EP2AGX95EF35I5G - Arria II GX FPGA, 89K LE, 452 I/O, 1152-FBGA | Intel
부품 번호: EP2AGX95EF35I5G ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1450 | $1,450.00 |
| 10 | $1380 | $13,800.00 |
| 100 | $1280 | $128,000.00 |
| 500 | $1190 | $595,000.00 |
| 1,000 | $1080 | $1,080,000.00 |
EP2AGX95EF35I5G 개요
What is an FPGA? A field-programmable gate array is a programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and routing resources that can be customized after manufacture to implement arbitrary digital circuits. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs and microcontrollers as a class of programmable logic ICs (PLDs), used for prototyping, low-volume production, and applications requiring hardware-level parallelism such as signal processing, packet processing, and high-speed interfaces.
Key features of the EP2AGX95 include 6.5625 Gbps true-LVDS support, dedicated hardware multipliers (PLLs and DLLs for clock management), and 89178 logic elements. The integrated PCI Express hard IP block supports Gen1 x1/x4 endpoints, simplifying PCIe-based designs. Memory interfaces support DDR3, DDR2, and QDR II+ at rates up to 800 MT/s.
The Arria II GX architecture combines a logic fabric with transceivers that handle protocols including PCI Express, Gigabit Ethernet, Serial RapidIO, and CPRI. The transceiver blocks support data rates between 600 Mbps and 3.75 Gbps, eliminating the need for external PHY chips. Built-in PCS (physical coding sublayer) blocks handle 8b/10b encoding and rate matching.
Typical applications for the EP2AGX95EF35I5G include wireless baseband processing, broadcast video equipment, industrial imaging, test and measurement instrumentation, and high-speed serial protocol bridging. The 452 I/O count makes the device suitable for designs requiring many parallel interfaces alongside serial channels.
When designing with the EP2AGX95EF35I5G, plan for the 35x35 mm FCBGA footprint, which demands PCB stack-up with buried vias and microvia technology. Use the Quartus II design software (13.0 or later service packs) for place-and-route and ensure proper power sequencing of the 0.9 V core, 1.1 V PLL, and 2.5 V/3.3 V I/O rails.
This page synthesizes distributor pricing, drop-in package alternatives, and engineering design notes not found in the manufacturer datasheet, providing engineering teams with practical sourcing and design-decision data.
드롭인 대체품: EP2AGX95EF35I5G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGX95EF35I5G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Embedded Memory, Logic Elements, Process Technology, PCIe Hard IP.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGX95EF35I5N
✅ 드롭인✓ 재고 있음
$1180 / 개
데이터시트 보기 →EP2AGX95EF35I3G
✅ 드롭인✓ 재고 있음
$280 / 개
데이터시트 보기 →EP2AGX95EF35I3N
✅ 드롭인✓ 재고 있음
$1320 / 개
데이터시트 보기 →EP2AGX95EF35C6G
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP2AGX95EF35C6N
✅ 드롭인✓ 재고 있음
$1390 / 개
데이터시트 보기 →EP2AGX125EF35I5G
✅ 드롭인✓ 재고 있음
$1190 / 개
데이터시트 보기 →EP2AGX125EF35I5N
✅ 드롭인✓ 재고 있음
$1390 / 개
데이터시트 보기 →EP2AGX95EF35I5G 최대 정격 & 전기적 특성
| Family | Arria II GX |
| Logic Elements | 89178 |
| Embedded Memory | 6839296 bits |
| Maximum User I/O | 452 |
| Number of LABs/CLBs | 452 |
| Number of Transceivers | 12 |
| Transceiver Data Rate | 600 Mbps to 3.75 Gbps |
| Package Type | 1152-BBGA, FCBGA (35 mm) |
| 동작 온도 범위 | -40C to +100C (industrial) |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| Operating Frequency | 500 MHz |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Lead Free | Yes |
EP2AGX95EF35I5G 1152-bbga, fcbga (35 mm) 핀 구성 가이드
EP2AGX95EF35I5G(1152-bbga, fcbga (35 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGX95EF35I5G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGX95EF35I5G 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, Broadcast Video Equipment, Industrial Imaging Systems, Test and Measurement Instrumentation, High-Speed Serial Protocol Bridging, Aerospace and Defense Signal Processing.
Wireless Baseband Processing
The EP2AGX95EF35I5G's 89,178 logic elements combined with 12 transceivers at up to 3.75 Gbps make it well suited for LTE and WiMAX baseband signal processing in wireless infrastructure equipment. The transceiver blocks handle CPRI/OBSAI backhaul between baseband unit and remote radio head at line rates up to 3.072 Gbps. The 6.8 Mbit embedded memory supports data buffering for multi-antenna MIMO processing. The 0.9 V core on a 40nm process delivers the performance-per-watt required for outdoor radio units. Industrial temperature grade (-40C to +100C) supports outdoor deployment conditions.
추천
Broadcast Video Equipment
SD/HD/3G-SDI video routing, format conversion, and overlay processing applications benefit from the EP2AGX95EF35I5G's 89178 logic elements and 452 I/O pins. The device's LVDS support (up to 6.5625 Gbps) handles uncompressed HD-SDI/3G-SDI serial interfaces directly, eliminating external serializers. M9K memory blocks provide line buffers and frame-store memory. The PCI Express hard IP enables host control from broadcast PC platforms. Design teams in the broadcast market value the Arria II GX family for its integrated SDI support, replacing multiple ASSPs with a single FPGA.
추천
Industrial Imaging Systems
Machine vision cameras, frame grabbers, and image processing systems leverage the EP2AGX95EF35I5G's parallel I/O bandwidth and 12 high-speed transceivers for multi-camera acquisition. The 452 user I/O count accommodates multiple LVDS Camera Link interfaces, while transceivers handle CoaXPress at 3.125 Gbps. The 89178 logic elements support real-time image preprocessing, Bayer demosaicing, and edge detection. The industrial temperature grade supports factory floor deployments. Memory interfaces up to 800 MT/s DDR3 provide adequate bandwidth for image buffering.
추천
Test and Measurement Instrumentation
Protocol analyzers, logic analyzers, and oscilloscope front ends use the EP2AGX95EF35I5G's high I/O density and transceiver channels to capture and process multiple high-speed serial protocols simultaneously. The integrated transceivers support standard test interfaces including PCI Express, SATA, and USB 3.0 protocol analysis. The 89178 logic elements handle state-based protocol decoding in firmware, while 6.8 Mbit memory stores captured traces. Industrial temperature grade supports laboratory and field test equipment deployment.
추천
High-Speed Serial Protocol Bridging
Multi-protocol bridging between PCI Express, Serial RapidIO, Gigabit Ethernet, and Aurora requires multiple transceiver channels and substantial logic resources — exactly the configuration provided by the EP2AGX95EF35I5G with 12 transceivers and 89178 logic elements. Hard IP blocks for PCI Express simplify endpoint and root complex implementations. The 452 user I/O count supports parallel sideband interfaces (I2C, SPI, GPIO) for system management. Industrial temperature grade supports telecom and datacom bridging applications.
추천
Aerospace and Defense Signal Processing
Avionics, radar signal processing, and electronic warfare subsystems benefit from the EP2AGX95EF35I5G's combination of 89178 logic elements, 12 transceivers, and industrial temperature range. The 40nm process provides radiation tolerance characteristics that meet aerospace reliability requirements when combined with appropriate mitigation. The high I/O count supports multiple ADC/DAC interfaces for RF signal chains. Embedded DSP blocks enable FFT, FIR filtering, and modulation/demodulation. The FCBGA-1152 package withstands thermal cycling for airborne applications.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGX95EF35I5G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGX95EF35I5N | EP2AGX95EF35I3G | EP2AGX95EF35C6G | EP2AGX125EF35I5G | EP2AGX125EF35I5N |
|---|---|---|---|---|---|---|
| Package | 1152-FCBGA (35 mm) | 1152-FCBGA (35 mm) - same | 1152-FCBGA (35 mm) - same | 1152-FCBGA (35 mm) - same | 1152-FCBGA (35 mm) - same | 1152-FCBGA (35 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 89178 | 89178 | 89178 | 89178 | 124200 (+39%) | 124200 (+39%) |
| Embedded Memory (bits) | 6839296 | 6839296 | 6839296 | 6839296 | 8310240 (+22%) | 8310240 (+22%) |
| User I/O | 452 | 452 | 452 | 452 | 452 | 452 |
| Transceivers | 12 (600 Mbps to 3.75 Gbps) | 12 | 12 | 12 | 12 | 12 |
| Speed Grade | I5 | I5 | I3 (slower) | C6 (commercial) | I5 | I5 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Pb-Free / Lead-Free Suffix | G (Pb-free) | N (no Pb-free suffix) | G (Pb-free) | G (Pb-free) | G (Pb-free) | N (no Pb-free suffix) |
주요 차별점
- Highest-density Arria II GX with industrial temperature grade in FCBGA-1152 (vs EP2AGX65DF29I5G)
- True drop-in compatibility with 12-transceiver configuration preserved (vs EP2AGX125EF35I5G)
- Industrial temperature grade with same package pinout as commercial variant (vs EP2AGX95EF35C6G)
설계 노트
Estimated: The 35x35 mm FCBGA-1152 package has a junction-to-ambient thermal resistance (theta_JA) of approximately 0.5 C/W with the exposed-die flip-chip BGA bottom thermal pad properly soldered to a PCB thermal land and 4 thermal vias. At maximum operating power (estimated 8-10 W under full transponder utilization), the junction temperature rise above ambient is 4-5 C. The industrial temperature grade allows junction temperatures up to 100 C, providing substantial thermal headroom for typical applications. Ensure the PCB thermal land is connected to an internal copper plane with a via array of 0.3 mm drill and 1.0 mm pitch.
The 1152-ball FCBGA at 1.0 mm ball pitch requires an HDI PCB stack-up with microvias and stacked vias. Use a minimum 6-layer stack-up with buried capacitance for power distribution. BGA breakout routing requires 0.1 mm (4 mil) trace/space rules for inner rows; outer two rows can be routed with 0.125 mm (5 mil) rules. Assign all VCCINT, VCCA, VCCPD, and VCCIO balls to dedicated power planes with local decoupling (100 nF X7R + 4.7 uF X5R per ball group).
Power sequencing: VCCINT (0.9 V core) must be applied before or simultaneously with VCCPD (3.3 V) and VCCA_PLL (2.5 V). VCCIO may follow VCCINT with monotonic ramp rates between 0.01 V/ms and 10 V/ms. Failure to observe correct sequencing can trigger permanent latch-up events. Use a dedicated power management IC (e.g., Intel EN5339 or LTM4623) with proper TRACK and MARGIN sequencing for multi-rail systems.
The 12 transceivers operating at 3.75 Gbps require controlled-impedance routing on the PCB with differential impedance of 100 ohms +/- 10%. Use stripline or microstrip with reference planes on adjacent layers. Maintain constant trace geometry and avoid 90-degree bends; use mitered bends or rounded corners with minimum 3x trace-width bend radius. AC-coupling capacitors (100 nF X7R, 0402 size) must be placed within 200 mils of each transceiver ball pair.
Configuration issues: ensure the configuration mode (AS, PS, JTAG, or Fast Passive Parallel) is properly set with MSEL[2..0] resistors before power-up. JTAG chain issues commonly arise from incorrect TMS/TCK termination (10 kohm pull-up on TCK, 1 kohm pull-up on TMS per IEEE 1149.1). The Quartus II programmer must target the correct device ID (0x020F30DD for EP2AGX95) — wrong device ID causes configuration failure with no clear error message.
규정 준수 정보
RoHS compliant per distributor listings. Pb-free terminal finish indicated by 'G' suffix. Industrial temperature grade qualified per Intel datasheet. AEC-Q100 not applicable for FPGAs.