EP2AGX45DF29I3NAD - 42K LE Arria II GX FPGA 780-FBGA | Intel
부품 번호: EP2AGX45DF29I3NAD ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $412.5 | $412.50 |
| 10 | $386 | $3,860.00 |
| 100 | $352.75 | $35,275.00 |
| 500 | $318.4 | $159,200.00 |
| 1,000 | $285.1 | $285,100.00 |
EP2AGX45DF29I3NAD 개요
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows designers to configure arbitrary digital logic, memory blocks, and I/O after manufacturing. In the broader taxonomy, the Arria II GX sits between Intel's Cyclone (low-cost) and Stratix (high-performance) families, with integrated transceivers that compete against Xilinx Kintex and AMD Versal mid-range devices. The 780-FBGA package places this part firmly in the high-density, transceiver-rich tier of mid-range FPGAs.
Key features of the EP2AGX45DF29I3NAD include 42,959 logic elements (LEs), 1,805 Logic Array Blocks (LABs), 3,517,440 bits of embedded RAM, 364 user I/Os, and dedicated multi-gigabit transceivers. The device also integrates 156 (typical) 18x18 multipliers for DSP workloads and embedded PCIe hard IP blocks, enabling protocol bridging and high-speed serial interface implementation without consuming soft logic resources.
The Arria II GX architecture combines an 8-input adaptive logic module (ALM) fabric with embedded memory, multiplier blocks, and PLLs. The integrated transceivers operate from 600 Mbps to 6.375 Gbps, supporting protocols such as PCIe Gen1/Gen2, Serial RapidIO, XAUI, CEI-6G, CPRI, and OBSAI. This makes the family well suited to wireline backhaul, broadcast video, and high-end industrial imaging.
Typical applications include high-speed serial protocol bridging (PCIe to XAUI/10G Ethernet), wireless baseband and digital radio, broadcast and professional video processing, and test and measurement instrumentation. The combination of mid-range logic density and integrated multi-gigabit transceivers makes the EP2AGX45DF29I3NAD especially attractive for cost-sensitive designs that still need serial connectivity at line rates up to 6.375 Gbps.
When designing with this device, ensure the PCB supports the FBGA 780-ball land pattern with appropriate via-in-pad or microvia technology for reliable manufacturing. Multi-gigabit transceivers require strict impedance control and length matching; consult the Arria II GX Transceiver User Guide for eye-diagram, pre-emphasis, and equalization settings. Power estimation should be performed using the Intel PowerPlay early power estimator before board bring-up.
This page synthesizes distributor pricing, drop-in Arria II GX speed-grade and temperature-grade alternatives, and practical design considerations not consolidated in the manufacturer datasheet.
드롭인 대체품: EP2AGX45DF29I3NAD — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGX45DF29I3NAD (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Mounting Type, Process Technology, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGX45DF29I3N
✅ 드롭인✓ 재고 있음
$215 / 개
데이터시트 보기 →EP2AGX45DF29I3G
✅ 드롭인✓ 재고 있음
$690 / 개
데이터시트 보기 →EP2AGX45DF29C6N
✅ 드롭인✓ 재고 있음
$175 / 개
데이터시트 보기 →EP2AGX45DF29C6G
✅ 드롭인✓ 재고 있음
$121.75 / 개
데이터시트 보기 →EP2AGX45DF29C5N
✅ 드롭인✓ 재고 있음
$510 / 개
데이터시트 보기 →EP2AGX45DF29C4N
✅ 드롭인✓ 재고 있음
$335.45 / 개
데이터시트 보기 →EP2AGX45DF29I3NAD 최대 정격 & 전기적 특성
| Family | Arria II GX |
| Logic Elements | 42,959 |
| Logic Array Blocks (LABs) | 1,805 |
| Embedded RAM Bits | 3,517,440 |
| User I/Os | 364 |
| 패키지 | 780-ball FBGA (FineLine BGA) |
| Process Node | 40 nm |
| Transceivers | Multi-gigabit transceivers integrated |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps |
| Multipliers (18x18) | 156 (typical) |
| Speed Grade | I3 (industrial, -40C to +100C junction, fastest speed bin in the I grade) |
| Temperature Grade | Industrial (I) |
| 실장 유형 | Surface Mount |
EP2AGX45DF29I3NAD 780-ball fbga (fineline bga) 핀 구성 가이드
EP2AGX45DF29I3NAD(780-ball fbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGX45DF29I3NAD.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGX45DF29I3NAD 적합 용도: 6 애플리케이션s: Serial Protocol Bridging (PCIe to 10G Ethernet), Wireless Baseband and Digital Radio, Broadcast and Professional Video Processing, Test and Measurement Instrumentation, Industrial Imaging and Machine Vision, Wireline Backhaul and Fronthaul Equipment.
Serial Protocol Bridging (PCIe to 10G Ethernet)
The Intel EP2AGX45DF29I3NAD's integrated multi-gigabit transceivers running up to 6.375 Gbps and the embedded PCIe Gen1/Gen2 hard IP make it a strong fit for protocol bridging applications, where PCIe traffic from a host CPU must be converted to 10 Gigabit Ethernet, XAUI, or Serial RapidIO for line-card uplinks. The 42,959 logic elements comfortably absorb a soft 10G MAC plus bridging logic, while the 3.5 Mbit of embedded RAM handles packet buffering at line rate. A typical design uses one PCIe x4 hard IP block plus four 6.375 Gbps transceiver channels, all on the same 780-FBGA silicon without external PHY chips.
추천
Wireless Baseband and Digital Radio
The 156 embedded 18x18 multipliers, the 3.5 Mbit of on-chip RAM, and the 6.375 Gbps transceivers make the EP2AGX45DF29I3NAD well suited to wireless baseband processing and digital radio systems. Up- and down-conversion, channel filtering, and crest-factor reduction (CFR) and digital pre-distortion (DPD) functions all map efficiently onto the 8-input ALM fabric and DSP blocks, while the transceivers carry CPRI or OBSAI links to the radio unit. The industrial temperature grade (I3) supports outdoor small-cell and pico-cell deployments where ambient temperatures vary widely.
추천
Broadcast and Professional Video Processing
The EP2AGX45DF29I3NAD's 364 user I/Os and 3.5 Mbit of embedded memory support broadcast video processing pipelines, including 3G-SDI and HD-SDI receive/transmit, multi-stream video switching, and basic color-space conversion. The 6.375 Gbps transceivers can drive SDI at 3G rates or carry HDMI/DisplayPort aggregated streams. The 780-FBGA package with 364 I/Os is large enough to fan out to multiple parallel video ports plus an SDI de-serializer interface, making it a practical choice for mid-range production switchers, video routers, and broadcast monitoring equipment.
추천
Test and Measurement Instrumentation
The combination of high logic density, abundant transceivers, and industrial temperature grade makes the EP2AGX45DF29I3NAD useful in modular test and measurement instruments such as protocol analyzers, BERT (bit-error-rate tester) front ends, and mixed-signal data acquisition. The transceivers support custom serial protocols used in proprietary test interfaces, while the embedded RAM and multipliers handle real-time DSP on captured samples. Designers benefit from the Arria II GX's mature Quartus II toolchain and broad IP library, reducing development time for instrument prototypes.
추천
Industrial Imaging and Machine Vision
The EP2AGX45DF29I3NAD's 364 user I/Os and 3.5 Mbit of on-chip RAM suit high-throughput industrial imaging and machine vision systems, where parallel Camera Link, CoaXPress, or GigE Vision streams must be received, processed, and forwarded. The 156 multipliers accelerate image pre-processing (filtering, edge detection) and the 8-input ALMs implement control logic for multi-camera synchronization. The industrial I3 temperature grade supports factory-floor deployments where ambient temperature swings and electrical noise are routine, and the 780-FBGA package provides enough I/Os for multi-camera fan-in.
추천
Wireline Backhaul and Fronthaul Equipment
The EP2AGX45DF29I3NAD's 6.375 Gbps transceivers support CPRI, OBSAI, and Ethernet backhaul links between baseband units and remote radio heads, making it a strong fit for small-cell, pico-cell, and distributed antenna system (DAS) backhaul. The 42,959 LEs handle layer-2 switching, traffic shaping, and synchronization (IEEE 1588 or SyncE) without external ASICs. The industrial I3 speed grade ensures timing margins are met over the full -40C to +100C junction range typical of outdoor enclosures and street-cabinet deployments.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGX45DF29I3NAD — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGX45DF29I3N | EP2AGX45DF29I3G | EP2AGX45DF29C6N | EP2AGX45DF29C6G | EP2AGX45DF29C5N | EP2AGX45DF29C4N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Logic Elements | 42,959 | 42,959 | 42,959 | 42,959 | 42,959 | 42,959 | 42,959 |
| Speed Grade | I3 | I3 - same | I3 - same | C6 (slower) | C6 (slower) | C5 (slower than C6) | C4 (slowest) |
| Temperature Grade | Industrial (-40C to +100C junction) | Industrial - same | Industrial - same | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Embedded RAM | 3,517,440 bits | 3,517,440 bits - same | 3,517,440 bits - same | 3,517,440 bits - same | 3,517,440 bits - same | 3,517,440 bits - same | 3,517,440 bits - same |
| User I/Os | 364 | 364 - same | 364 - same | 364 - same | 364 - same | 364 - same | 364 - same |
| Transceivers | Multi-gigabit, up to 6.375 Gbps | Multi-gigabit, 6.375 Gbps - same | Multi-gigabit, 6.375 Gbps - same | Multi-gigabit, 6.375 Gbps - same | Multi-gigabit, 6.375 Gbps - same | Multi-gigabit, 6.375 Gbps - same | Multi-gigabit, 6.375 Gbps - same |
주요 차별점
- Industrial temperature grade with fastest I3 speed bin (vs EP2AGX45DF29C6N)
- Lead-free (Pb-free) finish on the AD suffix variant (vs EP2AGX45DF29I3N)
- Same 780-FBGA package across speed grades and temperature grades (vs EP2AGX45DF25I3G (484-FBGA, smaller))
설계 노트
The 780-FBGA package of the EP2AGX45DF29I3NAD has 0.8 mm to 1.0 mm ball pitch depending on package revision and requires microvia or via-in-pad PCB technology for reliable assembly. Per the Arria II GX device datasheet, the BGA substrate has a large central thermal pad that must be soldered to a thermal via array (typically 4x4 to 6x6 vias at 0.3 mm drill) to meet the 31 C/W theta_JB thermal resistance. Use 1 oz copper on outer layers and ensure the reflow profile matches the JEDEC J-STD-020 MSL3 floor life of 168 hours at 30C/60% RH.
The multi-gigabit transceiver channels of the EP2AGX45DF29I3NAD operate up to 6.375 Gbps and require strict impedance control. Per the Arria II GX Transceiver User Guide, route each transceiver channel as a 100 ohm differential pair with length matching within 5 mils, use a continuous reference plane on layer 2 or layer 3, and avoid 90-degree bends - use mitered or curved traces. Coupling capacitors must be placed within 250 mils of the FPGA balls, and the AC-coupling capacitor value should be selected per the standard (typically 100 nF for 6.375 Gbps) and rated for 0402 or smaller size to minimize discontinuity.
Estimated: The Arria II GX EP2AGX45DF29I3NAD has separate supply rails for core (VCCINT), I/O banks (VCCIO), transceiver (VCCHIP, VCCA, VCCP), and PLL/clock (VCC_PLL) voltages. Total power consumption depends on logic utilization, toggle rate, and transceiver activity; for a typical 50% LE utilization design with two active transceiver channels at 6.375 Gbps, expect 5-8 W total power. Use the Intel PowerPlay early power estimator (EPE) spreadsheet during architecture phase and the PowerPlay Power Analyzer post-place-and-route for accurate numbers. Decoupling capacitors (0.1 uF, 1 uF, 10 uF) must be placed as close as possible to each power pin per the device datasheet's decoupling guidelines.
Common pitfalls when designing with the EP2AGX45DF29I3NAD include: (1) leaving JTAG pins TMS/TCK/TDO/TDI floating - they must be pulled per the configuration scheme; (2) selecting the wrong configuration mode - the Arria II GX supports FPP, AS, PS, and JTAG modes, and an MSEL pin setting mismatch is a frequent first-PCB bring-up failure; (3) overlooking the POR (power-on-reset) sequencing requirement, where VCCINT must ramp before VCCPD; (4) using too few transceiver reference clock inputs for the design's required channel count. Refer to the Arria II GX configuration user guide for detailed pin-strapping and clock requirements.
규정 준수 정보
RoHS compliance inferred from the AD suffix in the MPN, which per the Altera/Intel ordering information guide designates lead-free and RoHS-compliant finish. The part is not AEC-Q100 qualified - it is a commercial/industrial FPGA and not intended for direct automotive qualification, though the Arria II GX family is used in some industrial and infrastructure applications. REACH status inferred from Intel's general REACH compliance statement. Halogen-free status not explicitly stated in verified web data and marked unknown. Conflict minerals compliance per Intel's Conflict-Free Smelter Program disclosure applies.