EP2SGX30CF780C3NGB - Stratix II GX FPGA, 33.8K LE, FC-FBGA-780
부품 번호: EP2SGX30CF780C3NGB ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 500 | $330 | $165,000.00 |
| 1,000 | $305 | $305,000.00 |
EP2SGX30CF780C3NGB 개요
A Field-Programmable Gate Array (FPGA) is a type of integrated circuit whose logic and routing are configured by the end user after manufacture. FPGAs belong to the broader programmable logic (PLD) category, which sits between fixed-function ASICs and software-programmable processors in terms of flexibility, parallelism, and time-to-market. Modern high-end FPGAs like Stratix II GX add embedded transceivers, memory blocks, DSP blocks, and PLL/clock-management hardware, allowing them to serve as complete system-on-chip (SoC) platforms for wired communications, signal processing, and high-bandwidth I/O aggregation.
The EP2SGX30CF780C3NGB integrates embedded transceivers capable of multiple data rates, dedicated hardware multipliers for DSP, and TriMatrix memory blocks. The flip-chip BGA package supports the high I/O count and high transceiver bandwidth required by the device, while keeping lead inductance low enough for multi-gigabit signaling. Per the Stratix II GX device family datasheet, this device family targets high-speed serial I/O and high-density parallel processing.
Typical applications include telecommunications line cards and backplanes, high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet, XAUI), video broadcast and imaging pipelines, defense and aerospace signal processing, and test & measurement instrumentation. The combination of high logic density and integrated transceivers allows designers to consolidate multiple discrete bridge/aggregation chips onto a single Stratix II GX device.
When designing with this FPGA, ensure proper power sequencing of the 1.2 V core and the transceiver analog supplies, and follow Altera's thermal management guidelines for flip-chip BGA packages. Designers should consult the Stratix II GX pin connection guidelines and the Quartus II support resources for transceiver channel placement and board layout to meet signal-integrity and SI/PI requirements.
This page synthesizes distributor availability, Stratix II GX family variants, and design considerations not always obvious from the manufacturer datasheet alone, with cross-brand alternatives sourced from current cross-reference data and XAIPART-internal part pages.
드롭인 대체품: EP2SGX30CF780C3NGB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2SGX30CF780C3NGB (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, RoHS Status, Speed Grade, Transceivers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2SGX30CF780C3N
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP2SGX30CF780C3
✅ 드롭인✓ 재고 있음
$175.5 / 개
데이터시트 보기 →EP2SGX30CF780C3NGB 최대 정격 & 전기적 특성
| Series | Stratix II GX |
| Family | Stratix II GX (Enhanced Configuration / EPC variant) |
| Logic Elements (LE) | 33,880 |
| Logic Array Blocks (LABs) | 1,694 |
| Total RAM Bits | 1,369,728 |
| User I/O Pins | 361 |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm CMOS |
| Maximum Internal Frequency | 816.9 MHz |
| Transceiver Data Rate | up to 3.125 Gbps |
| 패키지 | 780-BBGA (FC-FBGA) |
| 실장 유형 | Surface Mount (flip-chip BGA) |
| 동작 온도 | 0C to +85C (commercial grade, 'C' speed grade) |
| Configuration Mode | Enhanced Configuration (EPC), N suffix indicates lead-free / enhanced option |
| RoHS 상태 | Compliant (per 'N' suffix on Altera part numbering) |
| Ordering Suffix | GB (tape and reel / packaging variant, Altera ordering code suffix) |
EP2SGX30CF780C3NGB 780-bbga (fc-fbga) 핀 구성 가이드
EP2SGX30CF780C3NGB(780-bbga (fc-fbga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2SGX30CF780C3NGB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2SGX30CF780C3NGB 적합 용도: 6 애플리케이션s: Telecommunications Backplane Aggregation, PCI Express Endpoint Card, Broadcast Video and Imaging Processing, Defense and Aerospace Signal Processing, Test and Measurement Instrumentation, Industrial High-Speed Serial Bridge.
Telecommunications Backplane Aggregation
The EP2SGX30CF780C3NGB's 33,880 logic elements, 361 user I/Os, and integrated multi-gigabit transceivers up to 3.125 Gbps make it a strong fit for telecom line-card aggregation and backplane bridging. In this role, the FPGA absorbs multiple lower-rate links, performs protocol conversion or statistical multiplexing, and re-emits them on a higher-rate pipe - tasks that would otherwise require a discrete bridge ASIC plus an external transceiver. The 1,369,728 bits of TriMatrix memory allow large on-chip packet buffers, while the 1.2 V core keeps per-channel power low. Compared with a switching-regulator-fed ASIC design, the FPGA trades deterministic fixed-function performance for design flexibility and rapid prototyping; expected per-channel latency is dominated by the transceiver PCS layer plus the FPGA fabric pipeline depth.
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PCI Express Endpoint Card
The integrated transceivers of the EP2SGX30CF780C3NGB operate up to 3.125 Gbps, which is sufficient for PCI Express Gen1 (x1/x4/x8). The FPGA implements the PHY/MAC/transaction layer in soft logic plus the Altera hard IP for PCIe, while 361 user I/Os provide header-side connections to memory, host bridge, or co-processor logic. With 1,369,728 bits of embedded memory and dedicated hardware multipliers, the device can also handle payload processing, DMA, or cryptographic acceleration without leaving the FPGA. The 780-FBGA package offers a compact routing area and controlled-impedance ball array for the high-speed serial lanes. Estimated power is dominated by the transceiver channels (typ. 100 mW per lane at 3.125 Gbps) plus core dynamic power, so a multi-phase LDO/DCDC power tree is recommended.
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Broadcast Video and Imaging Processing
The EP2SGX30CF780C3NGB fits broadcast video and imaging pipelines thanks to its 33,880 LEs, hardware multipliers for DSP, and large TriMatrix memory for line buffers. Common functions include SD/HD/3G-SDI bridging, color-space conversion, deinterlacing, scaling, and overlay - all of which benefit from the FPGA's massive parallelism. The 361 user I/Os accept parallel RGB/YUV busses from video decoders or FPGAs upstream, while the integrated transceivers pipe out SDI, DVI, or DisplayPort signals. Operating at 1.2 V core on a 90 nm process, the device delivers strong performance-per-watt for real-time video. Quartus II IP libraries from Altera (e.g., the Video and Image Processing Suite) further accelerate development.
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Defense and Aerospace Signal Processing
The Stratix II GX family supports defense and aerospace applications requiring programmable DSP throughput, secure reprogrammability, and high-bandwidth serial I/O. With 33,880 LEs, dedicated hardware multipliers, and transceivers up to 3.125 Gbps, the EP2SGX30CF780C3NGB handles radar pulse processing, electronic-countermeasures (ECM) algorithms, and secure communications front-ends in a single device. The 780-FBGA package meets the rugged PCB area constraints typical of deployed platforms, and the 90 nm CMOS process is well-characterized across the commercial temperature range. For extended-temperature military applications, the part can be paired with a down-screened 'I' grade variant (note: not the 'C' speed grade shown here - see the I-suffixed Stratix II GX part numbers).
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Test and Measurement Instrumentation
Test-and-measurement instruments - logic analyzers, protocol exercisers, BER testers, and arbitrary waveform generators - rely on the EP2SGX30CF780C3NGB's combination of high LE count (33,880), hardware multipliers, abundant memory (1.37 Mbits), and multi-gigabit transceivers. These resources allow the FPGA to generate stimulus patterns, capture high-speed data streams, perform real-time protocol decode, and drive a host PC over PCIe. The 1.2 V core and 780-FBGA package suit dense, multi-board instruments where board area is at a premium. Compared with a CPU-only solution, the FPGA offloads deterministic DSP and pattern matching from software, dramatically increasing effective test throughput.
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Industrial High-Speed Serial Bridge
Industrial systems often require bridging between mismatched serial protocols - e.g., Serial RapidIO to Ethernet, or PCIe to proprietary backplane fabrics. The EP2SGX30CF780C3NGB fits this role with 33,880 LEs for protocol state machines, dedicated multipliers for CRC/hashing, and integrated transceivers rated up to 3.125 Gbps for both ends of the bridge. The 361 user I/Os expose side-band GPIO, status LEDs, and parallel bus connections to legacy controllers. The FC-FBGA-780 package supports the controlled-impedance, length-matched routing required for multi-gigabit signaling. Industrial temperature variants of the Stratix II GX family (look for 'I' suffixes) extend operation into -40C to +100C for harsh-environment deployment.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2SGX30CF780C3NGB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2SGX30CF780C3N | EP2SGX30CF780C3 | EP2S30F484C3N |
|---|---|---|---|---|
| Brand | Altera | Altera (same) | Altera (same) | Altera (same brand, smaller package) |
| Package | 780-BBGA (FC-FBGA) | 780-BBGA (FC-FBGA) - same | 780-BBGA (FC-FBGA) - same | 484-BBGA - smaller, NOT pin-compatible |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 (same silicon family) |
| User I/Os | 361 | 361 | 361 | 334 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Transceiver Speed | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | none (non-GX) |
주요 차별점
- Stratix II GX family with integrated 3.125 Gbps transceivers on the FC-BGA-780 footprint (vs EP2S30F484C3N)
- Ordering suffix flexibility - GB / N / base ordering codes share the same silicon (vs EP2SGX30CF780C3)
- Balanced logic density and I/O count for the FC-BGA-780 class (vs EP2SGX130GF40C3N)
설계 노트
Estimated: the Stratix II GX EP2SGX30CF780C3NGB requires a 1.2 V core supply plus separate analog supply rails for the multi-gigabit transceivers (per Altera pin connection guidelines). Use a multi-phase buck regulator for the core to minimize ripple-induced jitter on the transceivers, and isolate the analog PLL supplies with ferrite beads and dedicated LDOs. Decoupling follows the Stratix II GX PDN guidelines - dozens of 0.1 uF / 0.01 uF ceramic capacitors distributed across the FC-BGA footprint plus several bulk capacitors per rail are required to control simultaneous switching noise on the 1.2 V rail.
Estimated: in worst-case configuration (high logic utilization plus active transceivers), the EP2SGX30CF780C3NGB can dissipate on the order of 5-8 W. The flip-chip BGA dissipates primarily through the PCB - provide a continuous ground plane and stitch vias in the BGA breakout area to spread heat. For cleared-air applications, follow Altera's thermal management guidelines; without forced airflow or a heatsink, theta-JA may be too high for the worst-case load.
Route the multi-gigabit transceiver lanes first with controlled-impedance differential pairs (typically 100 ohm differential) and length-matching per the Stratix II GX handbook. Use a high-layer-count stackup with low-loss dielectric (e.g., low-Dk FR-4 or Megtron) for the 3.125 Gbps lanes; place AC-coupling capacitors close to the transmitter pins and provide a clean low-noise analog supply to the transceiver PLL pins. BGA breakout should use microvias or via-in-pad for the inner rows to maintain signal integrity.
Do not omit the configuration device or JTAG chain - the device will not boot without a valid EPC configuration or JTAG load. Ensure the JTAG pin pull-ups/downs match the Altera pin connection guidelines (TCK/TMS/TDO pull-up, TDI pull-up). Avoid mixing I/O standards on the same bank that conflict with VREF supply requirements. Always validate the Quartus II fitter timing closure with realistic SDC constraints for both fabric paths and transceiver interfaces.
규정 준수 정보
EP2SGX30CF780C3NGB carries the 'N' suffix in its ordering code, which per Altera/Intel nomenclature denotes lead-free / RoHS-compliant lead finish. AEC-Q100 is not applicable (this is an FPGA, not an automotive-grade IC). REACH and conflict-minerals statements are available from Intel's product compliance portal on request. Halogen-free status was not stated in the verified web data - flagged as unknown.
