EP1SGX25FF1020I6N - Stratix GX FPGA, 25K LE, 607 I/O | Altera
부품 번호: EP1SGX25FF1020I6N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 50 | $215 | $10,750.00 |
| 100 | $185 | $18,500.00 |
| 500 | $160 | $80,000.00 |
| 1,000 | $145 | $145,000.00 |
EP1SGX25FF1020I6N 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, memory blocks, and DSP slices. FPGAs occupy the middle ground between fixed-function ASICs (high NRE, low unit cost) and microcontrollers (software-defined, lower throughput). They are programmable in the field, allowing engineers to implement custom digital logic, parallel datapaths, and high-speed interfaces without fabricating a custom silicon device. In the broader taxonomy: FPGA -> programmable logic -> digital IC -> semiconductor -> integrated circuit.
Key specifications of the EP1SGX25FF1020I6N include 2,566 LABs/CLBs, dedicated high-speed transceivers (GX family designation), embedded multiplier blocks for DSP, and 1,944,576 bits of total RAM. The device supports up to 607 user I/O across multiple I/O banks supporting multiple single-ended and differential I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. Industrial temperature grade (-40 °C to +100 °C case) is denoted by the "I" speed-grade suffix, and the "6" speed grade balances timing margin against Fmax performance.
Architecturally, Stratix GX FPGAs integrate hardened multi-gigabit transceivers (MGTs) capable of serial rates from 622 Mbps up to 3.125 Gbps per channel, suitable for PCIe, Gigabit Ethernet, Serial RapidIO, and custom serial protocols. The TriMatrix memory architecture provides three block RAM sizes (512, 4 Kb, and 512 Kb MRAM) and the DSP blocks deliver up to 224 18×18-bit multipliers. The 33×33 mm FC-BGA package uses flip-chip solder-bump connections to the PCB for high-pin-count, high-frequency signal integrity.
Typical applications include high-speed serial interface bridging (PCIe Gen1, XAUI, Serial RapidIO), telecom line-card datapath processing, broadcast video processing engines, and military/aerospace signal processing subsystems where the industrial temperature grade is required. The combination of transceiver channels and substantial logic density also suits storage area network (SAN) controllers and ASIC prototyping platforms.
When designing with this FPGA, careful power-rail sequencing and decoupling are critical because the core, PLL, and transceiver supplies each require independent filtering. Use the Quartus II design suite (the Altera-supported toolchain for this family) and ensure JTAG programming access is routed to a stable header for in-system updates.
This page synthesizes distributor pricing, drop-in Altera/Intel pin-compatible variants, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EP1SGX25FF1020I6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX25FF1020I6N (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Operating Temperature, Package, RoHS Status, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX25FF1020I5N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2050 / 개
데이터시트 보기 →EP1SGX25FF1020I7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$98.5 / 개
데이터시트 보기 →EP1SGX25FF1020C6N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$160 / 개
데이터시트 보기 →EP1SGX25FF1020C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$62.5 / 개
데이터시트 보기 →EP1SGX25FF1020C5N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1580 / 개
데이터시트 보기 →EP1SGX25DF1020I6N
✅ 드롭인✓ 재고 있음
$165 / 개
데이터시트 보기 →EP1SGX25DF1020I5N
✅ 드롭인✓ 재고 있음
$985 / 개
데이터시트 보기 →EP1SGX25DF1020I7N
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP1SGX25FF1020I6N 최대 정격 & 전기적 특성
| Manufacturer | Altera (Intel) |
| Series | Stratix GX |
| Family | Stratix GX FPGA |
| Logic Elements (LE) | 25,660 |
| Number of LABs/CLBs | 2,566 |
| Total RAM Bits | 1,944,576 |
| User I/O Count | 607 |
| Supply Voltage - Core | 1.425 V to 1.575 V |
| 동작 온도 | -40 °C to +100 °C (Industrial) |
| 실장 유형 | Surface Mount |
| 패키지 / 케이스 | 1020-BBGA, FCBGA |
| Supplier Device Package | 1020-FBGA (33x33) |
| Speed Grade | 6 |
| Process Node | 0.13 µm |
| Embedded Transceivers | Stratix GX multi-gigabit transceivers (MGTs) |
EP1SGX25FF1020I6N 1020-fbga (33x33) 핀 구성 가이드
EP1SGX25FF1020I6N(1020-fbga (33x33) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX25FF1020I6N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX25FF1020I6N 적합 용도: 6 애플리케이션s: High-Speed Serial Interface Bridging, Telecom Line-Card Datapath Processing, Broadcast Video Processing Engines, Military / Aerospace Signal Processing, Storage Area Network (SAN) Controllers, ASIC Prototyping Platforms.
High-Speed Serial Interface Bridging
The EP1SGX25FF1020I6N's hardened Stratix GX multi-gigabit transceivers (MGTs) support serial rates from 622 Mbps up to 3.125 Gbps per channel, making it ideal for bridging protocols such as PCI Express Gen1 (2.5 Gbps), XAUI (3.125 Gbps), Serial RapidIO, and Gigabit Ethernet. The 25,660 logic elements provide ample datapath processing to implement MAC, PCS, and protocol state machines alongside the physical layer. With 607 user I/O and multiple I/O banks, the FPGA can simultaneously drive multiple parallel interfaces (LVDS, LVTTL) while the MGTs handle serial links.
추천
Telecom Line-Card Datapath Processing
The EP1SGX25FF1020I6N delivers 25K logic elements and 1.86 Mbit of TriMatrix embedded RAM, supporting telecom line-card functions such as packet classification, traffic shaping, and QoS scheduling. Its industrial temperature range (-40 °C to +100 °C) enables deployment in outdoor and uncontrolled thermal environments typical of central-office racks. The DSP multiplier blocks (up to 224 18×18-bit multipliers) accelerate FEC, encryption, and DSP front-end processing for wireless base stations.
추천
Broadcast Video Processing Engines
With 607 user I/O and substantial embedded RAM, the EP1SGX25FF1020I6N excels in broadcast video processing where multiple parallel video streams (SDI, DVB-ASI, HDMI) must be muxed, scaled, and processed in real time. The TriMatrix block RAM supports line buffers and frame buffers for video format conversion, while the DSP blocks accelerate chroma keying, scaling filters, and deinterlacing. The 1.5 V core and 1020-FBGA package are typical of high-end video-processing boards.
추천
Military / Aerospace Signal Processing
The industrial temperature grade of the EP1SGX25FF1020I6N (-40 °C to +100 °C) and Altera's heritage in defense/aerospace programs make this FPGA suitable for radar signal processing, electronic warfare subsystems, and avionics datalinks. Its hardened transceivers support ruggedized serial datalinks while the 25K logic capacity handles beamforming, FFT preprocessing, and I/Q demodulation. Conformal coating and BGA under-fill are recommended for shock/vibration environments.
추천
Storage Area Network (SAN) Controllers
The EP1SGX25FF1020I6N's embedded multi-gigabit transceivers combined with 25K logic elements provide the foundation for Fibre Channel and SAS/SATA storage controllers. The device's protocol-rich I/O can simultaneously drive 4 Gbps Fibre Channel links, multiple SATA ports, and management interfaces. Its embedded RAM supports command queuing, scatter-gather DMA descriptors, and parity-check buffering at line-rate.
추천
ASIC Prototyping Platforms
Engineers use the EP1SGX25FF1020I6N on ASIC prototyping platforms because its 25K logic elements, hard transceivers, and high I/O count closely emulate complex ASIC designs before tape-out. Multiple FPGAs can be bridged via the MGTs to partition large ASIC designs across chips. Quartus II's incremental compilation and LogicLock regions enable ASIC-style design partitioning, accelerating prototype bring-up and pre-silicon software development.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX25FF1020I6N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX25FF1020I5N | EP1SGX25FF1020I7N | EP1SGX25FF1020C6N | EP1SGX25DF1020I6N |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1020-FBGA (33x33) | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same |
| Logic Elements | 25,660 | 25,660 - same die | 25,660 - same die | 25,660 - same die | 25,660 - same die |
| Speed Grade | 6 | 5 (slower) | 7 (faster) | 6 | 6 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Commercial (0C to +85C) | Industrial |
| User I/O Count | 607 | 607 | 607 | 607 | 607 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Embedded Transceivers | Yes (Stratix GX MGTs) | Yes (same) | Yes (same) | Yes (same) | Yes (same) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Speed grade 6 offers balanced timing margin for industrial applications (vs EP1SGX25FF1020I5N)
- Industrial temperature grade supports -40C to +100C operation (vs EP1SGX25FF1020C6N)
- FF variant designation with hardened Stratix GX transceivers (vs EP1SGX25DF1020I6N)
설계 노트
The EP1SGX25FF1020I6N requires multiple independent supply rails: VCCINT (1.425-1.575 V core), VCCIO (per-bank, 1.2 V to 3.3 V), VCCA_PLL (1.5 V analog, filtered), and VCCAUX (2.5 V or 3.3 V auxiliary). Implement a controlled power-on sequence (VCCINT first, then VCCIO, then VCCAUX) using a sequencing controller such as the LTC2923 or TI UCD90124 to prevent latch-up. Bulk decoupling of 22 µF polymer + 1 µF ceramic + 0.1 µF ceramic per supply pin is recommended.
The industrial-grade EP1SGX25FF1020I6N is rated for case temperatures up to +100 °C. At 25K LE utilization with active MGTs, typical junction-to-ambient thermal resistance θJA for the 1020-FBGA package on a JEDEC 4-layer test board is approximately 12-15 °C/W. Estimated: at 5 W total power dissipation, junction temperature rise above ambient is 60-75 °C, leaving 25-40 °C margin at 100 °C case. For sealed enclosures, derate by 30% or add a heatsink with thermal interface material.
The 1020-FBGA 33×33 mm package uses 1.0 mm pitch solder balls. PCB design must follow JEDEC MS-034 for flip-chip BGA land pattern and solder mask defined (SMD) pads are recommended over non-solder mask defined (NSMD) for higher assembly yield. Use microvia-in-pad technology (0.1 mm laser vias) under center balls for breakout routing. Maintain differential pair length matching within 5 mils for MGT serial links and route each differential pair on a single layer with reference ground planes on adjacent layers.
Do not use the JTAG pins (TCK, TMS, TDI, TDO) as general-purpose I/O after configuration - they revert to JTAG mode whenever nCONFIG goes low, causing in-system reprogramming issues. Do not apply 3.3 V to a 2.5 V or 1.8 V VCCIO bank without level-shifting buffers. Verify all I/O bank voltages before connecting peripheral devices, and never mix 5 V tolerant and non-5 V tolerant I/O standards on the same bank.
Isolate MGT transceiver analog power and grounds from digital I/O regions using a split-plane or guarded layout. Place MGT decoupling capacitors as close to their respective VCCMGT and GND pins as possible (≤100 mils). For 3.125 Gbps signals, maintain 50 Ω single-ended or 100 Ω differential controlled impedance with 6-8 mil trace width on standard FR-4 stack-ups, and avoid 90-degree bends - use 45-degree or curved traces only.
규정 준수 정보
RoHS/REACH compliance not confirmed from the provided search snippets; refer to original Altera product declaration. The device is industrial temperature grade but not AEC-Q100 qualified (FPGA, not a discrete automotive IC).