EP2AGX95EF29I3G - Arria II GX FPGA, 89K LE, 780-FBGA | Intel
부품 번호: EP2AGX95EF29I3G ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1259.99 | $1,259.99 |
| 10 | $1199.5 | $11,995.00 |
| 100 | $1089 | $108,900.00 |
| 500 | $985 | $492,500.00 |
| 1,000 | $899 | $899,000.00 |
EP2AGX95EF29I3G 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnect, dedicated DSP blocks, embedded memory, and high-speed transceiver physical media attachment (PMA) and physical coding sublayer (PCS) circuitry. FPGAs occupy a unique position in the computing hierarchy between general-purpose microcontrollers/MPUs and fixed-function ASICs: they deliver hardware-level parallelism and deterministic latency while remaining in-system reprogrammable, which shortens time-to-market and supports late-stage design changes. Within Intel's product taxonomy, the Arria II GX family sits between the low-power Cyclone series and the high-end Stratix series, targeting mid-range applications that need transceivers and DSP but do not require the largest fabric.
Key features of the EP2AGX95EF29I3G include up to 8.5 Gbps transceivers, dedicated 6.25 Gbps PCIe hard IP blocks, hardware DSP blocks supporting 18x18 multipliers at up to 250 MHz, and on-chip RAM up to 6.8 Mbits. The -I3 speed/temperature grade indicates an industrial temperature range of -40C to +100C and a speed grade 3 timing bin. Power is supplied through dedicated VCC, VCCA_PLL, and VCCPD banks, with POR (power-on-reset) circuitry ensuring clean configuration.
The Arria II GX architecture uses adaptive logic modules (ALMs) with 8-input fracturable look-up tables (LUTs), each capable of implementing two independent 4-input functions, plus dedicated registers, adders, and carry chains. The transceiver blocks (GX) integrate clock-data recovery (CDR), serializer/deserializer (SERDES), and channel bonding logic supporting protocols such as PCIe Gen1/Gen2, Gigabit Ethernet, CPRI, OBSAI, Serial RapidIO, and 10G optical interfaces when used in conjunction with external PHYs. Memory interfaces include DDR2/DDR3 hard controllers with read/write leveling.
Typical applications for the EP2AGX95EF29I3G include wireless baseband processing (CPRI links to remote radio heads), broadcast video routers and format converters, military secure communications, test and measurement equipment, and high-speed serial bus aggregation. Designers choose this part when 89K logic elements and embedded transceivers balance well against power, cost, and PCB area constraints.
When designing with this FPGA, pay careful attention to transceiver reference clock jitter (<1 ps RMS recommended for 6.25G operation), matched-length differential pair routing for MGT lanes, and decoupling network density near each BGA power ball. Configuration via JTAG, Passive Serial (PS), or Fast Passive Parallel (FPP) modes should be selected based on system boot requirements. Quartus II design software (version 13.0 or later) is required for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor stock levels, package-level cross references within the Arria II GX family, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EP2AGX95EF29I3G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGX95EF29I3G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Process Technology, Family, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGX95EF29C6G
✅ 드롭인✓ 재고 있음
$465 / 개
데이터시트 보기 →EP2AGX95EF29C5G
✅ 드롭인✓ 재고 있음
$1305 / 개
데이터시트 보기 →EP2AGX95EF29C4G
✅ 드롭인✓ 재고 있음
$980 / 개
데이터시트 보기 →EP2AGX125EF29I3G
✅ 드롭인✓ 재고 있음
$590.9643 / 개
데이터시트 보기 →EP2AGX190EF29I3G
✅ 드롭인✓ 재고 있음
$1195 / 개
데이터시트 보기 →EP2AGX95EF29I3G 최대 정격 & 전기적 특성
| Series | Arria II GX |
| Family | Arria II GX (EP2AGX95) |
| Logic Elements (LE) | 89,178 |
| Embedded Memory Bits | 6,839,296 bits (~6.5 Mbit) |
| User I/O Count | 372 |
| 패키지 | 780-BBGA, FCBGA (29 mm) |
| 동작 온도 | -40C to +100C (Industrial) |
| Speed Grade | I3 (Industrial, speed grade 3) |
| Process Technology | 40 nm TSMC low-power |
| Supply Voltage Core | 0.9 V |
| Transceiver Data Rate | Up to 3.75 Gbps (EP2AGX95) |
| PCIe Hard IP | Yes (Gen1) |
| DSP Blocks (18x18 multipliers) | Up to 4 DSP blocks per column |
| PLL Count | Up to 6 PLLs (per device-level data) |
| Configuration Modes | JTAG, PS, FPP, AS |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
EP2AGX95EF29I3G 780-bbga, fcbga (29 mm) 핀 구성 가이드
EP2AGX95EF29I3G(780-bbga, fcbga (29 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGX95EF29I3G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGX95EF29I3G 적합 용도: 6 애플리케이션s: Wireless Baseband and CPRI Backhaul, Broadcast Video Routing and Format Conversion, Test and Measurement Instrumentation, Military and Secure Communications, High-Speed Serial Bus Aggregation, Industrial Imaging and Machine Vision.
Wireless Baseband and CPRI Backhaul
The EP2AGX95EF29I3G fits CPRI (Common Public Radio Interface) and OBSAI baseband links because it integrates multi-gigabit transceivers with deterministic latency and hardware DSP blocks. With 89,178 logic elements, designers can implement channel estimation, FFT/iFFT, and digital predistortion (DPD) for 4G LTE and pre-5G RRH (remote radio head) systems. The 372 user I/Os and 6.8 Mbit embedded memory support CPRI rates up to 3.072 Gbps, while industrial temperature operation suits outdoor base-station equipment. Pin-compatible migration to EP2AGX125 or EP2AGX190 in the same 780-FBGA EF29 package lets engineers scale capacity as channel counts grow.
추천
Broadcast Video Routing and Format Conversion
Broadcast routers and SDI-based format converters benefit from the EP2AGX95EF29I3G's 372 user I/Os, which can aggregate multiple 3G-SDI/HD-SDI streams while performing frame synchronization and color-space conversion. The 89K logic elements accommodate real-time de-interlacing, scaling, and overlay engines, and the embedded memory (6.8 Mbit) provides line buffers for video processing. Hardware DSP blocks enable chroma/luma filtering without consuming soft logic. Industrial temperature grade suits studio and headend equipment, while the 780-FBGA package's high pin density supports multi-stream I/O on a single board.
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Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol analyzers leverage the EP2AGX95EF29I3G's 89,178 logic elements for deep acquisition memory, triggering logic, and real-time protocol decoding at multi-gigabit serial rates. The integrated transceivers handle PCIe, SATA, USB 3.0, and custom serial protocols with deterministic latency. Hardware DSP blocks accelerate FFT-based spectrum analysis and signal-processing for jitter measurement. The 780-FBGA package exposes enough user I/Os to drive high-channel-count probe front-ends, and industrial temperature supports bench and field-deployed instruments.
추천
Military and Secure Communications
Defense radio systems and secure data links require FPGAs that combine high logic density, hardware encryption/DSP, and industrial/extended temperature operation. The EP2AGX95EF29I3G's 89K logic elements support channel coding (Turbo, LDPC), encryption cores, and multi-channel modem waveforms in a single device. Integrated transceivers handle Link-16, HAVE QUICK, and proprietary RF-to-digital interfaces. The 780-FBGA package's flip-chip construction provides excellent thermal performance for sealed enclosures, and Intel's long-life support program historically covered Arria II GX for defense customers planning 10+ year deployments.
추천
High-Speed Serial Bus Aggregation
Datacenter and HPC backplanes often aggregate multiple PCIe, SATA, and 10G Ethernet links through a single aggregation FPGA. The EP2AGX95EF29I3G provides 8 transceivers at up to 3.75 Gbps each, with PCIe hard IP for root-port or endpoint functionality, and embedded memory to hold packet buffers. The 89K logic elements implement non-blocking switch fabrics, while 372 user I/Os drive board-level sideband signals and management interfaces. Industrial temperature supports 1U/2U rack equipment with constrained airflow, and the 780-FBGA package's high pin count simplifies dense PCB layouts.
추천
Industrial Imaging and Machine Vision
Multi-camera machine vision systems use the EP2AGX95EF29I3G to aggregate CoaXPress, Camera Link, and GigE Vision streams while performing real-time image processing. The hardware DSP blocks accelerate 2D filtering, edge detection, and color correction, while 6.8 Mbit of embedded memory holds line buffers and lookup tables for gamma/white-balance. The 372 user I/Os interface to image sensors, motor controllers, and lighting triggers. Industrial temperature supports factory-floor deployment, and the 780-FBGA package accommodates the high pin count needed for multi-channel vision pipelines.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGX95EF29I3G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGX95EF29C6G | EP2AGX95EF29C5G | EP2AGX95EF29C4G | EP2AGX125EF29I3G | EP2AGX190EF29I3G |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (FCBGA, EF29) | 780-FBGA (FCBGA, EF29) - same | 780-FBGA (FCBGA, EF29) - same | 780-FBGA (FCBGA, EF29) - same | 780-FBGA (FCBGA, EF29) - same | 780-FBGA (FCBGA, EF29) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 89,178 | 89,178 | 89,178 | 89,178 | 124,100 | 190,400 |
| Embedded Memory (bits) | 6,839,296 | 6,839,296 | 6,839,296 | 6,839,296 | 8,121,216 | 9,990,400 |
| User I/O Count | 372 | 372 | 372 | 372 | 372 | 372 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | I3 (industrial, speed grade 3) | C6 (commercial, speed grade 6) | C5 (commercial, speed grade 5) | C4 (commercial, speed grade 4) | I3 (industrial, speed grade 3) | I3 (industrial, speed grade 3) |
| PCIe Hard IP | Yes (Gen1) | Yes (Gen1) | Yes (Gen1) | Yes (Gen1) | Yes (Gen1) | Yes (Gen1) |
| Lifecycle Status | Last Time Buy (2026) | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
주요 차별점
- Higher logic density than EP2AGX65 in the same 780-FBGA package (vs EP2AGX65DF29I3G)
- Industrial temperature with same density as commercial C-grade (vs EP2AGX95EF29C6G)
- Step-up path to EP2AGX190 for capacity growth (vs EP2AGX190EF29I3G)
설계 노트
The EP2AGX95EF29I3G requires multiple power rails: a 0.9V core (VCC), 1.1V/1.2V transceiver analog supplies (VCCH_GXB), 1.8V/2.5V/3.3V I/O banks (VCCIO), 2.5V/3.3V configuration supply (VCCPD), and 1.2V PLL analog (VCCA_PLL). Each transceiver channel typically draws ~120 mA at full utilization, so the EF29 package's 4-quadrant power-pad design is essential for clean delivery. Decoupling should follow Intel's PDN (power distribution network) guidelines with 0.1 uF and 10 uF ceramics in a 1:3 ratio near each supply ball. Power-on sequencing is mandatory: VCC must rise before VCCPD to avoid damage to the configuration logic.
Despite its 40 nm low-power process, the EP2AGX95EF29I3G with all transceivers active at 3.75 Gbps can dissipate 6 to 10 W, especially in dense designs. The 780-FBGA flip-chip package has a theta_JB of approximately 1.5 C/W when properly soldered to a high-layer-count PCB with continuous via arrays in the package keep-out area. Use Intel's Early Power Estimator (EPE) tool pre-layout, then validate thermal margins with a junction-temperature calculator post-layout. Industrial temperature operation (-40C to +100C) requires the junction-to-ambient thermal resistance to keep Tj below 100C at worst-case ambient.
BGA escape routing for the 780-ball EF29 package requires microvia technology (laser-drilled stacked vias) on at least 6 PCB layers. Matched-length differential routing (within 5 mils) is required for each transceiver lane; keep the 100-ohm differential impedance continuous through vias and bends. Use 135-degree bends (no 90-degree corners) on high-speed traces, and stitch ground vias along both sides of the differential pair to maintain a controlled-impedance environment. Reference the Arria II GX device datasheet's board design guidelines for trace widths, via antipad dimensions, and breakout patterns.
Three pitfalls are common in EP2AGX95EF29I3G designs: (1) using a non-Intel configuration mode that fails CRC check, requiring explicit MSEL pin strapping; (2) overlooking the DCLK (configuration clock) duty-cycle requirement of 40-60 percent, which can cause intermittent configuration failures; (3) failing to apply the proper POR (power-on-reset) delay before asserting nCONFIG, leading to brown-out during configuration. Always generate the bitstream with Quartus II's hardened configuration settings, validate the SOF/POF files, and verify the JTAG IDCODE matches the device under test before production bring-up.
규정 준수 정보
RoHS and lead-free per distributor listings. AEC-Q100 is not applicable to FPGAs. Halogen-free status was not stated in the verified web data; set to unknown.