EP1SGX10DF672C7N - 10,570-Lane FPGA | Intel | High-Speed Systems
부품 번호: EP1SGX10DF672C7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP1SGX10DF672C7N 개요
An FPGA is a programmable logic device containing configurable logic, routing, memory, and I/O resources that can implement digital circuits after manufacturing. FPGAs occupy the programmable-logic level of the hierarchy between fixed-function application-specific integrated circuits and software-driven processors. Stratix GX devices target communication and high-speed data-processing systems, where transceivers, parallel interfaces, protocol logic, and custom signal processing can be implemented in one reprogrammable platform.
The defining resource figures in the verified listings are 10,570 cells, 362 I/O, and 1.5 V operation. The device is built on 130 nm technology, and a 4,385.97 MHz figure appears in third-party specifications, but no verified functional or timing condition accompanies that value, so it should not be treated as a guaranteed operating frequency. The component is a CMOS FPGA and uses surface-mount BGA assembly. Its commercial operating-temperature range is listed as 0 C to 85 C.
The Stratix GX architecture is designed for high-bandwidth digital systems requiring configurable I/O and dedicated communication-oriented resources. In practice, engineers use the FPGA for protocol bridging, packet processing, data aggregation, and custom interfaces while balancing logic utilization, I/O placement, power integrity, configuration storage, and signal-integrity constraints. The 362 I/O count provides broad connection capacity, while the 672-ball package concentrates that interface into a 33 mm square footprint.
Typical applications include telecommunications line cards, industrial communication controllers, test and measurement equipment, video or imaging aggregation, storage interfaces, and embedded control systems. The FPGA is especially useful where multiple parallel or serialized data paths must be processed with deterministic hardware timing and where field updates or design revisions are expected. Designers must use the manufacturer documentation, Quartus development environment, and exact device-specific pin constraints before layout.
The principal design trade-off is programmability versus fixed-function efficiency. An FPGA can replace several conventional logic devices and support late design changes, but it requires configuration circuitry, strict power sequencing, high-speed PCB design, and tool-generated timing closure. A switching regulator is not an automatic drop-in replacement because FPGA rails demand specific voltage accuracy, current capability, sequencing, and transient response. Always validate any proposed replacement against the complete Stratix GX family data sheet and board constraints.
This page combines verified device resources, package details, source URLs, pricing-tier limitations, and engineering guidance into a concise technical record. Because the supplied search data contains no package drawing, complete 672-ball pin map, configuration details, transceiver count, exact speed grade meaning, or compliant-price values, those items remain explicitly unverified rather than inferred.
드롭인 대체품: EP1SGX10DF672C7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX10DF672C7N (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, RoHS Status, Mounting Type, Total RAM Bits.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX10DF672C7
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$98.5 / 개
데이터시트 보기 →EP1SGX10DF672C6N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$195 / 개
데이터시트 보기 →EP1SGX10DF672C5N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$192 / 개
데이터시트 보기 →EP1SGX10DF672I6N
✅ 드롭인✓ 재고 있음
$85.2 / 개
데이터시트 보기 →EP1SGX10DF672C7N 최대 정격 & 전기적 특성
| Product Type | Field Programmable Gate Array (FPGA) |
| Device Family | Stratix GX |
| Logic Cells | 10,570 cells |
| User I/O | 362 I/O |
| Logic Family | CMOS |
| Process Technology | 130 nm |
| 공급 전압 | 1.5 V |
| 패키지 | 672-Ball FC-FBGA |
| Alternative Package Description | FBGA-1020 |
| Package Body | 33 mm x 33 mm |
| Ball Pitch | 1 mm |
| Listed Frequency Figure | 4,385.97 MHz |
| 동작 온도 | 0 C to 85 C |
| 실장 유형 | Surface Mount |
| DigiKey Product Category | FPGAs (Field Programmable Gate Array) |
| RoHS 상태 | unknown |
| REACH Status | unknown |
| AEC-Q100 Status | not_applicable |
EP1SGX10DF672C7N 33 mm x 33 mm 핀 구성 가이드
EP1SGX10DF672C7N(33 mm x 33 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX10DF672C7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX10DF672C7N 적합 용도: 6 애플리케이션s: Telecommunications Line Cards, Industrial Communication Controllers, Test and Measurement Equipment, Video and Imaging Aggregation, Storage Data-Path Controllers, Embedded Protocol Bridge.
Telecommunications Line Cards
EP1SGX10DF672C7N fits telecommunications line cards that need programmable protocol handling, data framing, and multiple external interfaces. Its 10,570 logic cells provide capacity for custom state machines, packet inspection, timing recovery support logic, and interface adaptation, while the listed 362 I/O can connect parallel control, status, memory, and transport signals. The Stratix GX family is intended for communication-oriented designs, making the device more relevant than a general-purpose CPLD when several functions must coexist. Engineers can place clock-domain crossing, buffers, and protocol-specific logic in one programmable device. Before layout, confirm the exact pin assignments, available I/O banks, high-speed lane resources, power rails, and supported configuration method from the family documentation; the supplied data does not provide a transceiver count or guaranteed line rate.
추천
Industrial Communication Controllers
EP1SGX10DF672C7N suits industrial controllers that combine deterministic hardware logic with several fieldbus, Ethernet-adjacent, or proprietary interfaces. The 10,570-cell resource level can implement real-time scheduling, protocol conversion, filtering, error detection, and control logic without relying entirely on processor software. Its 362 listed I/O help aggregate sensor inputs, actuator controls, status signals, and external memory or bridge devices, while programmability allows late interface changes during commissioning. A 1.5 V core supply is identified, but complete power domains and sequencing are unavailable here. Validate the 0 C to 85 C rating against the enclosure, conduction cooling, and measured board temperature. The BGA package also requires controlled impedance, escape routing, clean power, and manufacturer-approved thermal design.
추천
Test and Measurement Equipment
EP1SGX10DF672C7N can serve in test systems that acquire, generate, correlate, and route high-speed digital data. The 10,570 logic cells are appropriate for trigger logic, channel aggregation, data reduction, pattern generation, time stamping, and custom instrument interfaces, while 362 listed I/O support parallel ADCs, DACs, memory devices, and control ports. Reprogrammability allows the same hardware platform to support multiple test modes or product revisions, shortening redesign cycles. However, the supplied 4,385.97 MHz catalog figure is not supported by timing conditions and must not be used as a guaranteed sampling or clock rate. Use the exact speed-grade timing model and tool-generated reports. The 672-ball FC-FBGA package also demands careful power integrity, low-noise references, matched clock distribution, and measurement of signal margins at temperature.
추천
Video and Imaging Aggregation
EP1SGX10DF672C7N is a candidate for video routers, frame grabbers, and imaging systems that merge parallel sensor data with control and memory traffic. Its 10,570 logic cells can handle timing generation, synchronization, cropping, buffering control, region-of-interest processing, and interface conversion, while 362 I/O provide substantial connection capacity for image sensors, serializers, DDR-style memory interfaces, and host processors. FPGA parallelism can reduce latency compared with a software-only implementation, particularly when pixels or packets arrive continuously. Designers should budget logic for synchronization FIFOs and clock-domain isolation, and should verify I/O-bank support because BGA banks may restrict voltage standards. The 1 mm pitch and 33 mm package body simplify package planning but require a multilayer PCB, via escape review, decoupling analysis, and signal-integrity simulation for high-speed edges.
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Storage Data-Path Controllers
EP1SGX10DF672C7N can implement custom storage controllers, protocol bridges, redundancy managers, and real-time data-path monitoring. The 10,570-cell capacity allows simultaneous handling of queues, CRC logic, scrambling, command translation, error recovery, and host interfaces, while the 362-I/O listing can support multiple memory banks, control paths, and high-speed parallel links. Its reprogrammable architecture is valuable when evolving standards or customer-specific features would otherwise require an ASIC redesign. A switching converter cannot replace the FPGA; each required rail must satisfy the exact device voltage, current, ripple, sequencing, and transient requirements, none of which are fully listed in the supplied data. Validate I/O termination, bus timing, clock-domain crossing, and read/write margins with the selected memory or storage interface before release.
추천
Embedded Protocol Bridge
EP1SGX10DF672C7N fits an embedded protocol bridge when a system must translate streams between processors, peripheral controllers, legacy buses, and high-speed links. The 10,570 logic cells support FIFOs, rate matching, packetization, address decoding, error checking, and protocol state machines, while 362 I/O leave room for multiple masters, slaves, clocks, and service interfaces. A single FPGA can replace several fixed-function bridge devices and adapt when endpoint requirements change. The commercial 0 C to 85 C listing must be checked against the target product's ambient and self-heating conditions. Use the exact pin planner to reserve configuration, clock, power, and debug signals before assigning I/O. Validate throughput from the implemented design rather than the unqualified 4,385.97 MHz catalog field, and confirm configuration image compatibility in the legacy Quartus tool flow.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX10DF672C7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX10DF672C7 | EP1SGX10DF672C6N | EP1SGX10DF672C5N | EP1SGX10DF672I6N |
|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Altera |
| Package | 672-Ball FC-FBGA | 672-Ball FC-FBGA | 672-Ball FC-FBGA | 672-Ball FC-FBGA | FBGA-672 |
| Device Family | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX |
| Ordering Grade | C7N | C7 | C6N | C5N | I6N |
| Cross-Reference Evidence | Target device | Same-family candidate; detailed comparison unavailable | Same-family candidate; detailed comparison unavailable | Same-family candidate; detailed comparison unavailable | Package and terminals stated consistent by web result |
주요 차별점
- Higher listed I/O resource than the verified replacement candidate (vs EP1SGX10DF672I6N)
- C7N ordering designation within the target family (vs EP1SGX10DF672C6N)
- Commercial 0 C to 85 C operating listing (vs EP1SGX10DF672I6N)
설계 노트
Treat the listed 1.5 V value only as the confirmed nominal supply; the supplied data does not identify additional FPGA rail domains, tolerances, currents, ramp rates, or sequencing. Before schematic release, create a rail table from the exact Stratix GX family handbook, including core, I/O, auxiliary, and any transceiver supplies. Select regulators for worst-case transient load, not average utilization, and keep high-frequency ceramic decoupling adjacent to the package with bulk capacitance placed for effective current return. Validate power-up and power-down sequencing on hardware, because an out-of-sequence rail can cause configuration failure, I/O contention, or long-term reliability concerns.
Use 0 C to 85 C only as the listed ambient operating range, not as a substitute for a junction-temperature calculation. No thermal resistance, maximum junction temperature, or power-consumption data appears in the supplied sources. Estimate or simulate total dissipation from utilization, clock rate, toggle activity, I/O loading, and configuration, then compare it with the manufacturer package model and board copper. Measure temperatures on populated prototypes at maximum workload and airflow. For a 33 mm by 33 mm BGA, spreading copper, thermal vias, chassis conduction paths, and nearby heat sources can materially change the result; qualify the complete assembly rather than the FPGA alone.
Route the 672-ball FC-FBGA as a controlled-impedance multilayer design with continuous reference planes and a verified via-escape plan. Place decoupling capacitors as close as physically possible to their associated power balls and minimize shared inductance between regulator, capacitor, and package. Follow the exact package drawing for ball orientation and keep high-speed lanes away from clock, power-entry, and board-edge discontinuities. Assign signal pins only through the exact device and package in Quartus, then review simultaneous-switching noise, I/O-bank voltage compatibility, differential-pair geometry, and return-path continuity. A generic FBGA footprint or pinout from another speed grade must not be used.
Do not interpret the 4,385.97 MHz catalog figure as a guaranteed operating frequency because the supplied data provides no condition, timing grade, or measurement definition. Do not infer a 672-ball pinout from a 672-pin label, and do not assume FBGA-1020 means 1,020 external signals; the verified comparison shows that package nomenclature varies by source. Similarly, a matching FC-FBGA package does not prove compatible rails, I/O banks, configuration modes, timing, or firmware. Before substituting a C5, C6, C7, or I6 ordering code, compare the manufacturer ordering guide, exact pin map, speed-grade tables, temperature rating, and power requirements. Unverified package-only candidates are not production drop-ins.
규정 준수 정보
The verified web data does not provide RoHS, REACH, lead-free, halogen-free, or conflict-minerals statements. AEC-Q100 is treated as not applicable to this general-purpose FPGA because the supplied data contains no automotive qualification claim; this is not a compliance certification.
