EP20K600CF33C9N - APEX 20KC FPGA 600K Gates 250MHz | Intel
부품 번호: EP20K600CF33C9N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $195 | $19,500.00 |
| 500 | $168 | $84,000.00 |
| 1,000 | $142 | $142,000.00 |
EP20K600CF33C9N 개요
An FPGA (Field Programmable Gate Array) is a programmable logic device that lets engineers implement custom digital circuits after PCB fabrication. Within the programmable logic hierarchy, the APEX 20KC family sits between mid-density CPLDs and high-end SRAM-based FPGAs, integrating Look-Up Tables (LUTs) with embedded system blocks (ESBs) that can be configured as memory, multipliers, or simple logic. This makes the 20KC family a multi-purpose platform for data-path, control, and DSP-style functions.
Key features include 24,320 logic elements, approximately 600K usable gates, embedded memory blocks, fast I/O elements with LVTTL/LVCMOS/PECL support, and a flexible clock network with up to four phase-locked loops (PLLs). The device supports in-system programmability via the IEEE 1149.1 JTAG interface and can be configured through passive serial, passive parallel, or passive asynchronous modes using a serial configuration device such as the Altera EPC.
Architecturally, the APEX 20KC combines a MultiCore architecture with embedded system blocks distributed across the device. The 0.15 µm process delivers an excellent performance-per-watt ratio for its logic density, and the FC-FBGA-1020 package provides a robust thermal envelope and high pin count for wide parallel interfaces. The 250 MHz system performance is suitable for high-speed data acquisition, communications backplanes, and processor co-processing.
Typical applications include telecommunications infrastructure, ASIC prototyping, high-speed image and video processing, network packet processing, DSP co-processing, and industrial automation controllers. The combination of embedded memory and high pin count also makes it useful for custom interface bridging and bus conversion designs.
When designing with this part, ensure adequate power decoupling near every VCC/VCCIO ball and follow Altera's recommended PCB layout for BGA packages. Configuration mode and JTAG chain design must be planned up-front because the APEX 20KC requires a separate configuration device on power-up.
This page synthesizes current distributor pricing, drop-in alternatives from the same APEX 20KC family, and practical design notes that go beyond the manufacturer datasheet to help engineers select and source this legacy FPGA.
드롭인 대체품: EP20K600CF33C9N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K600CF33C9N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Configuration Interface, Speed Grade, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K600CF33C9
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP20K600CF33C8N
✅ 드롭인✓ 재고 있음
$162.75 / 개
데이터시트 보기 →EP20K600CF33C7N
✅ 드롭인✓ 재고 있음
$110 / 개
데이터시트 보기 →EP20K600CF1020C9
✅ 드롭인✓ 재고 있음
$165 / 개
데이터시트 보기 →EP20K600CF1020C8
✅ 드롭인✓ 재고 있음
$92 / 개
데이터시트 보기 →EP20K600CF1020C7
✅ 드롭인✓ 재고 있음
$212.4 / 개
데이터시트 보기 →EP20K600CF33C9N 최대 정격 & 전기적 특성
| Family | APEX 20KC |
| Logic Elements | 24,320 |
| Typical Gates | 600,000 |
| Maximum Operating Frequency | 250 MHz |
| Process Technology | 0.15 µm CMOS |
| Core Supply Voltage | 1.8 V |
| 패키지 | FC-FBGA-1020 |
| 핀 수 | 1020 |
| 실장 유형 | Surface Mount (BGA) |
| Configuration Interface | JTAG (IEEE 1149.1), Passive Serial/Parallel |
| I/O Standards | LVTTL, LVCMOS, PCI, PECL |
| Embedded Memory | Embedded System Blocks (ESBs) |
EP20K600CF33C9N fc-fbga-1020 핀 구성 가이드
EP20K600CF33C9N(fc-fbga-1020 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K600CF33C9N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K600CF33C9N 적합 용도: 6 애플리케이션s: ASIC Prototyping, Telecommunications Infrastructure, High-Speed Image and Video Processing, DSP Co-Processing, Custom Interface Bridging, Network Packet Processing.
ASIC Prototyping
The EP20K600CF33C9N's 24,320 logic elements and 600K usable gates provide ample capacity to prototype complex ASIC designs before committing to fabrication. With 250 MHz internal performance, the device can emulate ASICs in the 150-200 MHz operating range, sufficient for most communications, image processing, and processor co-design verification. Designers map RTL (Verilog/VHDL) into the FPGA via Quartus II, use the embedded system blocks for memory and DSP functions, and iterate quickly without the mask and NRE costs of an ASIC spin. The FC-FBGA-1020 package's high pin count supports wide parallel buses for ASIC testbench interfaces.
추천
Telecommunications Infrastructure
Telecom backplane designs benefit from the EP20K600CF33C9N's high logic density and fast I/O supporting LVTTL, LVCMOS, PCI, and PECL standards. At 250 MHz the device can implement protocol bridges, framer circuits, ATM segmentation and reassembly, and HDLC controllers used in legacy SONET/SDH and PDH equipment. The 1020-ball FC-FBGA package provides sufficient I/O for parallel bus connections to network processors, serializer/deserializer chips, and TDM switching fabrics. Embedded system blocks can be configured as FIFOs for packet buffering.
추천
High-Speed Image and Video Processing
Image processing pipelines requiring real-time pixel-rate operation can use the EP20K600CF33C9N to implement filters, FFTs, and color-space converters. The 0.15 µm process delivers sufficient performance for 250 MHz operation, and embedded system blocks can be configured as dual-port RAM line buffers or multiplier arrays for convolution operations. The wide 1020-pin FC-BGA interface accommodates parallel camera sensor inputs (up to 64-bit data buses) and connects to memory controllers for frame buffering in SDRAM. Typical use cases include machine vision, medical imaging front-ends, and broadcast video equipment.
추천
DSP Co-Processing
The EP20K600CF33C9N can serve as a DSP co-processor alongside a host processor, accelerating compute-intensive tasks like FIR filtering, FFT/iFFT transforms, and error correction. The embedded system blocks support multiplier-accumulator functions critical for DSP datapaths, and the 250 MHz system clock enables throughput in the hundreds of MMACs. Designers typically use a host port interface (e.g., PCI or local bus) to transfer data between the host CPU and the FPGA's internal RAM blocks. This is a common pattern in software-defined radio, radar signal processing, and audio processing systems.
추천
Custom Interface Bridging
Legacy-to-modern interface bridges (e.g., PCI to PCIe, parallel ATA to SATA, VME to Serial RapidIO) are well-suited for the EP20K600CF33C9N because of its wide I/O flexibility and high pin count. The device can be configured as an LVTTL bridge on one side and a PECL/LVDS interface on the other, with FIFO buffering in embedded system blocks to handle rate matching. The 250 MHz performance easily meets gigabit-per-second throughput targets. Industrial control systems, test instrumentation, and aerospace retrofits often rely on this kind of FPGA-based glue logic to extend the life of legacy equipment.
추천
Network Packet Processing
Routers, switches, and security appliances have used the EP20K600CF33C9N for deep-packet inspection, classification engines, and traffic management functions. The 600K-gate capacity allows complex parsing pipelines, hash tables in embedded system blocks, and TCAM-like lookup functions implemented in LUT RAM. The 250 MHz system clock and 1020-pin FC-FBGA interface support multi-gigabit Ethernet MACs, SPI-4.2 interfaces, and Serial RapidIO links. Although modern designs have moved to Intel Cyclone V or Xilinx 7-series, the 20KC remains in deployed telecom and datacom infrastructure worldwide.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K600CF33C9N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K600CF33C9 | EP20K600CF33C8N | EP20K600CF33C7N | EP20K600CF1020C9 |
|---|---|---|---|---|---|
| Package | FC-FBGA-1020 | FC-FBGA-1020 - same | FC-FBGA-1020 - same | FC-FBGA-1020 - same | FC-FBGA-1020 - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Logic Elements | 24,320 | 24,320 - same | 24,320 - same | 24,320 - same | 24,320 - same |
| Typical Gates | 600,000 | 600,000 - same | 600,000 - same | 600,000 - same | 600,000 - same |
| Speed Grade | -9 (fastest) | -9 (fastest) - same | -8 (10% slower) | -7 (20% slower) | -9 (fastest) - same |
| Max Frequency | 250 MHz | 250 MHz - same | ~225 MHz | ~200 MHz | 250 MHz - same |
| Core Voltage | 1.8 V | 1.8 V - same | 1.8 V - same | 1.8 V - same | 1.8 V - same |
| Process | 0.15 µm | 0.15 µm - same | 0.15 µm - same | 0.15 µm - same | 0.15 µm - same |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Fastest speed grade in the 20KC 600K family (vs EP20K600CF33C7N)
- Lead-free finish with full drop-in compatibility (vs EP20K600CF33C9)
- Maximum I/O count among 20KC packages (vs EP20K600CB652C9N)
설계 노트
The EP20K600CF33C9N requires multiple supply rails: VCCINT (1.8 V core), VCCIO (3.3 V/2.5 V/1.8 V per bank), and VCC_PLL (1.8 V for phase-locked loops). Decouple each rail with 0.1 µF and 10 µF ceramic capacitors placed within 5 mm of the respective balls. For a fully utilized device, total power dissipation can reach 3-5 W - use at least four PCB power layers and thermal vias beneath the BGA to spread heat.
Estimated: the 1020-ball FC-FBGA at 1.0 mm pitch requires microvia (laser-drilled) PCB technology or via-in-pad construction with copper-filled and plated-over vias. Standard 0.4 mm via-in-pad with 6-mil laser drill is recommended. Use a 1-oz copper outer layer and 2-oz inner power/ground layers for current handling. Signal trace width/space of 4 mil/4 mil is typical for breakout routing.
The APEX 20KC is SRAM-based and loses configuration on power-down - an external EPC-series configuration ROM (e.g., EPC16) is mandatory for stand-alone operation. JTAG chain order matters: connect TDI->TDO in correct sequence and provide pull-ups on nCONFIG, nSTATUS, and CONF_DONE lines. Banks must be powered before use; unused banks should still receive VCCIO to prevent floating inputs and ICCIO leakage.
At full logic utilization (estimated ~85% LE usage, all I/O switching), junction temperature can approach 100 °C without airflow. With FC-FBGA-1020's typical theta_JA around 15-20 °C/W on a 6-layer JEDEC test board, a 3-5 W dissipation requires 200-300 LFM airflow or an attached heatsink for industrial temperature (85 °C) operation.
규정 준수 정보
The 'N' suffix conventionally indicates lead-free ball finish per JEDEC J-STD-020, but RoHS/REACH compliance is not confirmed in the verified web data. AEC-Q100 not applicable - this is a general-purpose commercial FPGA.