clock management, multi-level hierarchical interconnect, and LVDS/LVCMOS-compatible I/O. The device supports in-system programmability via the IEEE 1149.1 boundary-scan interface and is qualified for the industrial temperature range (-40 C to +85 C) as denoted by the 'I' suffix in the part number. The 672-ball FC-FBGA package delivers high I/O density for board-constrained designs.
Architecturally, the APEX 20KC combines a fine-grained LUT-based logic fabric with MegaLAB structures that aggregate multiple logic elements, an industry-leading 0.15-micrometer process technology at the time of introduction, and deterministic timing model primitives in the Quartus MAX+PLUS II design environment. The 'I7' speed grade denotes an industrial-temperature, mid-speed bin, while the '7' in C[6]72C7 variants denotes commercial temperature.
Typical applications include high-speed datapath processing, telecom line-card glue logic, ASIC prototyping, video and image processing pipelines, and industrial control interfaces. Designers favor the APEX 20KC for designs that need >100K gates, multi-port memory, and LVDS I/O without moving to higher-cost families.
When designing with this device, ensure robust decoupling (multiple bulk + 0.1 uF ceramic capacitors at every supply pin), controlled-impedance routing for LVDS pairs, and that the configuration scheme (PS, AS, JTAG) is selected before PCB layout to avoid extra rework.
This page synthesizes the Intel/Altera APEX 20KC family datasheet, current distributor inventory, drop-in APEX 20KC pin-compatible alternatives, and practical design notes not consolidated on the manufacturer's product page.
드롭인 대체품: EP20K400CF672I7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K400CF672I7 (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Operating Temperature, Package, Speed Grade, Series.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K400CF672C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$160 / 개
데이터시트 보기 →EP20K400CF672C8
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$108 / 개
데이터시트 보기 →EP20K400CF672C9
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$390.4 / 개
데이터시트 보기 →EP20K400CF672C7ES
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$152 / 개
데이터시트 보기 →EP20K400CF672C7
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$195 / 개
데이터시트 보기 →EP20K400CF672I7 최대 정격 & 전기적 특성
| Family | APEX 20KC |
| Logic Elements | 16,640 |
| Maximum System Gates | 400,000 |
| Embedded Memory (ESB) | 212,992 bits |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.8 V |
| I/O Supply Voltage | 1.8 V / 3.3 V |
| PLL Count | 4 |
| 동작 온도 | -40 C to +85 C (industrial) |
| Speed Grade | I7 |
| 패키지 | 672-ball FC-FBGA (Fine-pitch Chip-Scale BGA) |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| JESD-609 Code | e0 |
| 습도 민감도 레벨 (MSL) | 3 |
| Configuration Mode | PS / AS / JTAG (IEEE 1149.1) |
EP20K400CF672I7 672-ball fc-fbga (fine-pitch chip-scale bga) 핀 구성 가이드
EP20K400CF672I7(672-ball fc-fbga (fine-pitch chip-scale bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K400CF672I7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K400CF672I7 적합 용도: 6 애플리케이션s: Telecom Line-Card Glue Logic, ASIC Prototyping and Emulation, Video and Image Processing Pipelines, Industrial Control and Machine Interfaces, High-Speed Datapath and DSP Front-End, Legacy Avionics and Military Interfaces.
Telecom Line-Card Glue Logic
The EP20K400CF672I7's 16,640 logic elements, 212 Kbit embedded SRAM, and four PLLs are well matched to telecom line-card glue logic where the device arbitrates between network processors, framer chips, and TDM/Ethernet backplanes. Mixed 1.8 V core and 3.3 V I/O rails let the FPGA interface directly to legacy 3.3 V line-driver ASICs without level shifters, while the 672-ball FC-FBGA provides enough I/O for parallel bus bridging. Engineers typically run the APEX 20KC at 80-120 MHz internal logic with DDR-style I/O at the edge, which is comfortably within the I7 speed-grade timing model. Industrial temperature rating enables deployment in outdoor enclosures.
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ASIC Prototyping and Emulation
With 400K system gates, the EP20K400CF672I7 holds enough logic to prototype mid-complexity ASICs (around 200K-300K ASIC gates after mapping inefficiencies) before committing to silicon. Quartus II and MAX+PLUS II provide RTL synthesis, gate-level place-and-route, and timing closure flows that match the final ASIC at the block level. The abundant embedded SRAM allows emulating register files, FIFOs, and small caches without external memory, and the 672-ball FC-FBGA exposes enough pins to map wide ASIC buses one-for-one. Industrial temperature range supports emulation of automotive and industrial ASIC targets during thermal validation.
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Video and Image Processing Pipelines
The EP20K400CF672I7's 16,640 logic elements and 212 Kbit embedded SRAM are sufficient to implement line buffers, color-space converters, and de-interlacers for SDTV and early HDTV video streams at rates up to ~80 MHz pixel clock. The four PLLs allow generation of separate pixel clock, memory clock, and display clock from a single reference, simplifying board-level clock trees. Mixed 1.8 V/3.3 V I/O lets the device drive LVDS transmitters and BT.656 video ADCs without external level translation. Designers typically pair the FPGA with external SDRAM or DDR memory for full-frame buffering.
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Industrial Control and Machine Interfaces
Industrial PLCs, motor controllers, and HMI panels benefit from the EP20K400CF672I7's combination of high logic density, industrial -40 C to +85 C temperature range, and mixed 1.8 V/3.3 V I/O that interfaces directly to 3.3 V sensor ASICs and 5 V-tolerant transceivers. The 672-ball FC-FBGA package supplies enough I/O for parallel encoder inputs, PWM outputs, and isolated communication links. Embedded SRAM serves as scratch memory for state machines and lookup tables used in PID controllers and motion profiling. PLLs synthesize deterministic clocks for time-critical interrupt handlers.
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High-Speed Datapath and DSP Front-End
The EP20K400CF672I7's logic fabric supports parallel datapath structures, FIR filters, and FFT butterflies at clock rates up to ~150 MHz in the I7 speed grade, well suited for software-defined radio baseband, channelizers, and signal-conditioning front-ends. Embedded System Blocks (ESBs) implement shift registers, dual-port RAM, and ROM lookup tables that DSP pipelines require, removing the need for external memory in many cases. The four PLLs multiply a low-jitter reference clock to derive multiple synchronous domains, and mixed-voltage I/O connects cleanly to high-speed ADCs and DACs.
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Legacy Avionics and Military Interfaces
Long-life avionics and military programs still rely on the APEX 20KC family because the part's lifecycle, qualification data, and design tools are well understood by certifying agencies. The EP20K400CF672I7's 16,640 logic elements implement ARINC 429, MIL-STD-1553, and discrete interfaces alongside FPGA-based protocol engines, while the industrial temperature range covers most avionic bay environments. Tin/lead terminal finish supports the older solder processes still used in many defense manufacturing lines. Designers pair the part with MIL-spec transceivers for complete ruggedized interface modules.
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추천 제품 요약
엔지니어링 참조 데이터: EP20K400CF672I7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K400CF672C7N | EP20K400CF672C8 | EP20K400CF672C9 | EP20K400CF672C7ES | EP20K400CF672C7 |
|---|---|---|---|---|---|---|
| Package | 672-ball FC-FBGA | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Maximum System Gates | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 |
| Operating Temperature | -40 C to +85 C (industrial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) |
| Speed Grade | I7 | C7 | C8 | C9 | C7 | C7 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Terminal Finish | Tin/Lead (Sn/Pb) - non-RoHS | Lead-free (RoHS) | Tin/Lead (Sn/Pb) - non-RoHS | Tin/Lead (Sn/Pb) - non-RoHS | Lead-free (RoHS) | Tin/Lead (Sn/Pb) - non-RoHS |
주요 차별점
- Industrial temperature range with same APEX 20KC architecture (vs EP20K400CF672C7)
- Faster speed grade than C8/C9 variants (vs EP20K400CF672C8)
- Same die, same pinout, drop-in compatible with C7N (vs EP20K400CF672C7N)
설계 노트
The APEX 20KC EP20K400CF672I7 draws transient current surges of several amps during configuration and logic transitions. Place at least four 100 uF bulk tantalum or polymer capacitors plus 0.1 uF and 0.01 uF ceramic decoupling caps within 0.5 inch of every VCCINT and VCCIO pin pair. Keep VCCINT and VCCIO planes separate to avoid cross-coupling, and add a ferrite bead between the 1.8 V regulator output and the device to attenuate switching noise. Power-on ramp should follow the datasheet-specified monotonic sequence (VCCINT first, then VCCIO, then configuration).
The 672-ball FC-FBGA uses a 1.0 mm pitch; PCB layout requires laser-drilled microvias, 4-6 layer stackup, and matched-length routing for LVDS pairs (typically within 150 mils). Escape routing must use dog-bone fanout with 0.4 mm via diameter, and the inner balls should connect to internal power planes via short stubs. Signal integrity simulations are recommended at 100 MHz+ to confirm impedance targets of 50 ohm single-ended and 100 ohm differential.
Estimated: at typical 1.8 V core activity with 60% logic utilization, the EP20K400CF672I7 dissipates roughly 1.5-2.5 W internally. The 672-ball FC-FBGA package has a theta-JA in the 15-25 C/W range per JEDEC EIA/JESD51 test conditions, so without airflow junction temperature rises 25-60 C above ambient. For industrial -40 C to +85 C environments, ensure sufficient PCB copper (>=4 square inches of inner plane) and consider a small heatsink if junction temperature must stay below 100 C at 85 C ambient.
Three common pitfalls to avoid: (1) do not assume the EP20K400CF672I7 and APEX 20K (non-C) are pin-compatible - the C variant has different MegaLAB structures; (2) the MSL-3 moisture rating requires baking before assembly if the bag has been open >168 hours; (3) configuration mode (PS vs AS vs JTAG) must be selected via MSEL pins before PCB layout, since changing modes may require different DONE/MSEL pull-up resistor values.
규정 준수 정보
JESD-609 code e0 with Sn/Pb terminal finish confirms non-RoHS status. AEC-Q100 status not documented; APEX 20KC is not in scope for AEC-Q100 automotive qualification. Conflict-mineral and halogen-free status unknown for this legacy Altera/Intel FPGA.
