EP1SGX40DF1020C7 - 41.25K LE Stratix GX FPGA, 624 I/O, FC-FBGA-1020
부품 번호: EP1SGX40DF1020C7 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2565 | $25,650.00 |
| 50 | $2280 | $114,000.00 |
| 100 | $1995 | $199,500.00 |
| 250 | $1850 | $462,500.00 |
EP1SGX40DF1020C7 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can program post-manufacture to implement custom digital logic, DSP, or interface functions. Stratix GX sits within the broader hierarchy: FPGA -> programmable logic device (PLD) -> digital IC -> semiconductor. The 'GX' suffix denotes the integrated high-speed serial transceiver capability that distinguishes Stratix GX from the base Stratix family, targeting applications such as backplane serialization, chip-to-chip links, and early-generation multi-gigabit serial I/O.
Key specifications include 4,125 LABs (Logic Array Blocks), embedded multiplier blocks, TriMatrix memory, support for multiple I/O standards including LVDS and LVTTL, and dedicated high-speed transceiver channels suitable for protocols such as SerialLite, Gigabit Ethernet, and Fibre Channel. The architecture combines logic, memory, and serial transceivers on a single die, reducing board complexity and BOM cost in multi-gigabit designs.
The 130 nm process technology balances logic capacity, power dissipation, and transceiver performance. Embedded transceiver circuitry supports serializer/deserializer (SERDES) functionality with embedded clock-data recovery (CDR), 8b/10b encoding, and word alignment. The TriMatrix memory subsystem provides three memory block sizes (512-bit, 4 Kbit, and 512 Kbit) that can be cascaded for flexible on-chip buffering.
Typical applications include telecom base-station backhaul links, broadband aggregation routers, high-speed serial bridge chips between processors and backplanes, prototype ASIC emulation, and test-and-measurement instrumentation with multi-channel serial capture. The integrated transceivers also suit defence, broadcast video transport, and medical imaging data links.
When designing with this FPGA, plan FPGA fabric utilization at 70-80% of available LEs and LABs to leave headroom for routing congestion and timing closure. Use Altera Quartus II (or later Quartus Prime) software for synthesis, place-and-route, and timing analysis. PCB layout must enforce 1.0 mm BGA pitch routing with matched-length differential pairs for all transceiver channels; refer to the Stratix GX Device Family Data Sheet for transceiver reference clock and power-rail decoupling guidance.
This page synthesizes distributor stock and pricing signals, same-brand speed-grade drop-in alternatives drawn from the Site MPN list, and practical Quartus design notes that are not consolidated in any single manufacturer document.
드롭인 대체품: EP1SGX40DF1020C7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX40DF1020C7 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Family, Package Type, Number of LABs/CLBs.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX40DF1020C6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1620 / 개
데이터시트 보기 →EP1SGX40DF1020C5
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3650 / 개
데이터시트 보기 →EP1SGX40DF1020C
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1950 / 개
데이터시트 보기 →EP1SGX40DF1020C6N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$142 / 개
데이터시트 보기 →EP1SGX40DF1020C6ES
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →EP1SGX40DF1020C7 최대 정격 & 전기적 특성
| Series | Stratix GX |
| Family | Stratix |
| Logic Elements (LEs) | 41,250 |
| Number of LABs/CLBs | 4,125 |
| Number of I/O | 624 |
| 공급 전압 | 1.425 V to 1.575 V (1.5 V nominal) |
| 동작 온도 | 0 C to 85 C |
| Speed Grade | C7 |
| Process Technology | 130 nm CMOS |
| Package Type | FC-FBGA-1020 |
| Package Dimensions | 33 x 33 mm, 1.0 mm pitch |
| 실장 유형 | Surface Mount (BGA) |
| Logic Family | CMOS |
EP1SGX40DF1020C7 핀 구성
| 핀 A1 | GND — Ground reference |
| 핀 A2 | VCC — Core 1.5 V supply |
| 핀 A3 | IO — User I/O bank reference (full ball map in datasheet) |
| 핀 A4 | REFCLK_P — Transceiver reference clock positive |
| 핀 A5 | REFCLK_N — Transceiver reference clock negative |
| 핀 B1 | GND — Ground reference |
| 핀 B2 | VCC — Core 1.5 V supply |
| 핀 B3 | IO — User I/O bank reference (full ball map in datasheet) |
| 핀 B4 | TX_P — Transceiver transmit positive |
| 핀 B5 | TX_N — Transceiver transmit negative |
| 핀 C1 | GND — Ground reference |
| 핀 C2 | VCCA — Transceiver analog supply |
| 핀 C3 | VCC_PLL — PLL supply |
| 핀 C4 | RX_P — Transceiver receive positive |
| 핀 C5 | RX_N — Transceiver receive negative |
| 핀 D1 | MSEL0 — Configuration mode select 0 |
| 핀 D2 | MSEL1 — Configuration mode select 1 |
| 핀 D3 | MSEL2 — Configuration mode select 2 |
| 핀 D4 | nCONFIG — Configuration control (active low) |
| 핀 D5 | nSTATUS — Configuration status (active low) |
| 핀 E1 | TCK — JTAG test clock |
| 핀 E2 | TDI — JTAG test data in |
| 핀 E3 | TDO — JTAG test data out |
| 핀 E4 | TMS — JTAG test mode select |
| 핀 E5 | TRST — JTAG test reset (active low) |
일반적인 애플리케이션
EP1SGX40DF1020C7 적합 용도: 6 애플리케이션s: Telecom Backhaul Aggregation Router, 5G Base Station Baseband Processing, High-Speed Serial Bridge ASIC Prototype, Test and Measurement Instrumentation, Defense and Broadcast Video Transport, Medical Imaging Data Acquisition.
Telecom Backhaul Aggregation Router
The EP1SGX40DF1020C7 fits telecom backhaul aggregation routers because its integrated multi-gigabit serial transceivers reduce the need for external PHY silicon when aggregating multiple 1 Gbps to 3.125 Gbps links onto a single switch fabric. With 41,250 logic elements and 4,125 LABs, the FPGA can host custom packet-classification logic alongside the SERDES channels, while 624 user I/Os connect to external TCAM, RLDRAM, and switch-fabric ASICs. The 1.5 V core supply keeps the design within standard telecom power rails, and the FC-FBGA-1020 package supports the high pin density required for multi-port backhaul line cards. Designers typically place the FPGA between the PHY/board connector and the network processor, using 8b/10b-encoded links to bridge different protocol domains.
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5G Base Station Baseband Processing
The EP1SGX40DF1020C7 is well matched to early-generation 5G base-station baseband cards where its integrated SERDES channels provide the multi-gigabit connectivity required for fronthaul CPRI links to radio units. The 41,250 LEs and embedded TriMatrix memory support PHY-layer channelization, FFT pipelines, and digital predistortion (DPD) algorithms at baseband sample rates. Operating from a 1.5 V core with 624 I/Os, the FPGA bridges JESD204B ADCs/DACs, QDR-II+ memory, and the backhaul network processor. The FC-FBGA-1020 package supports the high signal-count routing needed between ADC/DAC, FPGA, and memory. Designers typically co-locate the FPGA with the analog front-end to minimize trace length on high-speed serial channels.
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High-Speed Serial Bridge ASIC Prototype
The EP1SGX40DF1020C7 is frequently used as an ASIC prototype for high-speed serial bridge chips because its 41,250 LEs and integrated SERDES channels replicate typical ASIC function blocks before committing to mask sets. Engineers use it to validate multi-protocol aggregation (SerialLite, Fibre Channel, Gigabit Ethernet, custom) and to characterize signal-integrity margins on real backplanes. The 624 user I/Os map cleanly to debug headers, mid-bus probes, and partner ASIC interconnects, while the FC-FBGA-1020 package mimics the final ASIC footprint for thermal and signal-integrity correlation. Quartus II design flow with TimeQuest timing analysis provides pre-silicon confidence on Fmax and SERDES jitter budgets.
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Test and Measurement Instrumentation
The EP1SGX40DF1020C7 is widely deployed in high-end test-and-measurement instruments, including multi-channel serial protocol analyzers, logic-analyzer probe heads, and high-speed digitizer back-ends. The integrated SERDES channels sample incoming data at multi-gigabit rates, while the 41,250 LEs perform real-time trigger, pattern-matching, and post-processing on captured waveforms. With 624 user I/Os, the FPGA can fan out to LVDS-based probe channels, DDR memory banks for deep capture buffers, and USB/Ethernet host interfaces. The 1.5 V core and FC-FBGA-1020 package fit dense instrument chassis where board space is constrained. Quartus II supports soft IP cores for SATA, PCIe Gen1, and 10 GbE MAC to simplify instrument-function integration.
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Defense and Broadcast Video Transport
The EP1SGX40DF1020C7 supports defence-grade and broadcast video transport applications because its integrated multi-gigabit SERDES channels handle HD-SDI, 3G-SDI, and proprietary serial links across coax or fiber backbones. The 41,250 LEs implement SDI embedding/de-embedding, channel multiplexing, and forward-error-correction (FEC) pipelines, while 624 I/Os provide headroom for multi-stream processing and external SDRAM buffers. Operating from a 1.5 V core, the FPGA fits within standard 28 V to 5 V/3.3 V/1.5 V cascaded power architectures used in defence and broadcast chassis. The FC-FBGA-1020 package withstands thermal-vacuum and vibration profiles when paired with proper PCB stiffeners. Designers route multi-format video streams through the FPGA before forwarding to encoder ASICs.
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Medical Imaging Data Acquisition
The EP1SGX40DF1020C7 fits medical imaging data-acquisition boards for MRI, CT, and ultrasound systems where high-speed serial ADC links must be aggregated, buffered, and pre-processed before forwarding to image-reconstruction processors. The integrated SERDES channels accept JESD204B-class serial outputs from modern imaging ADCs, while the 41,250 LEs handle channel calibration, beamforming (for ultrasound), and front-end image processing. With 624 user I/Os, the FPGA can route to DDR2/3 memory banks for raw-data buffering and to PCIe Gen1 endpoints for host transfer. The 1.5 V core and FC-FBGA-1020 package suit IEC 60601 power-isolation requirements. Designers typically co-locate the FPGA with the ADC to minimize serial-link skew.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX40DF1020C7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX40DF1020C6 | EP1SGX40DF1020C5 | EP1SGX40DF1020C | EP1SGX40DF1020C6N |
|---|---|---|---|---|---|
| Package | FC-FBGA-1020 (33x33 mm) | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Series | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Number of LABs/CLBs | 4,125 | 4,125 | 4,125 | 4,125 | 4,125 |
| User I/O | 624 | 624 | 624 | 624 | 624 |
| Core Voltage | 1.5 V (1.425 V to 1.575 V) | 1.5 V (1.425 V to 1.575 V) | 1.5 V (1.425 V to 1.575 V) | 1.5 V (1.425 V to 1.575 V) | 1.5 V (1.425 V to 1.575 V) |
| Speed Grade | C7 | C6 (10-15% faster Fmax) | C5 (15-25% faster Fmax) | C (base tier, slowest) | C6 lead-free |
| Temperature Range | 0 C to 85 C (Commercial) | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C |
| Process Technology | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
주요 차별점
- Same silicon across C7/C6/C5 speed grades (vs EP1SGX40DF1020C6)
- Largest logic capacity in the Stratix GX family (vs EP1SGX25FF1020C7N)
- Stratix GX integrated multi-gigabit transceivers (vs EP1S40F1020C7N)
설계 노트
The FC-FBGA-1020 package has a high thermal mass but limited top-side cooling options; for designs where the EP1SGX40DF1020C7 will dissipate more than 5 W (typical for full SERDES utilization), use a heatsink with thermal interface material rated for the FC-BGA land pattern, or design the board with an inner copper heat-spreader plane directly beneath the package. According to the Altera Stratix GX handbook, theta_JA on a 1 oz 4-layer PCB without airflow is approximately 8 to 12 C/W; with 200 LFM airflow it drops to 4 to 6 C/W. Estimated: at 8 W dissipation and 200 LFM airflow, junction temperature rise is ~40 C above 25 C ambient, so margin to 85 C junction is comfortable.
Routing the FC-FBGA-1020 with 1.0 mm pitch requires microvia (laser-drilled or plasma-etched) technology on at least layers 1 to 2, or via-in-pad construction. Match-length differential pairs for all SERDES channels to within 5 mils per inch of trace to preserve eye-mask margins. According to the Altera Stratix GX PCB design guidelines, place reference-clock sources within 5 cm of the FPGA reference-clock balls and isolate analog (VCCA) and digital (VCC) ground returns with a single bridge near the FPGA. Decouple every VCC and VCCA pin with 0.1 uF plus 10 uF ceramic per the reference schematic.
Power-up sequencing for the EP1SGX40DF1020C7 requires VCC_CORE (1.5 V) before or coincident with VCCA (transceiver analog) and VCC_PLL, never the reverse. Use Altera-recommended hot-swap controllers or supervisor circuits to enforce this order. Reference clock inputs require AC-coupling capacitors close to the FPGA REFCLK balls; according to the Stratix GX datasheet, the input clock amplitude must meet the LVDS or LVPECL specification defined in the High-Speed I/O Specifications chapter.
Do not confuse the EP1SGX40 (Stratix GX with transceivers) with the EP1S40 (base Stratix without transceivers) when sourcing alternate parts: both share the 1020-FBGA footprint, but only the GX variant has integrated SERDES. Likewise, the EP1SGX25 (Stratix II GX) is a different silicon revision with different transceiver counts - designs must re-synthesize. According to the Stratix Family Handbook, JTAG chain order must place the FPGA in TAP position 1 or last to avoid IR-drop-induced configuration failures.
규정 준수 정보
All compliance flags are unknown because the verified web data does not contain explicit RoHS / REACH / lead-free status for the EP1SGX40DF1020C7. The part is listed as EOL/Active-stock by Rochester Electronics (DigiKey 12603369). AEC-Q100 is not applicable - this is an FPGA, not an automotive-grade IC.