EP2S130F1508C3 - 132K LE Stratix II FPGA, 1508-FCBGA | Intel
부품 번호: EP2S130F1508C3 ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1480 | $740,000.00 |
| 1,000 | $1350 | $1,350,000.00 |
EP2S130F1508C3 개요
What is an FPGA? A Field Programmable Gate Array is a programmable logic device that combines configurable logic blocks, programmable interconnect, dedicated memory, and hardened IP such as transceivers, PLLs, and DSP blocks. An FPGA is a type of programmable logic device (PLD), which itself belongs to the broader category of logic ICs within digital integrated circuits. Unlike an ASIC, the FPGA's function is defined after manufacture by loading a configuration bitstream into on-chip SRAM, allowing rapid design iteration and field upgrades.
Key features of the EP2S130F1508C3 include up to 6.3 Gbps transceiver support (Stratix II GX block, on related devices), dedicated DSP blocks for high-speed multiply-accumulate, TriMatrix embedded memory supporting true dual-port RAM, ROM, and FIFO modes, and eight Fast PLLs plus four Enhanced PLLs. The 90 nm process enables a typical core voltage of 1.2 V with low static and dynamic power, and the 1,508-pin FC-BGA package supports the 1,126 user I/O count via an industrial-standard footprint.
The architecture uses adaptive logic modules (ALMs) that combine 8-input fracturable look-up tables, adders, and registers, giving designers higher effective logic density per LE compared to previous generations. The dedicated DSP blocks deliver up to 3.6 GMACS at 250 MHz, and the TriMatrix memory delivers 6+ Tbps of aggregate memory bandwidth when fully utilized. Configuration is via passive serial, fast passive parallel, or JTAG.
Typical applications include high-end telecommunications line cards, baseband processing for wireless base stations, high-definition video broadcast equipment, military signal intelligence, ASIC prototyping, and high-performance compute accelerators. The 1,126 I/O count makes it well suited for memory-intensive designs interfacing DDR2 SDRAM, QDRII SRAM, and RLDRAM II.
Design consideration: Stratix II devices require a 1.2 V core supply and a 3.3 V/2.5 V/1.8 V I/O supply; the Quartus II design software is required for synthesis, place-and-route, and bitstream generation. Multi-voltage I/O banks allow mixing of standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS) on a single die. The FC-BGA package requires a high-layer-count PCB with matched-impedance routing and a 1.0 mm or finer ball pitch.
This page synthesizes distributor pricing, same-family drop-in alternatives, and design notes not found in the manufacturer datasheet alone, including the difference between the C3 commercial speed grade and the C4/C5/I3/I4 grades for timing margin analysis.
드롭인 대체품: EP2S130F1508C3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2S130F1508C3 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Process Technology, Operating Temperature, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2S130F1508C4
✅ 드롭인✓ 재고 있음
$1295 / 개
데이터시트 보기 →EP2S130F1508C5
✅ 드롭인✓ 재고 있음
$345 / 개
데이터시트 보기 →EP2S130F1508C5N
✅ 드롭인✓ 재고 있음
$1390 / 개
데이터시트 보기 →EP2S130F1508I4
✅ 드롭인✓ 재고 있음
$3950 / 개
데이터시트 보기 →EP2S130F1508I4N
✅ 드롭인✓ 재고 있음
$1390 / 개
데이터시트 보기 →EP2S130F1508C3N
✅ 드롭인✓ 재고 있음
$270 / 개
데이터시트 보기 →EP2S130F1508C3 최대 정격 & 전기적 특성
| Family | Stratix II |
| Logic Elements | 132,540 |
| Embedded Memory (bits) | 6,747,840 |
| Maximum User I/O | 1,126 |
| Process Technology | 90 nm |
| Core Voltage (typical) | 1.2 V |
| Speed Grade | C3 (commercial) |
| 패키지 | 1508-ball FC-BGA |
| 동작 온도 | 0C to +85C (commercial) |
| PLLs (Fast + Enhanced) | 8 + 4 (per family) |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG |
| RoHS 상태 | Compliant |
| 실장 유형 | Surface Mount (BGA) |
EP2S130F1508C3 1508-ball fc-bga 핀 구성 가이드
EP2S130F1508C3(1508-ball fc-bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2S130F1508C3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2S130F1508C3 적합 용도: 6 애플리케이션s: Telecommunications Line Cards, Wireless Base Station Baseband, High-Definition Video Broadcast, ASIC Prototyping and Emulation, Military Signal Intelligence, High-Performance Compute Accelerator.
Telecommunications Line Cards
The EP2S130F1508C3 is well suited to telecom line cards where it implements multi-gigabit serial links, packet processing, and traffic management. With 132,540 logic elements the device can host full custom MACs and framers, while 6,747,840 bits of TriMatrix memory provides packet buffers and lookup tables without off-chip SRAM. The 1,126 user I/Os connect to external PHYs, SFP+ cages, and backplane SERDES. The 90 nm process and 1.2 V core keep power within ATCA/AMC thermal envelopes.
추천
Wireless Base Station Baseband
In WCDMA, LTE, and 5G NR baseband processing, the EP2S130F1508C3 executes uplink/downlink channel decoding, FFT/iFFT, and MIMO detection. The dedicated DSP blocks deliver GMACS-class throughput for 64-QAM demodulation, while the TriMatrix memory holds soft-decision buffers for turbo and LDPC decoders. The 1,508-ball FC-BGA provides ample I/O to interface CPRI/OBSAI links to RRH and to external DDR2/QDRII memory for HARQ buffers.
추천
High-Definition Video Broadcast
The EP2S130F1508C3 powers HD and 4K video processing equipment such as contribution decoders, broadcast switchers, and studio video walls. The 132,540 logic elements support multi-channel H.264/AVC or MPEG-2 decoders, while the 1,126 I/Os handle SDI, HDMI, and DisplayPort interfaces. The TriMatrix memory stores reference frames and deinterlacing line buffers. The 90 nm core and 1.2 V operation allow fan-cooled 1RU chassis designs.
추천
ASIC Prototyping and Emulation
The 132,540 logic elements of the EP2S130F1508C3 make it a strong choice for ASIC prototyping and hardware emulation. Designers map RTL of 5M-10M-gate ASICs by partitioning across multiple FPGAs and using the TriMatrix memory for transaction-level modeling. The 1,126 I/Os support high-speed chip-to-chip interconnect, and the 90 nm process provides predictable timing closure with Quartus II TimeQuest. Stratix II prototyping kits are mature in the industry.
추천
Military Signal Intelligence
The EP2S130F1508C3 is qualified for high-reliability defense signal-intelligence (SIGINT) and electronic-warfare (EW) systems. The 132,540 LEs implement wideband digital receivers, channelizers, and adaptive beamformers, while the TriMatrix memory stores FFT windows and covariance matrices. The industrial-temperature EP2S130F1508I4 variant operates from -40C to +100C for ground-mobile platforms. The 1,508-ball FC-BGA withstands the vibration profile of MIL-STD-810.
추천
High-Performance Compute Accelerator
The EP2S130F1508C3 serves as a compute accelerator in high-performance computing (HPC) clusters and high-frequency trading (HFT) platforms. The 132,540 LEs execute parallel algorithmic kernels (option pricing, encryption, search), the DSP blocks accelerate SIMD arithmetic, and the 1,126 I/Os support PCIe, 10 Gigabit Ethernet, and DDR2/QDRII memory. The 90 nm process and 1.2 V core deliver GMACS-per-watt efficiency for latency-sensitive workloads.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2S130F1508C3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2S130F1508C4 | EP2S130F1508C5 | EP2S130F1508C5N | EP2S130F1508I4 | EP2S130F1508I4N | EP2S130F1508C3N |
|---|---|---|---|---|---|---|---|
| Package | 1508-ball FC-BGA | 1508-ball FC-BGA - same | 1508-ball FC-BGA - same | 1508-ball FC-BGA - same | 1508-ball FC-BGA - same | 1508-ball FC-BGA - same | 1508-ball FC-BGA - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| Embedded Memory (bits) | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 |
| Max User I/O | 1,126 | 1,126 | 1,126 | 1,126 | 1,126 | 1,126 | 1,126 |
| Speed Grade | C3 (commercial, fastest) | C4 (commercial, ~10-15% slower) | C5 (commercial, slowest) | C5 (commercial, slowest, Pb-free) | I4 (industrial) | I4 (industrial, Pb-free) | C3 (commercial, fastest, Pb-free) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C | -40C to +100C | 0C to +85C |
| Lead-Free (Pb-free) | No (standard SnPb finish) | No | No | Yes | No | Yes | Yes |
| Quartus II Bitstream Family | Stratix II (compatible) | Stratix II (same) | Stratix II (same) | Stratix II (same) | Stratix II (same) | Stratix II (same) | Stratix II (same) |
| Approx. Unit Price (USD) | $1,850 (qty 1) | ~$1,760 | ~$1,665 | ~$1,665 | ~$1,950 | ~$1,950 | ~$1,850 |
주요 차별점
- C3 is the fastest commercial speed grade in the EP2S130F1508 family (vs EP2S130F1508C5)
- Same-family density simplifies migration to Arria II GX (vs Xilinx Virtex-5 LX330)
- 1,508-ball FC-BGA delivers the maximum I/O count in the Stratix II family (vs EP2S130F1020C3 (1,020-ball FC-BGA))
설계 노트
The EP2S130F1508C3 requires multiple supply rails: VCCINT (1.2 V core), VCCIO (1.2 V to 3.3 V I/O per bank), VCCPD (3.3 V pre-driver), VCCA_PLL (1.2 V analog PLL), and VCCD_PLL (1.2 V digital PLL). Decoupling requires 0.1 uF and 0.01 uF ceramic capacitors as close as possible to each supply pin. A bulk 47 uF to 100 uF tantalum or polymer cap on each rail reduces switching noise. Power sequencing: VCCINT must reach its threshold before VCCIO and VCCPD to avoid latch-up; Altera recommends the PowerPlay early-power estimator to budget current per rail before PCB layout.
The 1,508-ball FC-BGA has a theta_JA of approximately 8-12 C/W with a properly designed thermal via array and heatsink. Estimated: at full toggle activity (typical Stratix II 130 LE, 450 MHz core, 1,126 I/O switching), worst-case power is approximately 15-22 W. Without a heatsink and adequate airflow (>=200 LFM), junction temperature can exceed 100C in a sealed enclosure. Use the thermal-impedance specifications from the Stratix II packaging user guide and consider copper-coin or thermal-via arrays directly under the FC-BGA land pads.
Route differential pairs (LVDS, SSTL) with 100 ohm differential impedance and single-ended I/O with 50 ohm controlled impedance. Keep 1.0 mm-pitch BGA breakouts on inner layers with via-in-pad or microvia technology for fan-out. Use a 12-16 layer stackup with dedicated ground and power planes adjacent to high-speed signal layers. Series damping resistors on clock nets reduce overshoot; place 33 ohm resistors within 200 mils of the FPGA clock pin per Altera design guidelines.
Do not connect JTAG TCK, TMS, TDI, TDO without proper pull-ups (TDI, TMS pull-up to VCCPD; TDO is a high-speed output). Configuration mode pins MSEL[3:0] must be tied to VCCPD or GND to select Passive Serial, Fast Passive Parallel, or JTAG-only mode. Skipping MSEL settings results in a configuration failure. Do not leave unused I/O pins floating; configure them as outputs driving ground or as inputs with internal pull-up to avoid stray switching current.
규정 준수 정보
RoHS and REACH compliant per Altera product page. Standard C3 finish is SnPb; choose C3N suffix for lead-free. AEC-Q100 not applicable for FPGA. Conflict-mineral statement available on Intel/Altera compliance page.
