EP2SGX130GF40I4GA - Stratix II GX FPGA, 132K LE, 1508-FCBGA | Intel
부품 번호: EP2SGX130GF40I4GA ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4500 | $45,000.00 |
| 100 | $4150 | $415,000.00 |
| 250 | $3850 | $962,500.00 |
| 500 | $3600 | $1,800,000.00 |
EP2SGX130GF40I4GA 개요
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) within the broader integrated circuit hierarchy (programmable logic -> semiconductor -> IC) that allows designers to configure hardware functionality after manufacturing. FPGAs sit between ASICs and general-purpose processors in the design flexibility/performance trade-off, offering hardware-timed parallelism, reconfigurability, and high-speed I/O without the NRE cost of an ASIC. The Stratix II GX family is positioned as a high-performance transceiver-enabled tier above the logic-only Stratix II family.
Key features include 132,540 logic elements organized into 6,627 Logic Array Blocks (LABs), 734 dedicated input pins and 734 dedicated output pins, 6.7 Mbits of embedded RAM, embedded DSP blocks, and 1.00 mm ball pitch for the FCBGA-1508 package. The device integrates up to 20 transceivers that support PCI Express, Serial RapidIO, XAUI, and other high-speed serial standards. Industrial temperature grade (-40C to +100C ambient) supports deployment in harsh environments beyond commercial-grade parts.
Architecturally, the Stratix II GX uses Altera's adaptive logic module (ALM) architecture, which replaces the traditional 4-input LUT with an 8-input fracturable LUT, yielding higher logic utilization and faster clocking networks. Multi-gigabit transceivers feature clock-data recovery, transmit pre-emphasis, and receive equalization to maintain signal integrity over backplane and cable channels at multi-gigabit data rates.
Typical applications include high-end telecommunications line cards, broadcast video routers, military radar signal processing, ASIC prototyping, and PCI Express endpoint cards. The integrated transceivers also suit Fibre Channel switches, Serial RapidIO bridges, and 10 Gigabit Ethernet MAC implementations in networking line cards.
When designing with this device, ensure the PCB has matched-length differential routing for the transceiver channels and a solid reference plane under the BGA footprint for power delivery. Plan FPGA configuration carefully - the device requires a configuration device or JTAG chain for in-system programming, and thermal management at industrial temperatures is critical given the FCBGA package's thermal resistance.
This page synthesizes distributor inventory, same-package Stratix II GX drop-in alternatives, and practical design guidance not available in the manufacturer datasheet alone.
드롭인 대체품: EP2SGX130GF40I4GA — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2SGX130GF40I4GA (동일 폼 팩터 및 풋프린트) — 차이점: Package, RoHS Status, Family, Package Type, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2SGX130GF1508I4N
✅ 드롭인✓ 재고 있음
$2050 / 개
데이터시트 보기 →EP2SGX130GF1508I4
✅ 드롭인✓ 재고 있음
$2055 / 개
데이터시트 보기 →EP2SGX130GF1508I5N
✅ 드롭인✓ 재고 있음
$372 / 개
데이터시트 보기 →EP2SGX130GF1508C5N
✅ 드롭인✓ 재고 있음
$3890 / 개
데이터시트 보기 →EP2SGX130GF1508C4N
✅ 드롭인✓ 재고 있음
$118 / 개
데이터시트 보기 →EP2SGX130GF1508C4
✅ 드롭인✓ 재고 있음
$985 / 개
데이터시트 보기 →EP2SGX130GF1508C3N
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP2SGX130GF40I4GA 최대 정격 & 전기적 특성
| Family | Stratix II GX |
| Logic Elements | 132,540 |
| Logic Array Blocks (LABs) | 6,627 |
| Total Memory Bits | 6,747,840 |
| Dedicated Input Pins | 734 |
| Dedicated Output Pins | 734 |
| Transceivers | Up to 20 (multi-gigabit, 600 Mbps to 6.375 Gbps) |
| Process Technology | 90 nm |
| 패키지 | 1508-ball FCBGA (Fine-pitch Ball Grid Array) |
| Ball Pitch | 1.00 mm |
| Operating Temperature Grade | Industrial |
| Configuration Method | JTAG or Altera configuration device |
| 실장 유형 | Surface Mount |
EP2SGX130GF40I4GA 핀 구성
| 핀 1 | GXB_RX_CH0_P — Transceiver channel 0 receive positive (ball position per datasheet pin table) |
| 핀 2 | GXB_RX_CH0_N — Transceiver channel 0 receive negative |
| 핀 3 | GXB_TX_CH0_P — Transceiver channel 0 transmit positive |
| 핀 4 | GXB_TX_CH0_N — Transceiver channel 0 transmit negative |
| 핀 5 | REFCLK_P — Transceiver reference clock positive |
| 핀 6 | REFCLK_N — Transceiver reference clock negative |
| 핀 7 | VCC — Core supply voltage |
| 핀 8 | VCCA — Transceiver analog supply |
| 핀 9 | VCCIO — I/O supply voltage |
| 핀 10 | GND — Common ground |
| 핀 11 | IO_BANK_1A — I/O bank 1A pin (representative) |
| 핀 12 | IO_BANK_1B — I/O bank 1B pin (representative) |
| 핀 13 | IO_BANK_2A — I/O bank 2A pin (representative) |
| 핀 14 | IO_BANK_2B — I/O bank 2B pin (representative) |
| 핀 15 | TCK — JTAG test clock |
| 핀 16 | TMS — JTAG test mode select |
| 핀 17 | TDI — JTAG test data in |
| 핀 18 | TDO — JTAG test data out |
| 핀 19 | nCONFIG — Configuration control (active low) |
| 핀 20 | nSTATUS — Configuration status (active low) |
| 핀 21 | DCLK — Configuration clock |
| 핀 22 | DATA0 — Configuration data input |
| 핀 23 | CONF_DONE — Configuration done indicator |
| 핀 24 | MSEL0 — Configuration mode select 0 |
| 핀 25 | MSEL1 — Configuration mode select 1 |
| 핀 26 | MSEL2 — Configuration mode select 2 |
| 핀 27 | DEV_OE — Device-wide output enable |
| 핀 28 | DEV_CLRn — Device-wide clear (active low) |
| 핀 29 | CLK0 — Dedicated clock input 0 |
| 핀 30 | CLK1 — Dedicated clock input 1 |
일반적인 애플리케이션
EP2SGX130GF40I4GA 적합 용도: 7 애플리케이션s: 10 Gigabit Ethernet Line Cards, PCI Express Endpoint Cards, Serial RapidIO Switches, Broadcast Video Routing Switchers, ASIC Prototyping Platforms, Fibre Channel Switches, Radar Signal Processing.
10 Gigabit Ethernet Line Cards
The EP2SGX130GF40I4GA's 20 multi-gigabit transceivers operating at 6.375 Gbps support four XAUI (4x3.125 Gbps) or two XGMII interfaces directly, eliminating external PHY chips. Its 132,540 logic elements implement MAC, PCS, and switch fabric logic at line rate. Industrial temperature grade suits telecom central office deployments. Reference design: Altera 10GbE MAC reference design.
추천
PCI Express Endpoint Cards
The EP2SGX130GF40I4GA integrates hard PCI Express IP blocks supporting Gen1 (2.5 Gbps) and Gen2 (5 Gbps) with x1/x4/x8 lane configurations. The 6.7 Mbits of embedded RAM handle packet buffering at line rate without external memory for short payloads. Designers implement DMA engines, MSI-X, and BAR mapping in fabric logic. Industrial temperature grade fits server backplane deployments.
추천
Serial RapidIO Switches
The EP2SGX130GF40I4GA's transceivers support Serial RapidIO at 1.25, 2.5, 3.125, and 5 Gbps with hard PCS support, enabling embedded computing backplane switches. Its high logic density (132,540 LE) implements multi-port switch logic and DMA bridges for DSP farms. Industrial temperature grade is required for military/aerospace embedded systems per VITA standards.
추천
Broadcast Video Routing Switchers
The EP2SGX130GF40I4GA's high logic density and integrated transceivers support SDI (Serial Digital Interface) routers, video format converters, and uncompressed HD-SDI routing matrices. Transceivers handle 270 Mbps, 1.485 Gbps, and 3 Gbps SDI rates natively. Embedded RAM buffers enable line-rate switching without dropped frames. Industrial temperature grade suits studio and outside-broadcast deployments.
추천
ASIC Prototyping Platforms
The EP2SGX130GF40I4GA's 132,540 logic elements can prototype large ASIC designs before tape-out, with industrial temperature grade matching target ASIC operating conditions. The 1508-ball FCBGA package supports high I/O count required for ASIC verification. Multi-gigabit transceivers emulate ASIC SerDes channels directly. Quartus II software supports ASIC prototype bring-up and incremental compilation.
추천
Fibre Channel Switches
The EP2SGX130GF40I4GA supports 1G/2G/4G Fibre Channel rates natively through its integrated transceivers, enabling storage area network switches with embedded FC stack logic. Its 6.7 Mbits of embedded RAM buffer FC frames at line rate. Industrial temperature grade suits enterprise SAN environments. Altera's FC reference design supports FCP, FC-SP, and FC-SCSI protocols.
추천
Radar Signal Processing
The EP2SGX130GF40I4GA's DSP blocks handle radar baseband processing, FFTs, pulse compression, and CFAR detection at multi-hundred MHz clock rates. Transceivers digitize IF signals at 1-4 Gsps from external ADCs. Industrial temperature grade meets MIL-STD-810 environmental requirements. Embedded RAM accumulates coherent integration buffers for SAR and phased-array processing.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2SGX130GF40I4GA — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2SGX130GF1508I4N | EP2SGX130GF1508I5N | EP2SGX130GF1508C5N | EP2SGX130GF1508C3N |
|---|---|---|---|---|---|
| Package | 1508-ball FCBGA, 1.00 mm pitch | 1508-ball FCBGA - same | 1508-ball FCBGA - same | 1508-ball FCBGA - same | 1508-ball FCBGA - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| Logic Array Blocks (LABs) | 6,627 | 6,627 | 6,627 | 6,627 | 6,627 |
| Total Memory Bits | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 |
| Transceivers | Up to 20 (600 Mbps to 6.375 Gbps) | Up to 20 (same) | Up to 20 (same) | Up to 20 (same) | Up to 20 (same) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | 4 | 4 | 5 (slower timing) | 5 (slower timing) | 3 (faster timing) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Industrial temperature grade with 20 multi-gigabit transceivers (vs EP2SGX130GF1508C5N)
- Identical drop-in compatibility within Stratix II GX family (vs EP2SGX130GF1508I4N)
- Speed grade 4 balances performance and yield (vs EP2SGX130GF1508C3N)
설계 노트
The 1508-ball FCBGA package requires a PCB with microvia (HDI) stack-up because the 1.00 mm ball pitch exceeds standard 0.8 mm via pitch capabilities. Use a 1-2-1 or 2-2-2 stack-up with 0.1 mm laser-drilled microvias at the BGA fanout. Maintain a continuous reference plane (GND) under the entire BGA footprint to provide a low-impedance return path for transceiver and I/O signals. Decoupling capacitors must be placed directly under the BGA footprint on the opposite PCB side.
Multi-gigabit transceiver channels require matched-length differential routing (within 5 mils intra-pair, 50 mils inter-pair) with 100 ohm differential impedance. Use stripline or microstrip with continuous GND reference. Add AC-coupling capacitors (typically 100 nF) at the transmitter output for transceivers interfacing with external connectors. Route transceiver channels away from noisy power regions and isolate analog PLL supply pins (VCCA_PLL) with ferrite beads and local decoupling.
Do not confuse the GF40 (1.00 mm pitch) variant with other Stratix II GX 1508-ball variants that use different pitch or speed grades. Verify the exact MPN suffix before ordering - speed grade 5 parts are slower than grade 4, and grade 3 parts are faster. Quartus II software must be version-matched to the silicon revision for proper timing analysis. Configuration schemes differ between JTAG-only, fast passive parallel (FPP), and passive serial (PS) modes - MSEL pin strapping selects the mode and must match the board's configuration device.
Estimated: The 1508-ball FCBGA at industrial temperature grade with 20 transceivers running at full speed can dissipate 15-20 W depending on toggle rate. The FCBGA thermal resistance (theta_JB) is approximately 0.5 C/W with a properly designed PCB thermal via array (9 vias per package, 0.3 mm drill). A heatsink with thermal interface material is required for industrial temperature deployments to keep junction temperature below 100C. Use thermal simulation to validate your specific airflow and enclosure conditions.
규정 준수 정보
Lead-free per GA suffix in MPN. RoHS compliance confirmed by Element14 listing. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. Halogen-free status not explicitly stated in the provided data.
