EP2A70B724C7 - 3M-Gate APEX II FPGA | Intel | Embedded Logic
부품 번호: EP2A70B724C7 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
| 3,000 | $0 | $0.00 |
EP2A70B724C7 개요
An FPGA is a programmable logic device whose configurable logic elements, routing, and I/O resources implement digital circuits after manufacturing. Unlike a fixed-function application-specific integrated circuit, the FPGA can be configured and reconfigured for different functions. The APEX II family targets high-density programmable logic, and EP2A70B724C7 combines a large logic-cell count with high I/O availability. Its package is identified in the verified data as 724-pin FCBGA, also described as 724-BBGA and PBGA724, with 35 mm by 35 mm body dimensions and 1.27 mm pitch in one source.
The principal features are the 3M-gate APEX II architecture, 67,200 logic cells, 540 I/O, 1.5 V operation, and 420 MHz maximum frequency reported in the search data. The 0.15 µm all-layer copper-metal process is reported in the APEX II family result, which also references up to eight metal layers. True-LVDS, LVPECL, PCML, and HyperTransport interface capabilities are described in the family-level source. These characteristics make the device relevant to high-density, multi-interface equipment, although the verified text does not establish a single universal speed grade or all interface ratings for this exact ordering code.
The reported 2.17 ns loadable-PLD figure and 420 MHz frequency should be interpreted as device-family or listing data rather than independently confirmed timing specifications for every configuration. A design must account for the selected device grade, process corner, voltage, temperature, routing, I/O standard, and implementation constraints. The part is therefore best treated as a high-density configurable platform whose practical throughput depends on the synthesized logic and the surrounding PCB environment.
Typical uses include industrial control and automation, communications equipment, high-speed interface aggregation, test and measurement systems, and legacy digital-system replacement. The 540 I/O count supports systems with many parallel or serialized external connections, while the 67,200-cell capacity suits substantial datapath, protocol, and control integration. Buyers should confirm the exact package drawing, ball map, configuration interface, speed grade, and available inventory before release to production.
The main design trade-off is density versus verification effort. A 724-ball BGA requires controlled fan-out, power distribution, decoupling, and signal-integrity review, while the large logic capacity can reduce the number of support devices in a system. This page provides a traceable starting point for EP2A70B724C7 sourcing and comparison, but the manufacturer datasheet and current distributor records remain the controlling documents for design approval.
드롭인 대체품: EP2A70B724C7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2A70B724C7 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Speed Grade, Logic Elements, System Gates.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청EP2A70B724C7 최대 정격 & 전기적 특성
| Device Type | FPGA (Field Programmable Gate Array) |
| Family | APEX II |
| Gate Count | 3,000,000 gates |
| Logic Cells | 67,200 cells |
| I/O Count | 540 I/O |
| 공급 전압 | 1.5 V |
| Maximum Frequency | 420 MHz |
| Fabrication Process | 0.15 µm |
| Loadable PLD Timing | 2.17 ns |
| Technology | CMOS |
| 패키지 | 724-pin FCBGA, 724-BBGA, or PBGA724 |
| Package Body Size | 35 mm x 35 mm |
| Package Pitch | 1.27 mm |
| Interface Capabilities | True-LVDS, LVPECL, PCML, and HyperTransport |
| RoHS 상태 | unknown |
| REACH Status | unknown |
| AEC-Q100 Status | unknown |
| Lead-Free Status | unknown |
EP2A70B724C7 1.27 mm 핀 구성 가이드
EP2A70B724C7(1.27 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2A70B724C7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2A70B724C7 적합 용도: 6 애플리케이션s: Industrial Automation Controllers, Communications Interface Aggregation, High-Speed Test and Measurement, Legacy Digital-System Replacement, Medical Monitoring Equipment, Aerospace and Defense Digital Processing.
Industrial Automation Controllers
EP2A70B724C7 is suitable for industrial automation controllers that need substantial configurable logic and a large external interface count. Its listed 67,200 logic cells, 3,000,000 gates, and 540 I/O can support protocol conversion, deterministic control sequencing, sensor aggregation, and parallel machine-control interfaces. The 1.5 V core supply and 724-pin FCBGA footprint make it most practical where the PCB already follows the APEX II package. Designers should verify I/O-bank voltage ranges, termination, timing, and the configuration interface because the supplied data does not provide those implementation details.
추천
Communications Interface Aggregation
EP2A70B724C7 can be considered for communications equipment that aggregates multiple high-speed or parallel interfaces into programmable digital processing. The APEX II family listing references True-LVDS, LVPECL, PCML, and HyperTransport, while the 540-I/O device listing provides capacity for many external connections. Its reported 420 MHz frequency is a useful starting point for architecture analysis, but actual throughput depends on placement, routing, I/O standards, and the selected speed grade. Confirm channel counts, differential electrical limits, clocking, and power integrity before assigning the FPGA to a line-rate design.
추천
High-Speed Test and Measurement
In test and measurement equipment, EP2A70B724C7 can provide configurable capture, formatting, triggering, and control logic while retaining a large 540-I/O interface. The listed 2.17 ns loadable-PLD timing and 420 MHz frequency support preliminary high-speed architecture discussions, but they are not sufficient to establish a production acquisition rate. The 724-BBGA package and 35 mm by 35 mm body size require careful fan-out, reference-plane planning, decoupling, and thermal analysis. Use the exact manufacturer timing model, I/O specification, and configuration documentation for the production design.
추천
Legacy Digital-System Replacement
EP2A70B724C7 is relevant to legacy-system replacement when an existing board already uses the 724-pin APEX II footprint and requires the listed high-density resources. Reusing the 3,000,000-gate architecture can preserve board-level integration, proprietary interfaces, and established firmware investment. It is not appropriate to select a replacement solely from a related APEX II name: the exact ball map, 1.5 V supply requirements, I/O configuration, timing grade, and configuration mechanism must be compared. For systems facing obsolescence, confirm lifecycle status, authorized inventory, and whether an exact same-code replacement is available.
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Medical Monitoring Equipment
EP2A70B724C7 may be used in medical monitoring equipment for configurable data routing, timing, and control functions, provided the final system meets applicable medical reliability, quality, and regulatory requirements. Its 67,200 logic cells and 540 I/O can help consolidate multiple digital functions and interface adapters. However, the verified data does not establish AEC-Q100, medical-grade qualification, safety certification, or a specific operating-temperature range. Those attributes must be confirmed with the manufacturer and the system compliance team; no compliance claim is inferred from the product type or its age.
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Aerospace and Defense Digital Processing
EP2A70B724C7 can support configurable digital processing in aerospace or defense systems where an existing APEX II 724-ball implementation and large logic capacity are required. The supplied results do not provide radiation-hardness, military temperature, export-control, or formal qualification information, so the part cannot be selected for those requirements from this data alone. Its 3,000,000 gates, 67,200 cells, and 540 I/O may be valuable for protocol adaptation, control, and signal processing. Perform the full package, timing, environmental, traceability, and counterfeit-risk review before deployment.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2A70B724C7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 |
|---|---|
| Brand | Intel / Altera |
| Package | 724-pin FCBGA / 724-BBGA |
| Gate Count | 3,000,000 gates |
| Logic Cells | 67,200 cells |
| I/O Count | 540 I/O |
| Supply Voltage | 1.5 V |
| Reported Maximum Frequency | 420 MHz |
| Process Technology | 0.15 µm |
| Loadable PLD Timing | 2.17 ns |
| Exact Drop-In Status | Target part |
주요 차별점
- Large 724-pin package and high I/O capacity (vs EP2A70B652C9)
- High listed APEX II logic capacity (vs EP2A25B724C7)
- Family-level high-speed interface support (vs EP2A40B724C7)
설계 노트
EP2A70B724C7 is listed with a 1.5 V supply and a 724-ball FCBGA/BGA package, but the supplied data does not provide the complete power budget, current consumption, power-up sequencing, or recommended decoupling network. Before layout, obtain the exact APEX II family power section and confirm supply tolerances, I/O-bank voltage requirements, inrush behavior, and sequencing. Use short, wide power paths, a continuous reference plane, and local decoupling at every applicable supply domain. Do not treat 1.5 V as the only system rail; the surrounding I/O, clock, configuration, and interface components may require additional voltages.
A 724-pin FCBGA or 724-BBGA requires controlled-impedance escape routing and careful ball-to-layer assignment. The verified results identify a 35 mm by 35 mm body and 1.27 mm pitch, but they do not provide a complete ball map, layer stack-up, escape geometry, or via recommendation. Confirm the manufacturer package drawing and PCB land pattern before schematic release. Plan the top-layer fan-out, reference continuity, stitching vias, and decoupling placement around the device, and simulate signal integrity for the selected I/O standards. Do not use a generic BGA footprint without checking the exact package and ball numbering.
The APEX II family listing references True-LVDS, LVPECL, PCML, and HyperTransport, making signal integrity and interface compliance central to deployment. The reported 1-Gbps capability and 420 MHz frequency are useful only as preliminary design targets; actual performance depends on I/O standard, termination, channel topology, voltage, speed grade, and board construction. Follow the manufacturer’s recommended termination and placement rules, control differential-pair symmetry, and validate clocks and high-speed lanes with measurements on prototypes. Confirm the exact I/O-bank restrictions and the permitted voltage combinations in the controlling datasheet.
Do not assume that a related APEX II MPN is a drop-in replacement for EP2A70B724C7. The supplied cross-reference results contain generic search tools but no verified substitute with an identical 724-ball pinout, 1.5 V requirements, 3,000,000-gate capacity, 67,200 logic cells, and 540 I/O. Check the exact ordering-code suffix, package drawing, ball map, speed grade, configuration interface, power pins, and firmware compatibility. Also verify the current lifecycle and distributor traceability before procurement. If a candidate requires a new footprint, it is a redesign-level alternative, not a drop-in replacement.
규정 준수 정보
The supplied verified data does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status.
