EP2S60F672C3N - Stratix II FPGA 60K LE 672-BGA | Intel
부품 번호: EP2S60F672C3N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1694.56 | $1,694.56 |
| 10 | $1560 | $15,600.00 |
| 100 | $1425 | $142,500.00 |
| 500 | $1295 | $647,500.00 |
| 1,000 | $1175 | $1,175,000.00 |
EP2S60F672C3N 개요
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows engineers to configure digital logic, memory blocks, and routing after manufacture. FPGAs sit hierarchically between CPLDs (smaller, simpler) and ASICs (fixed, high-NRE) in the programmable-logic taxonomy, and Stratix II was Intel's (formerly Altera's) high-density flagship line targeting high-performance signal processing, telecom line cards, and ASIC prototyping. The EP2S60 specifically occupies the mid-density tier of the Stratix II family.
Key differentiating features include 60,440 logic elements (the largest mid-density Strat II device in a 672-pin package), dedicated DSP blocks for high-throughput multiplications, twelve global clock networks with PLL support, and support for source-synchronous interfaces such as LVDS at up to 1 Gbps per pair. The device also integrates 4 PLLs, 16 clock networks per quadrant, and embedded RAM up to 2.5 Mbits. Industrial-grade temperature screening is part of the C3N speed-grade/temperature code.
Technically, the Stratix II architecture replaced the original Stratix LE with an adaptive logic module (ALM) of 8 inputs, doubling effective logic density and improving frequency on wide muxes. Each LAB contains 8 ALMs and 16 logic-array registers. The 90 nm process with 1.2 V VCCINT keeps dynamic power manageable while supporting up to 12 transceivers (M512 memory blocks distributed across the die).
Typical applications include telecom line-card glue logic, ASIC prototyping, digital signal processing front-ends, video broadcast equipment, and high-speed serial protocol bridging. Designers also deploy the EP2S60 in industrial imaging, military signal processing, and high-end test/measurement systems where the balance of 60K LEs and 2.5 Mbits of memory fits the workload.
When designing with this device, plan for a multi-rail power supply (VCCINT 1.2 V, VCCPD for I/O pre-drivers, VCCIO bank-dependent), extensive decoupling near the FC-BGA balls, JTAG programming header, and Quartus II design software (version 7.2 or later). Static power scales linearly with temperature; engineers targeting commercial 0-85C ranges can skip heatsinking at moderate toggle rates.
This page synthesizes distributor pricing, drop-in Stratix II alternatives, and practical Quartus II design notes not found in the manufacturer datasheet alone, helping engineers sourcing EP2S60F672C3N for both new designs and legacy production reorders.
드롭인 대체품: EP2S60F672C3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2S60F672C3N (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, RoHS Status, Operating Temperature, PLLs.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2S60F672C3
✅ 드롭인✓ 재고 있음
$1033.14 / 개
데이터시트 보기 →EP2S60F67214N
✅ 드롭인✓ 재고 있음
$232 / 개
데이터시트 보기 →EP2S60F672C5N
✅ 드롭인✓ 재고 있음
$170 / 개
데이터시트 보기 →EP2S60F672C4N
✅ 드롭인✓ 재고 있음
$325 / 개
데이터시트 보기 →EP2S60F672I4N
✅ 드롭인✓ 재고 있음
$220 / 개
데이터시트 보기 →EP2S60F672C7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP2S60F672C3N 최대 정격 & 전기적 특성
| Family | Stratix II |
| Logic Elements (LE) | 60,440 |
| Logic Array Blocks (LABs) | 3,022 |
| Adaptive Logic Modules (ALMs) | 24,176 |
| Total Embedded Memory | 2,544,192 bits (2.5 Mbits) |
| User I/O Pins | 492 |
| User I/O Banks | 8 |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.2 V |
| I/O Supply Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Pre-Driver Supply (VCCPD) | 3.3 V |
| Maximum Internal Clock Frequency | 816.99 MHz |
| PLLs | 4 |
| Global Clock Networks | 16 |
| 패키지 | 672-pin FC-FBGA |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to +85C (commercial grade) |
| Speed Grade | C3 (slower speed grade) |
| RoHS 상태 | unknown |
| Lead-Free | unknown |
EP2S60F672C3N 핀 구성
| 핀 A1 | VCCIO_1 — I/O bank 1 supply voltage |
| 핀 B2 | I/O — User I/O pin (bank 1) |
| 핀 A26 | GND — Ground reference |
| 핀 AA27 | VCCINT — Core 1.2 V supply |
| 핀 AC1 | TDI — JTAG Test Data In |
| 핀 AB2 | TCK — JTAG Test Clock |
| 핀 AC26 | TMS — JTAG Test Mode Select |
| 핀 AB27 | TDO — JTAG Test Data Out |
| 핀 Y26 | nSTATUS — Configuration status |
| 핀 W25 | nCONFIG — Configuration control |
| 핀 V24 | DCLK — Configuration clock |
| 핀 U23 | DATA0 — Configuration data input |
| 핀 R22 | VCCPD — Pre-driver supply (3.3 V) |
일반적인 애플리케이션
EP2S60F672C3N 적합 용도: 6 애플리케이션s: Telecom Line-Card Glue Logic, ASIC Prototyping, DSP Front-End Processing, Video Broadcast Equipment, Industrial Imaging Systems, High-Speed Serial Protocol Bridging.
Telecom Line-Card Glue Logic
The EP2S60F672C3N fits telecom line-card designs where 60K logic elements and 12 transceivers must implement protocol bridging (UTOPIA, POS-PHY), packet classification, and traffic management under tight latency budgets. The 492 user I/O across 8 banks support parallel RapidIO, SPI-4.2, and external FIFO interfaces to network processors, while 2.5 Mbits of TriMatrix memory absorb packet bursts without external SSRAM. The 1.2 V VCCINT keeps power below 12 W typical even at 200 MHz toggle rates, acceptable for ATCA/AMC thermal envelopes.
추천
ASIC Prototyping
For ASIC prototyping, the EP2S60F672C3N's 60,440 logic elements, 3022 LABs, and 492 user I/O map most ASICs in the 500K-gate range with multi-clock domain support. The 90 nm process maintains timing fidelity to ASIC flow, while Quartus II's synthesis preserves RTL semantics for regression testing. Dedicated DSP blocks (up to 256 18x18 multipliers) accelerate multiply-intensive RTL without requiring soft cores, and the 1 Gbps LVDS capability mimics ASIC SERDES interfaces during bring-up.
추천
DSP Front-End Processing
The EP2S60F672C3N delivers DSP front-end performance through dedicated 18x18 multipliers and 2.5 Mbits of distributed memory for coefficient storage, enabling FIR filters, FFT engines, and radar pulse compression in radar, sonar, and software-defined radio front-ends. The 816 MHz internal clock supports 1 Gigasample/sec equivalent throughput per DSP block chain, while the 90 nm process provides adequate timing margin for pipelined multiply-accumulate paths up to 400 MHz.
추천
Video Broadcast Equipment
In broadcast video routers, format converters, and multiviewers, the EP2S60F672C3N provides the parallel pixel processing bandwidth required for HD-SDI (1.485 Gbps) routing, color-space conversion, and on-screen display overlay. Its 492 I/O support multiple SDI input/output streams simultaneously with embedded memory acting as line buffers for format scaling. LVDS pairs up to 1 Gbps handle DVB-ASI and SMPTE 259M/292M interfaces without external serializer/deserializer parts.
추천
Industrial Imaging Systems
For machine vision and medical imaging, the EP2S60F672C3N interfaces to Camera Link, LVDS-based image sensors, and CoaXPress via soft IP cores, providing real-time pixel processing for defect detection and image enhancement. The 2.5 Mbits of embedded memory suffice for line-buffer and kernel storage in 3x3 convolution engines, while 492 I/O accept parallel sensor data at 80 MHz pixel clock rates. Industrial-grade variants (EP2S60F672I4N) extend operation to -40C for factory-floor deployment.
추천
High-Speed Serial Protocol Bridging
The EP2S60F672C3N bridges between serial protocols such as RapidIO, PCIe (via soft IP), SerialLite II, and Gigabit Ethernet without external ASSPs, leveraging its dedicated SERDES support up to 1 Gbps and 8 banks of programmable I/O. In storage area network aggregation or military datalink applications, 2.5 Mbits of memory buffer packet headers while the 60K LE fabric handles encapsulation, encryption, and forward-error-correction algorithms. The industrial-temperature variant supports field-deployed rugged systems.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2S60F672C3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2S60F672C3 | EP2S60F67214N | EP2S60F672C5N | EP2S60F672I4N | EP2S60F672C7N |
|---|---|---|---|---|---|---|
| Package | 672-pin FC-FBGA | 672-pin FC-FBGA | 672-pin FC-FBGA | 672-pin FC-FBGA | 672-pin FC-FBGA | 672-pin FC-FBGA |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Speed Grade | C3 | C3 | C7 (slower) | C5 (faster) | C4 industrial | C7 (slowest) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | 0C to +85C |
| Lead-Free (N suffix) | Yes (N suffix) | No | Yes | Yes | Yes | Yes |
| User I/O | 492 | 492 | 492 | 492 | 492 | 492 |
| Lifecycle Status | NRNR (EOL 2026) | NRNR | NRNR | NRNR | NRNR | NRNR |
주요 차별점
- C3 speed grade within commercial 0-85C range (vs EP2S60F672C5N (C5 grade))
- Lead-free (Pb-free) N-suffix ball finish (vs EP2S60F672C3 (non-N, tin-lead))
- Mid-density 60K LE in 672-BGA package (vs EP2S90F1020C3N (90K LE, 1020-BGA))
- Commercial 0-85C operating range (vs EP2S60F672I4N (industrial -40C to +100C))
설계 노트
The EP2S60F672C3N requires four independent supplies: VCCINT (1.2 V core, up to 12 W typical), VCCPD (3.3 V pre-driver, required for JTAG and configuration I/O), VCCIO (per-bank 1.2-3.3 V for user I/O standards), and VCCA_PLL (1.2 V analog for PLL blocks). Bulk-decouple VCCINT with 220 uF tantalum plus 100 nF ceramic per quadrant; place 10 uF and 100 nF ceramic capacitors within 5 mm of every VCCINT ball group. Power-on sequencing: VCCINT must reach 1.0 V before VCCPD/VCCIO exceeds 2.0 V to avoid I/O latch-up. The Stratix II Hardware Reference (SII51002) recommends 1 ms minimum monotonic rise time.
At maximum toggle activity (~20% of LE utilization at 200 MHz), the EP2S60F672C3N dissipates up to 12 W from the 1.2 V core, concentrated in the center of the die. The FC-FBGA package requires thermal vias (0.3 mm diameter, 1.2 mm pitch array) directly under the central thermal balls to a 6-layer PCB inner copper plane. Without active airflow, junction-to-ambient thermal resistance is approximately 12 C/W, giving a 144 C temperature rise - exceeding commercial limits. Recommended layout: 4 thermal-via rows under the central ball grid connecting to an inner 2 oz copper pour; consider forced-air cooling for >50% utilization.
The 672-ball FC-FBGA uses 1.0 mm ball pitch and requires HDI PCB fabrication with microvia (0.1 mm) stack-up. Per the Stratix II AN 395 documentation, route all differential pairs (LVDS) with 100 ohm differential impedance and length matching within 20 mil; route all DDR2 DQS/DQ groups within 50 mil length match across 8 bits. The 8 I/O banks (each with independent VCCIO) must be kept on separate PCB routing layers if mixing 1.5 V SSTL and 3.3 V LVCMOS standards. Decoupling: 100 nF X7R ceramic under each bank, distributed across the package periphery.
Estimated: with 200 MHz toggling on 30% of LEs (~18K elements), core power dissipation is approximately (18K x 50 pF x 200 MHz x 1.2 V^2) = 2.6 W dynamic plus 4 W static at 85 C junction - total ~6.6 W. Engineers often forget that VCCPD must be present and stable before nCONFIG rises, otherwise the device enters unknown configuration state and may fail to enumerate on JTAG. Always include a JTAG reset supervisor (e.g., 4-pin header + 10 kohm pull-up on nCONFIG) for production programming.
규정 준수 정보
N suffix indicates Pb-free ball finish per Stratix II part-number decoding guide. RoHS/REACH/AEC-Q100 status not explicitly stated in provided web data; consult Intel compliance letter via iNRC program for full documentation. Not applicable for AEC-Q100 - this is a commercial FPGA, not an automotive-grade part.
