EP2SGX90EF1152I2N - 90,960 LEs Stratix II GX FPGA | Intel
부품 번호: EP2SGX90EF1152I2N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1580 | $158,000.00 |
| 500 | $1450 | $725,000.00 |
| 1,000 | $1320 | $1,320,000.00 |
EP2SGX90EF1152I2N 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks (memory, transceivers, PLLs, multipliers). It sits in the broader taxonomy of programmable logic devices -> logic ICs -> integrated circuits. FPGAs allow designers to implement arbitrary digital logic after manufacturing, providing time-to-market and design-revision flexibility that ASICs and microcontrollers cannot match for parallel, high-throughput workloads.
Key features of the EP2SGX90EF1152I2N include 4,548 Logic Array Blocks (LABs), embedded multiplier blocks for DSP, embedded memory (M512/M4K/M-RAM blocks totaling 4,520,448 bits), and dedicated high-speed transceivers. The device is built on a 1.2 V core with PLL-based clock management for multi-domain designs. The 1152-BBGA (FC-FBGA) flip-chip BGA package supports the high I/O count and signal-integrity requirements of multi-gigabit serial interfaces.
From an architectural standpoint, the Stratix II GX family uses an ALM-based logic fabric with 8-input fracturable look-up tables, supporting higher effective logic utilization than the older 4-input LUT architecture. Embedded transceivers and dedicated PHY hard IP allow line rates up to 6.375 Gbps depending on protocol, simplifying high-speed serial designs.
Typical applications include high-end serial backplanes, telecommunications line cards, software-defined radio (SDR), high-performance DSP and video processing, ASIC prototyping, and test and measurement equipment. The GX transceiver block is especially attractive for protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and custom serial links.
Design considerations include robust power-decoupling networks (the Stratix II GX requires multi-rail supply sequencing), thermal management via package-bottom heatsinking (FC-BGA exposes a die-side thermal interface), and PCB layout that meets the BGA escape and impedance-controlled routing requirements of the gigabit transceivers.
This page synthesizes current distributor pricing, drop-in family alternatives, and practical design notes not consolidated on the manufacturer's product page, with all data cross-referenced to live distributor listings as of 2026-09-09.
드롭인 대체품: EP2SGX90EF1152I2N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2SGX90EF1152I2N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature Grade, Transceivers, Operating Temperature, Series.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2SGX90EF1152I4N
✅ 드롭인✓ 재고 있음
$1550 / 개
데이터시트 보기 →EP2SGX90EF1152I5N
✅ 드롭인✓ 재고 있음
$1320 / 개
데이터시트 보기 →EP2SGX90EF1152C5N
✅ 드롭인✓ 재고 있음
$1380 / 개
데이터시트 보기 →EP2SGX90EF1152C4N
✅ 드롭인✓ 재고 있음
$695 / 개
데이터시트 보기 →EP2SGX90EF1152C3N
✅ 드롭인✓ 재고 있음
$1280 / 개
데이터시트 보기 →EP2SGX90EF1152C5
✅ 드롭인✓ 재고 있음
$225 / 개
데이터시트 보기 →EP2SGX90EF1152I2N 최대 정격 & 전기적 특성
| Family | Stratix II GX |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 90,960 |
| Logic Array Blocks (LABs) | 4,548 |
| Total Embedded RAM Bits | 4,520,448 bits |
| User I/Os | 558 |
| 패키지 | 1152-BBGA (FC-FBGA, flip-chip) |
| Core Voltage | 1.2 V |
| Operating Temperature Grade | Industrial (I2) |
| Process Node | 90 nm |
| Transceivers | Up to 12 high-speed serial channels (family spec) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
| 수명 주기 상태 | Active (Stratix II GX family) |
EP2SGX90EF1152I2N 1152-bbga (fc-fbga, flip-chip) 핀 구성 가이드
EP2SGX90EF1152I2N(1152-bbga (fc-fbga, flip-chip) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2SGX90EF1152I2N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2SGX90EF1152I2N 적합 용도: 6 애플리케이션s: Telecommunications Line Cards, Software Defined Radio (SDR), High-Performance DSP and Video Processing, ASIC Prototyping, Test and Measurement Equipment, Industrial Control and Networking Backplanes.
Telecommunications Line Cards
The EP2SGX90EF1152I2N fits mid-to-high-end telecom line cards because of its 90,960 logic elements combined with multi-gigabit transceivers and 558 user I/Os. In a typical line card the FPGA fabric implements MAC, framer, traffic manager, and OAM logic in parallel, while the GX transceivers drive SFP+/XFP optical modules at rates up to 6.375 Gbps. Industrial temperature grade makes the part suitable for central-office deployments with relaxed HVAC, and the 1152-BBGA package offers the signal integrity required for backplane serial links such as Serial RapidIO and Interlaken.
추천
Software Defined Radio (SDR)
Software-defined radio systems benefit from the EP2SGX90EF1152I2N's combination of 18x18 hardware multipliers, embedded RAM blocks, and parallel logic capacity for high-sample-rate DSP pipelines. The 4,520,448 bits of embedded memory are used as sample-rate conversion buffers and FFT working storage, while the gigabit transceivers digitize IF outputs to a host processor. Industrial temperature grade supports outdoor and vehicular SDR deployments, and the 1152-BBGA package supports the dense interconnect required to interface high-speed ADCs and DACs.
추천
High-Performance DSP and Video Processing
The EP2SGX90EF1152I2N delivers tens of GMACs of DSP throughput for video codec, image processing, and radar pipelines. Its multiplier blocks handle H.264, JPEG2000, and FFT kernels, while the embedded RAM buffers video frames without external DDR. The 558 user I/Os accept parallel camera-link or LVDS inputs and drive HDMI/DVI output bridges. Industrial temperature grade lets the same hardware serve outdoor surveillance, automotive test rigs, and broadcast equipment, with the 1152-BBGA package supporting the high pin-count parallel video interfaces.
추천
ASIC Prototyping
ASIC prototyping is a classic application for the EP2SGX90EF1152I2N: the 90,960 logic elements map reasonably large ASIC RTL blocks, and the embedded transceivers emulate high-speed ASIC PHYs. Multi-FPGA partitioning is supported by the 558 user I/Os, which carry inter-FPGA signals between prototyping boards. Industrial temperature grade allows prototype boards to operate in non-air-conditioned labs, and Quartus II provides strong ASIC-pro design-flow support with gate-level netlist ingestion.
추천
Test and Measurement Equipment
Test and measurement instruments leverage the EP2SGX90EF1152I2N's transceivers to drive protocol analyzers, BERTs, and logic analyzers operating at multi-gigabit rates. The logic fabric implements custom protocol decoding, statistics counters, and trigger engines. Industrial temperature grade extends deployment into production-floor ATE and field-test gear. The 1152-BBGA package provides the high I/O count required to interface to multiple instrument front ends simultaneously, and the Quartus II tool chain simplifies time-domain closure for high-throughput pipelines.
추천
Industrial Control and Networking Backplanes
Industrial control cabinets and high-speed backplanes use the EP2SGX90EF1152I2N as a flexible I/O and protocol translator. The FPGA can implement EtherCAT, PROFINET, SERCOS III, or custom real-time fieldbuses, while the embedded transceivers bridge to gigabit uplinks. Industrial temperature grade (I2) is critical for factory-floor environments with elevated ambient temperatures, and the 1152-BBGA package supports the dense pin-out required to terminate multiple fieldbus channels and backplane serial links in parallel.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2SGX90EF1152I2N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2SGX90EF1152I4N | EP2SGX90EF1152I5N | EP2SGX90EF1152C5N | EP2SGX90EF1152C4N | EP2SGX90EF1152C3N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-BBGA (FC-FBGA) | 1152-BBGA (FC-FBGA) - same | 1152-BBGA (FC-FBGA) - same | 1152-BBGA (FC-FBGA) - same | 1152-BBGA (FC-FBGA) - same | 1152-BBGA (FC-FBGA) - same |
| Logic Elements | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 |
| User I/Os | 558 | 558 | 558 | 558 | 558 | 558 |
| Embedded RAM Bits | 4,520,448 bits | 4,520,448 bits | 4,520,448 bits | 4,520,448 bits | 4,520,448 bits | 4,520,448 bits |
| Temperature Grade | Industrial (I2) | Industrial (I4) | Industrial (I5) | Commercial | Commercial | Commercial |
| Speed Grade | 2 (I2 family) | 4 | 5 | 5 | 4 | 3 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Transceivers (family) | Up to 12 multi-gigabit | Up to 12 multi-gigabit | Up to 12 multi-gigabit | Up to 12 multi-gigabit | Up to 12 multi-gigabit | Up to 12 multi-gigabit |
주요 차별점
- Industrial (I2) temperature grade with same die as commercial variants (vs EP2SGX90EF1152C5N)
- Full 90,960 logic element density (vs EP2SGX60EF1152I3N)
- High-density 1152-BBGA package supports maximum I/O (vs EP2S90F780I4N (780-pin BGA sibling))
- Integrated multi-gigabit transceivers (vs EP2S90F1508I4N (non-GX Stratix II))
설계 노트
The Stratix II GX EP2SGX90EF1152I2N requires multiple supply rails (VCCINT core 1.2 V, VCCIO banks, VCCA_PLL, VCC transceiver analog, VCCAUX). Sequence the rails per the device handbook: bring up VCCINT before VCCIO and VCCA, and enable transceivers only after their analog supply stabilizes. Use the dedicated PLL filter networks as specified; substituting standard ferrite beads causes excessive PLL jitter and degrades multi-gigabit link margin.
A flip-chip BGA package dissipates heat through the die into the package top, not through PCB balls. Attach a heatsink or heat-spreader with thermal interface material (TIM) to the package lid for any design running above 50% transceiver utilization or at industrial temperature. Estimated: at 1.0 W core dissipation plus 4 active transceivers, the junction temperature rise is roughly 15C with a properly mounted heatsink and 35C without - confirm in the device handbook theta_JC and theta_JB values before finalizing the thermal solution.
Escape a 1152-BBGA with microvia-in-pad stack-up using 0.4 mm or 0.5 mm pitch fan-out. Maintain 100-ohm differential impedance for the gigabit transceiver lanes, with intra-pair skew below 1 ps per cm. Keep reference planes continuous under transceiver ball rows to prevent impedance discontinuities; break reference only when a high-speed lane must transition layers, and stitch ground vias around each signal transition. Follow the Altera/Allegro reference pin-out file for the recommended decoupling capacitor placement.
For multi-gigabit transceivers, route each lane with matched-length differential pair, controlled skew to the reference clock, and AC-coupling capacitors of 100 nF placed close to the transmitter. Use IBIS-AMI models from Altera/Intel for channel simulation before committing to PCB fabrication; do not assume that the Stratix II GX pre-emphasis defaults are sufficient for backplane channels longer than 20 inches. Pre-tap and post-tap coefficients must be tuned per channel and verified with a BERT during board bring-up.
Do not reuse Quartus II assignments between I2 and C-speed grades without re-compiling - timing models differ and bitstream generation will fail or, worse, produce a working but unreliable design. Also verify that all transceiver reference clocks come from PLL-driven dedicated clock inputs, not regular GPIO; GPIO toggling cannot meet the jitter requirement of multi-gigabit links. Finally, the configuration flash should store separate images for engineering and production bitstreams to simplify field updates.
규정 준수 정보
RoHS and lead-free per Altera/Intel product marking. AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive-grade part. Conflict-minerals compliance per Intel corporate policy.
