EP2SGX90EF1152I4 - Stratix II GX FPGA, 90K LE, 1152-BGA | Intel / Altera
부품 번호: EP2SGX90EF1152I4 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5123.86 | $5,123.86 |
| 10 | $4795 | $47,950.00 |
| 100 | $4310 | $431,000.00 |
| 500 | $3990 | $1,995,000.00 |
| 1,000 | $3750 | $3,750,000.00 |
EP2SGX90EF1152I4 개요
An FPGA (Field-Programmable Gate Array) is a programmable logic device that consists of an array of configurable logic blocks (LABs/CLBs), embedded memory blocks, DSP blocks, routing interconnects, and I/O cells - all of which can be reconfigured by the customer after manufacture. FPGAs sit between general-purpose microcontrollers and ASICs in the design flexibility-vs-performance trade-off, with Stratix II GX specifically positioned for high-speed serial connectivity (multi-gigabit transceivers) and DSP-intensive designs.
Key features of the EP2SGX90EF1152I4 include 4,548 LABs/CLBs, 452 user I/O pins, dedicated multiplier blocks and DSP hardware, 12 embedded transceivers supporting multi-gigabit serial protocols (PCI Express, Serial RapidIO, Gigabit Ethernet, XAUI), and dedicated PLL clock management blocks. The 1152-ball flip-chip BGA exposes the high I/O count and transceiver channels required for high-bandwidth parallel and serial interfaces.
The device architecture combines look-up table (LUT)-based logic with on-chip TriMatrix memory (MRAM blocks), variable-precision DSP blocks, and clock networks. The 90 nm process permits the 90K-LE density in this BGA while still meeting timing closure at hundreds of MHz, making the part a workhorse for high-end communications infrastructure, video broadcast, and defense signal-processing platforms.
Typical applications include high-speed serial protocol bridging (PCIe Gen1/Gen2 endpoints, Serial RapidIO switches, XAUI/10G Ethernet MACs), software-defined radio baseband, ASIC prototyping, ASIC and ASSP emulation, video and image processing pipelines, and high-performance DSP coprocessors. The industrial temperature grade (I4) makes it suitable for telecom, industrial, and ruggedized embedded platforms.
Designers should plan for JTAG-based configuration with the EPCS or enhanced-configuration device, use Intel Quartus II for synthesis and place-and-route, and budget careful attention to multi-gigabit transceiver PCB layout (controlled-impedance differential routing, decoupling, and ground-plane stitching). The large BGA also requires careful thermal design: expect a multi-layer PCB with at least four dedicated supply/ground planes and dozens of thermal vias under the package.
This page synthesizes distributor pricing, drop-in same-family variants, and practical design notes that complement the manufacturer datasheet. Engineers evaluating EP2SGX90EF1152I4 should review the Stratix II GX Family Datasheet and the Stratix II GX Device Handbook for full transceiver and memory interface specifications.
드롭인 대체품: EP2SGX90EF1152I4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2SGX90EF1152I4 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Transceivers, Total RAM Bits, Operating Temperature, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2SGX90EF1152I3
✅ 드롭인✓ 재고 있음
$1480 / 개
데이터시트 보기 →EP2SGX90EF1152I3N
✅ 드롭인✓ 재고 있음
$1320 / 개
데이터시트 보기 →EP2SGX90EF1152I2N
✅ 드롭인✓ 재고 있음
$1320 / 개
데이터시트 보기 →EP2SGX90EF1152C5N
✅ 드롭인✓ 재고 있음
$1380 / 개
데이터시트 보기 →EP2SGX90EF1152C5ES
✅ 드롭인✓ 재고 있음
$1495 / 개
데이터시트 보기 →EP2SGX90EF1152C5
✅ 드롭인✓ 재고 있음
$225 / 개
데이터시트 보기 →EP2SGX90EF1152C4N
✅ 드롭인✓ 재고 있음
$695 / 개
데이터시트 보기 →EP2SGX90EF1152C4ES
✅ 드롭인✓ 재고 있음
$305 / 개
데이터시트 보기 →EP2SGX90EF1152I4 최대 정격 & 전기적 특성
| Family | Stratix II GX |
| Series | Stratix II |
| Logic Elements (LE) | 90,960 |
| LABs/CLBs | 4,548 |
| Total Memory Bits | 4,520,448 |
| User I/O Count | 558 |
| Operating Temperature Grade | Industrial (I4): -40C to +100C |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm |
| Maximum Internal Clock Frequency | 732.1 MHz |
| 패키지 | 1152-ball FC-FBGA |
| 실장 유형 | Surface Mount (BGA) |
| Integrated Transceivers | Yes (multi-gigabit, Stratix II GX family feature) |
EP2SGX90EF1152I4 1152-ball fc-fbga 핀 구성 가이드
EP2SGX90EF1152I4(1152-ball fc-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2SGX90EF1152I4.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2SGX90EF1152I4 적합 용도: 7 애플리케이션s: PCI Express Endpoint and Bridge, Software-Defined Radio Baseband, ASIC Prototyping and Emulation, High-Speed Serial Protocol Bridging, Video and Image Processing Pipelines, Telecom and Industrial Control, High-Performance DSP Coprocessor.
PCI Express Endpoint and Bridge
The EP2SGX90EF1152I4 fits PCIe Gen1/Gen2 endpoint designs because its integrated multi-gigabit transceivers natively support the PCIe protocol with the required encoding, clocking, and channel bonding. The 90K logic elements and 4.5 Mbit embedded memory allow the FPGA to implement a soft PCIe IP core plus endpoint application logic in a single device. With 558 user I/O, engineers can also bridge PCIe to local bus interfaces, DDR2 memory, or custom parallel peripherals without external glue logic. The industrial temperature grade (I4) supports telecom and industrial backplane deployments.
추천
Software-Defined Radio Baseband
The EP2SGX90EF1152I4 is widely deployed in SDR baseband signal processing chains because of its 90K logic elements, dedicated DSP blocks, and integrated transceivers for ADC/DAC digital interfaces or RF front-end links. The 4.5 Mbit embedded memory is sufficient for sample buffering and FFT windowing, while the high I/O count lets the FPGA interface to multi-channel ADC/DAC pairs in parallel. The 732.1 MHz internal clock rate supports wideband demodulation. The I4 industrial temperature grade is essential for outdoor or ruggedized SDR deployments in tactical and cellular infrastructure.
추천
ASIC Prototyping and Emulation
The EP2SGX90EF1152I4 with 90,960 logic elements is sized to map large ASIC blocks for hardware/software co-verification, often used in arrays of two or four FPGAs for million-gate ASIC prototypes. The 558 user I/O pins provide the inter-FPGA and chip-to-chip channels needed to partition a large design across multiple devices. The integrated transceivers support high-speed serial links between prototyping boards. Quartus II provides the design partitioning and pin-multiplexing tools required to map ASIC RTL onto Stratix II GX FPGAs efficiently.
추천
High-Speed Serial Protocol Bridging
The EP2SGX90EF1152I4 supports Serial RapidIO, XAUI, 10G Ethernet MAC, and other multi-gigabit protocols using its integrated transceivers. Protocol bridging between RapidIO and Ethernet, or between PCIe and Serial RapidIO, is a common application where the FPGA acts as a switch or bridge chip. The 90K logic elements accommodate full MAC plus forwarding logic, while the 4.5 Mbit embedded memory handles packet buffering. The 1152-FBGA exposes the high I/O and transceiver channels needed for these multi-link designs.
추천
Video and Image Processing Pipelines
The EP2SGX90EF1152I4 is suited for multi-stream HD video processing because of its high DSP block count, embedded memory bandwidth, and 558 user I/O that can carry multiple DVI/HDMI/SDI data paths into the device. Real-time video scaling, deinterlacing, color space conversion, and compression (H.264/MPEG) can be implemented in logic plus DSP. The 4.5 Mbit embedded memory is used for line buffering. Industrial temperature grade (I4) supports broadcast and surveillance deployments where ambient temperatures vary widely.
추천
Telecom and Industrial Control
The EP2SGX90EF1152I4 fits telecom line cards and industrial control systems where deterministic, low-latency logic and DSP are required alongside high-speed serial backplane links. The 90K logic elements accommodate complex state machines, protocol stacks, and DSP filters, while the integrated transceivers connect to backplane fabrics (XAUI/SFI). The I4 industrial temperature grade (-40C to +100C) meets telecom NEBS and industrial cabinet environmental specs. The 1152-FBGA is designed for high-density line-card PCB layouts.
추천
High-Performance DSP Coprocessor
The EP2SGX90EF1152I4 can be paired with a host CPU as a DSP coprocessor for FFT, FIR, matrix multiply, or video codec acceleration, using its dedicated DSP blocks and embedded memory bandwidth. The 732.1 MHz internal clock supports sustained gigabit-rate processing. The integrated transceivers enable high-throughput host links (PCIe, Serial RapidIO) without external bridge chips. The industrial temperature grade (I4) allows deployment in outdoor or factory-floor coprocessor cards.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2SGX90EF1152I4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2SGX90EF1152I3 | EP2SGX90EF1152C5N | EP2SGX90EF1152C4N |
|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 1152-FBGA | 1152-FBGA - same | 1152-FBGA - same | 1152-FBGA - same |
| Logic Elements | 90,960 | 90,960 | 90,960 | 90,960 |
| LABs/CLBs | 4,548 | 4,548 | 4,548 | 4,548 |
| Total Memory Bits | 4,520,448 | 4,520,448 | 4,520,448 | 4,520,448 |
| User I/O | 558 | 558 | 558 | 558 |
| Temperature Grade | Industrial I4 (-40C to +100C) | Industrial I3 | Commercial C5 (0C to +85C) | Commercial C4 (0C to +85C) |
| RoHS Status (N suffix) | Without N suffix (legacy) | Without N (I3 base) / I3N (RoHS) | With N (RoHS-compliant) | With N (RoHS-compliant) |
| Integrated Transceivers | Yes (Stratix II GX feature) | Yes | Yes | Yes |
| Max Internal Clock | 732.1 MHz | 732.1 MHz | 732.1 MHz | 732.1 MHz |
주요 차별점
- Highest industrial-grade I4 temperature variant in the 90K-LE Stratix II GX family with 1152-FBGA footprint (vs EP2SGX90EF1152C5N (commercial grade))
- Same 1152-FBGA package as lower-cost commercial variants, enabling one PCB to support I4/C5/C4 qualification (vs EP2SGX130GF1508I4 (130K LE))
- Industrial I4 temperature grade -40C to +100C suitable for telecom/industrial deployment (vs EP2S90F1020I4 (Stratix II non-GX))
- 90,960 logic elements provide 50% more capacity than the EP2SGX60 in the same package (vs EP2SGX60EF1152I4)
설계 노트
The 1152-ball FC-FBGA requires a multi-layer PCB (typically 8 to 12 layers) with dedicated ground and supply planes under the package. Use a 1.0 mm or 1.27 mm pitch BGA land pattern per JEDEC MS-026. Escape routing on the top layer must fan out at 45-degree angles from each row, with via-in-pad recommended for inner rows. A minimum 4-layer stackup (SIG/GND/PWR/SIG) is acceptable for lower-speed designs, but transceiver channels require at least 6 to 8 layers with continuous ground reference planes beneath all high-speed traces.
Estimated: at full logic utilization (~80%) and 558 active I/O switching at moderate frequency, the EP2SGX90EF1152I4 dissipates roughly 5 to 8 W. The FC-FBGA package exposes the die directly to a thermal lid; use a heat sink with thermal interface material or a high-performance thermal pad. Place at least 30 thermal vias in a 1.0 mm grid under the central die area, stitching to internal ground planes. Without adequate thermal relief, junction temperature may exceed 100C in sealed enclosures.
Multi-gigabit transceiver channels require 100-ohm differential controlled-impedance routing, length matching within the transceiver-pair tolerance (typically under 5 mil), and continuous reference ground beneath each trace. Use AC-coupling capacitors at the transmitter output as required by the protocol. Decouple each transceiver supply pin with 0.1 uF and 10 uF capacitors placed within 100 mil. Avoid routing signals across plane splits near the transceiver channels, and use stitching vias every lambda/20 along the edges of the differential pairs.
The Stratix II GX device requires multiple supply rails: VCCINT (1.2 V core), VCCIO (per-bank I/O voltage, 1.2 V to 3.3 V), VCCPD (3.3 V or 2.5 V pre-driver), VCCA (2.5 V analog PLL/transceiver), VCCD_PLL (1.2 V PLL digital). Each rail must be decoupled close to its pin with bulk and bypass capacitors. Power-on sequencing requires VCCINT before VCCIO; consult the Stratix II GX Device Handbook Power Management chapter for the required sequencing and ramp rates to avoid long-term reliability issues.
Common pitfalls include (1) forgetting to release the nCONFIG pin to logic high after power-up, causing the device to remain in configuration reset; (2) omitting the JTAG chain TMS pull-up, which leaves the device in an undefined state; (3) using the wrong configuration mode (AS, AP, PS, FPP) for the EPCS device; (4) leaving unused I/O pins floating instead of setting them to tri-state with weak pull-up; (5) mixing Stratix II and Stratix II GX configuration schemes. Always verify the Quartus II device programmer recognizes the part before attempting to load a design.
규정 준수 정보
EP2SGX90EF1152I4 base part is from the legacy Altera Stratix II GX generation; N-suffixed variants (e.g. EP2SGX90EF1152I4N, where available) indicate RoHS-compliant lead-free builds. The I4 industrial temperature grade is NOT AEC-Q100 qualified; this part is not intended for automotive under-hood or safety-critical applications. Exact RoHS/REACH compliance data was not present in the provided distributor data and is marked as unknown.