EP2AGX65DF25I5N - Arria II GX FPGA, 60K LE, 572-FCBGA | Intel
부품 번호: EP2AGX65DF25I5N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $245 | $24,500.00 |
| 500 | $215 | $107,500.00 |
| 1,000 | $192 | $192,000.00 |
EP2AGX65DF25I5N 개요
An FPGA is a reprogrammable logic device that combines configurable logic blocks, routing resources, and embedded memory into a single silicon die. Within the broader programmable logic hierarchy, FPGAs sit alongside CPLDs, ASICs, and ASSPs. The Arria II GX family specifically targets mid-range applications requiring a balance of logic density, embedded transceivers, and DSP blocks without the power and cost of the high-end Stratix family.
Key features of the EP2AGX65DF25I5N include a maximum core operating frequency around 500 MHz, support for DDR2/DDR3/QDRII/RLDRAM II external memory interfaces, eight PLLs for clock management, dedicated 18x18 multipliers for DSP, and hard PCI Express Gen1/Gen2 IP blocks. The 0.9 V core supply with separate transceiver and auxiliary supplies enables fine-grained power optimization across logic, SERDES, and I/O banks.
Architecturally, the device uses logic-array-block-based fabric with columnar memory blocks and DSP blocks interspersed, plus a hardened periphery containing transceivers, PLLs, and I/O registers. This hybrid approach allows soft logic to be placed alongside fixed-function silicon for predictable timing on memory and serial interfaces.
Typical applications include high-speed serial protocol bridging, industrial video processing, software-defined radio, test and measurement backplanes, and mid-range ASIC prototyping. The combination of transceivers, DSP blocks, and a substantial logic budget makes this device well suited to designs that previously required a discrete ASSP plus an FPGA.
When designing with the EP2AGX65DF25I5N, plan the PCB power distribution network carefully: the device requires multiple voltage rails (core VCC, VCCPT, VCCAUX, VCCAUX_GXB, VCC_GXB, VCCIO per bank) with sub-milliohm decoupling near each supply pin. Use the Altera Quartus II PowerPlay Early Power Estimator before final pin assignment to validate thermal envelope at industrial temperatures.
This page synthesizes distributor pricing, drop-in alternatives within the Arria II GX family, and practical PCB design guidance not consolidated in the manufacturer datasheet.
드롭인 대체품: EP2AGX65DF25I5N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGX65DF25I5N (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Process Technology, Package, Operating Temperature, Transceivers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGX65DF25I5G
✅ 드롭인✓ 재고 있음
$378 / 개
데이터시트 보기 →EP2AGX65DF25I3N
✅ 드롭인✓ 재고 있음
$125.9 / 개
데이터시트 보기 →EP2AGX65DF25I3G
✅ 드롭인✓ 재고 있음
$920 / 개
데이터시트 보기 →EP2AGX65DF25C6N
✅ 드롭인✓ 재고 있음
$89.4 / 개
데이터시트 보기 →EP2AGX65DF25C5N
✅ 드롭인✓ 재고 있음
$198.95 / 개
데이터시트 보기 →EP2AGX65DF25I5N 최대 정격 & 전기적 특성
| Device Family | Arria II GX |
| Series | EP2AGX65 |
| Logic Elements (LE) | 60,214 |
| Adaptive Logic Modules (ALMs) | 25,300 |
| LABs/CLBs | 2,530 |
| Total Embedded RAM Bits | 5,371,904 |
| User I/O Pins | 252 |
| 패키지 | 572-ball FC-FBGA |
| Core Voltage | 0.87 V to 0.93 V |
| Process Technology | 40 nm CMOS |
| Maximum Core Frequency | 500 MHz |
| Speed Grade | I5 |
| Temperature Grade | Industrial |
| Transceivers | Up to 12 channels, data rates up to 3.75 Gbps |
| Embedded Multipliers | 18x18 dedicated multipliers |
| PLLs | 8 |
| 실장 유형 | Surface Mount (BGA) |
| Lead Free / RoHS | Lead free, per verified data |
| Ordering Code Suffix | N = lead-free, tray or tape & reel |
EP2AGX65DF25I5N 572-ball fc-fbga 핀 구성 가이드
EP2AGX65DF25I5N(572-ball fc-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGX65DF25I5N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGX65DF25I5N 적합 용도: 6 애플리케이션s: Wireless Baseband / CPRI / OBSAI Bridging, Industrial Video Processing / Machine Vision, Software-Defined Radio (SDR) Platforms, ASIC Prototyping and Emulation, Test and Measurement Instrumentation, PCI Express Endpoint / Industrial I/O Card.
Wireless Baseband / CPRI / OBSAI Bridging
The EP2AGX65DF25I5N's 12 integrated transceivers supporting data rates up to 3.75 Gbps are ideal for CPRI and OBSAI links between baseband units and remote radio heads in 4G LTE and small-cell architectures. With 60,214 logic elements and 312 embedded 18x18 multipliers, the device can implement Layer-1 baseband DSP alongside the serial bridge in a single chip. Industrial temperature rating (-40C to +100C) suits outdoor radio unit enclosures. The 572-FCBGA package fits ATCA and AdvancedMC baseband mezzanines. Typical power consumption at full transceiver utilization falls in the 5-8 W range, manageable with forced-air cooling.
추천
Industrial Video Processing / Machine Vision
The EP2AGX65DF25I5N pairs 5.37 Mbits of embedded RAM with 252 user I/Os to ingest multiple Camera Link, CoaXPress, or HDMI streams for industrial inspection systems. Its 18x18 multipliers enable real-time image-pipeline operations (filtering, thresholding, edge detection) at full frame rate, while the industrial temperature range supports factory-floor deployment. Designers typically instantiate soft cores for GigE Vision or USB3 Vision protocol stacks and run frame-buffer memory in DDR3. The 500 MHz core frequency sustains 1080p60 processing on a single device.
추천
Software-Defined Radio (SDR) Platforms
The EP2AGX65DF25I5N is widely deployed in commercial SDR platforms where its transceiver channels up-convert ADC samples to baseband and the FPGA fabric runs channelizers, modulators, and protocol stacks. The 25,300 ALMs and embedded DSP blocks deliver 100+ GMACs of multiply-accumulate throughput suitable for LTE channel bandwidths and IEEE 802.11 modem blocks. Transceivers connect directly to ADC/DAC evaluation modules via FMC HPC connectors. Industrial temp allows ruggedized SDR enclosures for tactical and field-radio applications.
추천
ASIC Prototyping and Emulation
Mid-volume ASIC designs targeting 100K-300K gates use the EP2AGX65DF25I5N as a prototyping vehicle because its 60,214 logic elements partition well into multi-FPGA emulation when combined with companion Arria II GX devices. Multiple 572-FCBGA devices can be placed on a single prototyping board, sharing clocks and JTAG chains. Embedded transceivers support high-speed chip-to-chip serial links between FPGAs, replacing expensive parallel mezzanine connections. Industrial temperature allows prototype boards to operate in unconditioned labs.
추천
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol analyzers use the EP2AGX65DF25I5N to handle trigger logic, protocol decoding, and display data pipelines. The 5.37 Mbits of embedded RAM buffer waveform captures while the 12 transceivers feed serialized sample streams from front-end ASICs. Industrial temperature allows bench-top and portable instrument operation. Quartus II design tools support PCI Express hard IP for direct host DMA of acquired data, eliminating a bridge chip on the backplane.
추천
PCI Express Endpoint / Industrial I/O Card
The EP2AGX65DF25I5N's hard PCI Express Gen1/Gen2 endpoint blocks enable direct root-complex or endpoint connection without an external bridge, ideal for industrial I/O cards, frame grabbers, and DSP accelerator cards. With 60,214 logic elements available, designers can implement custom DMA engines, on-card processing pipelines, and host driver interfaces in the FPGA fabric. The 572-FCBGA package has excellent thermal headroom for sustained DMA workloads; industrial temperature supports unconditioned server rooms.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGX65DF25I5N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGX65DF25I5G | EP2AGX65DF25I3N | EP2AGX65DF25I3G | EP2AGX65DF25C6N | EP2AGX65DF25C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 572-FCBGA (DF25) | 572-FCBGA (DF25) - same | 572-FCBGA (DF25) - same | 572-FCBGA (DF25) - same | 572-FCBGA (DF25) - same | 572-FCBGA (DF25) - same |
| Logic Elements | 60,214 LE | 60,214 LE | 60,214 LE | 60,214 LE | 60,214 LE | 60,214 LE |
| Speed Grade | I5 | I5 | I3 (faster) | I3 (faster) | C6 (slower, commercial temp) | C5 (commercial temp) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Industrial | Commercial (0C to +85C) | Commercial (0C to +85C) |
| User I/O | 252 | 252 | 252 | 252 | 252 | 252 |
| Embedded RAM Bits | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 |
| Shipping Medium | Tray (N suffix) | Tape & Reel | Tray | Tape & Reel | Tray | Tray |
주요 차별점
- Mid-range Arria II GX density with integrated 3.75 Gbps transceivers (vs EP4CGX150DF27I7N (Cyclone IV GX))
- Industrial temperature support in the same 572-FCBGA footprint (vs EP2AGX65DF25C6N (commercial temp))
- Pin-compatible speed-grade migration within I5/I3 (vs EP2AGX65DF25I3N (I3 speed grade))
설계 노트
The EP2AGX65DF25I5N requires six distinct voltage rails: 0.9 V VCC (core), 1.5 V VCCPT, 2.5 V VCCAUX, 2.5 V VCCAUX_GXB, 1.1 V VCC_GXB (transceiver), and per-bank VCCIO. Per the Intel Arria II GX pin connection guidelines, place 0402-size 0.1 uF and 0.01 uF ceramic decoupling capacitors within 200 mil of every VCC/VCCAUX/VCCPT ball pair, and provide at least 22 uF of bulk polymer capacitance for every 100 mA of expected transient current. Estimated: a fully-utilized 12-transceiver design draws 6-9 W; design the PDN for 12 W headroom at industrial temperatures.
The 572-FCBGA package relies on thermal vias in the land pattern and a heat spreader attached to the lid for adequate heat removal. Without a heat spreader, the junction-to-ambient thermal resistance (theta_JA) of this package can exceed 20 C/W, causing the device to throttle at industrial temperatures under sustained high-utilization workloads. Estimated: at 8 W dissipation the junction temperature rises approximately 160 C above ambient (8 W x 20 C/W), exceeding the 100 C industrial limit - a forced-air path or heatsink is required.
Use the Intel Arria II GX symbol library and PCB footprint from the Quartus II pin-pad assignment file (.qpf) to ensure the BGA land pattern matches the 1.0 mm pitch of the DF25 package. Stack-up recommendation: 14-layer board with 4-6-4 layer count and matched 100 ohm differential impedance for the transceiver channels routed on inner stripline layers. High-speed transceiver traces must be length-matched within 5 mil pair-to-pair and within 50 mil lane-to-lane.
Transceiver channels on the EP2AGX65DF25I5N require AC-coupled 100 ohm differential routing with AC coupling capacitors of 0.1 uF placed near the receiver side. According to the Intel Arria II GX PCB layout guidelines, length-match the P and N traces within 5 mil and use continuous reference ground planes on adjacent layers; do not route transceiver lanes over power-plane splits or vias that change reference planes. Pre-emphasis and de-emphasis levels should be tuned with the Quartus II Transceiver Toolkit.
Common errors when bringing up the EP2AGX65DF25I5N include leaving VCCIO banks powered before VCC (which can latch-up I/O structures), missing configuration-mode pull-up resistors on MSEL pins, and incomplete JTAG chain termination on TDO. The device powers up with all I/O pins in tri-state; configure the I/O standard via Quartus II before relying on board-level signals. Always run the Quartus II power estimator with realistic activity factors before tape-out, as the published core current is a static estimate.
규정 준수 정보
Lead-free per verified data; AEC-Q100 not applicable to commercial FPGAs; halogen-free and conflict-minerals status not specified in the provided web data and should be requested from the manufacturer for full regulatory disclosure.
