EP2SGX90GF1020 - Stratix II GX FPGA, 90K LE, 1020-Pin FCBGA | Altera
부품 번호: EP2SGX90GF1020 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1200 | $1,200.00 |
| 10 | $1150 | $11,500.00 |
| 100 | $1095 | $109,500.00 |
| 500 | $1040 | $520,000.00 |
| 1,000 | $990 | $990,000.00 |
EP2SGX90GF1020 개요
A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit containing programmable logic blocks, routing interconnect, and embedded hard IP such as transceivers, block RAM, and DSP blocks. FPGAs sit within the semiconductor hierarchy as programmable logic devices -> reconfigurable digital ICs -> integrated circuits, and are used for prototyping, signal processing, and ASIC replacement where high parallelism, deterministic latency, or post-fabrication design changes are required.
Key features of the EP2SGX90GF1020 include up to 12 transceiver channels at 3.125 Gbps, dedicated hardware multipliers for DSP, support for external memory interfaces including DDR/DDR2/QDRII, and a flexible phase-locked loop (PLL) network with up to 12 PLLs. The Stratix II GX family targets high-speed serial I/O applications such as backplane transceivers, chip-to-chip links, and protocol bridging.
Architecture-wise the device uses an ALM-based fabric with eight-input fracturable lookup tables, embedded RAM blocks (M512/M4K/M-RAM tiers), and hard IP for PCI Express (x1/x4) and Gigabit Ethernet MAC. The transceiver blocks include built-in serializer/deserializer (SERDES), 8B/10B encoding, and word alignment, eliminating the need for external physical-layer chips on common protocols.
Typical applications include high-speed serial protocol bridging, communications backplane aggregation, military/aerospace signal processing, test and measurement equipment, and video broadcast infrastructure. The integrated transceivers make it especially suitable for Serial RapidIO, XAUI, PCIe, and custom proprietary links.
When designing with the EP2SGX90GF1020, plan for a multi-layer PCB (typically 8-12 layers) with controlled-impedance 100-ohm differential traces for transceiver channels and a solid ground reference plane; power decoupling requires multiple bulk and ceramic capacitors placed close to each ball grid array region per Stratix II GX handbook guidance.
This page synthesizes distributor pricing tiers, drop-in same-package alternatives, and practical layout notes that are not consolidated in the manufacturer handbook, providing a single reference for engineers evaluating the EP2SGX90GF1020 for new designs or legacy board sustainment.
드롭인 대체품: EP2SGX90GF1020 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2SGX90GF1020C5
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP2SGX90GF1020C4
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP2SGX90GF1020C3
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP2SGX90GF1020I5
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP2SGX90GF1020I4
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP2SGX90GF1020 최대 정격 & 전기적 특성
| Family | Stratix II GX |
| Logic Elements | 90,560 (approx.) |
| Embedded Memory | Up to 4.5 Mbits |
| Transceiver Channels | Up to 12 channels |
| Transceiver Data Rate | Up to 3.125 Gbps |
| Process Technology | 90 nm |
| 패키지 | 1020-ball FCBGA (FineLine BGA) |
| Number of PLLs | Up to 12 |
| Memory Interface Support | DDR, DDR2, QDRII, RLDRAM |
| Hard IP | PCI Express (x1/x4), Gigabit Ethernet MAC, SERDES |
| 실장 유형 | Surface Mount (BGA) |
| Configuration Method | JTAG, Passive Serial, Fast Passive Parallel |
EP2SGX90GF1020 1020-ball fcbga (fineline bga) 핀 구성 가이드
EP2SGX90GF1020(1020-ball fcbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2SGX90GF1020.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2SGX90GF1020 적합 용도: 6 애플리케이션s: High-Speed Serial Protocol Bridge, Telecom Backplane Aggregation, Military and Aerospace Signal Processing, Test and Measurement Equipment, Video Broadcast Infrastructure, Industrial Control and Automation.
High-Speed Serial Protocol Bridge
The EP2SGX90GF1020 is well suited to multi-protocol bridge applications where incoming 3.125 Gbps serial streams must be aggregated and converted to lower-speed parallel interfaces such as PCIe or memory-mapped buses. Its 12 integrated transceivers (3.125 Gbps each) and 90K logic elements provide enough fabric for protocol state machines, buffer management, and 8B/10B encoding/decoding on a single die. The hard SERDES blocks eliminate external PHY complexity and reduce BOM cost. Designers typically place the FPGA between line-card SERDES and a host ASIC or CPU, using the 4.5 Mbit embedded RAM for packet buffering. Compared with discrete SERDES-plus-FPGA solutions, the integrated transceiver approach reduces board area by approximately 40 percent.
추천
Telecom Backplane Aggregation
The EP2SGX90GF1020 was widely deployed in carrier-grade backplane systems where multiple XAUI or Serial RapidIO lanes needed aggregation at line-card interfaces. The 1020-ball FCBGA package supports the high pin count required for parallel fabric interfaces alongside the 12 transceiver channels, enabling 24+ Gbps aggregate bandwidth per device. The 12 PLLs provide independent clock domains for each aggregation port, simplifying multi-rate system design. Industrial temperature grades of the device are commonly used in outdoor or uncontrolled-environment telecom cabinets. Sustaining legacy telecom equipment with this FPGA is a typical long-lifecycle use case.
추천
Military and Aerospace Signal Processing
Defense and aerospace integrators specified the EP2SGX90GF1020 for radar signal processing, electronic warfare subsystems, and secure communications equipment because of its high logic density, integrated transceivers for sensor interfacing, and availability in military temperature grades. The 90,560 logic elements support parallel DSP pipelines processing tens of MSPS of I/Q data, while the transceiver channels handle digital-RF links to ADC/DAC mezzanines. Long-life defense programs rely on the part's mature ecosystem of validated reference designs and IP cores. Sustainment through secondary-market suppliers is a standard procurement strategy for these programs.
추천
Test and Measurement Equipment
High-end oscilloscopes, logic analyzers, and protocol testers used the EP2SGX90GF1020 as the central waveform-processing engine because of its combination of logic density, embedded memory, and 3.125 Gbps transceivers for instrument synchronization. The 4.5 Mbit embedded RAM enables deep waveform capture buffers, while the ALM fabric supports parallel DSP operations for FFT, filtering, and trigger detection in real time. The multi-gigabit transceivers allow the instrument to expose high-speed test ports without external SERDES chips. Designers appreciated the Quartus II tool flow for rapid prototype iteration in this application segment.
추천
Video Broadcast Infrastructure
Studio-grade video routers, format converters, and broadcast monitoring equipment leveraged the EP2SGX90GF1020's high logic density and SERDES channels to handle uncompressed HD-SDI, 3G-SDI, and emerging 4K video streams. The 12 transceiver channels easily accommodate multiple bi-directional SDI links operating at 2.97 Gbps each, with logic-element headroom for color-space conversion and frame-rate adaptation. The 1020-ball FCBGA package supports the high pin count required for parallel video bus interfaces. Sustaining legacy broadcast equipment installed before 2015 is a common long-life use case for this part.
추천
Industrial Control and Automation
Factory automation controllers and motion-control platforms specified the EP2SGX90GF1020 for high-speed deterministic processing of multi-axis servo loops and fieldbus communications. The ALM-based fabric delivers predictable timing critical for control loops, while the integrated transceivers support EtherCAT, SERCOS III, and proprietary real-time Ethernet variants. Industrial temperature grades of the device operate reliably in factory-floor environments from -40C to +100C. Legacy automation equipment with 15-20 year service life continues to use this part via authorized broker channels.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2SGX90GF1020 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2SGX90GF1020C5 | EP2SGX90GF1020C4 | EP2SGX90GF1020C3 | EP2SGX90GF1020I5 | EP2SGX90GF1020I4 |
|---|---|---|---|---|---|---|
| Package | FCBGA-1020 (1.0 mm pitch) | FCBGA-1020 - same | FCBGA-1020 - same | FCBGA-1020 - same | FCBGA-1020 - same | FCBGA-1020 - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 90,560 | 90,560 | 90,560 | 90,560 | 90,560 | 90,560 |
| Transceiver Channels | 12 | 12 | 12 | 12 | 12 | 12 |
| Transceiver Data Rate | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps |
| Embedded Memory | Up to 4.5 Mbits | Up to 4.5 Mbits | Up to 4.5 Mbits | Up to 4.5 Mbits | Up to 4.5 Mbits | Up to 4.5 Mbits |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Integrated 3.125 Gbps SERDES eliminates external PHY chips (vs EP2S90F1020C5 (non-transceiver Stratix II))
- Largest logic density available with Stratix II GX FCBGA-1020 (vs EP2SGX60EF1152C5)
- Pin-compatible with the entire EP2SGX90 GF1020 speed-grade family (vs EP2SGX130GF1508C5 (higher-density variant))
설계 노트
The 1020-ball FCBGA package with 1.0 mm pitch requires a multi-layer PCB with 8-12 layers, microvia or laser-drilled via fabrication, and an HDI stack-up. Follow Altera's BGA layout guidelines: power and ground balls require direct via connection to internal planes, and signal layers should maintain 100-ohm differential impedance for the 12 transceiver channels. Recommended microvia aspect ratio is below 1:1 to ensure reliable plating; back-drilled vias are advised for high-speed signals to reduce stub effects. Post-reflow X-ray inspection is mandatory for production boards.
Estimated: With 90,560 logic elements and 12 transceivers running at 3.125 Gbps, the EP2SGX90GF1020 core current draw can reach several amps. Use a multi-rail power supply with VCCINT, VCCA, VCCD_PLL, and VCCIO rails per the Stratix II GX handbook. Bulk decoupling requires a minimum of 4 x 22 uF tantalum or polymer capacitors plus 0.1 uF and 0.01 uF ceramic capacitors placed close to every power ball cluster. Power sequencing must follow Altera's recommended order to avoid latch-up during hot-plug events. Use a power-tree spreadsheet to size the regulator for worst-case transceiver utilization.
Maintain a continuous ground reference plane under all 100-ohm differential transceiver traces to control impedance and minimize EMI. Route each transceiver channel as a matched-length differential pair with intra-pair skew below 1 ps and pair-to-pair skew below 50 ps. AC-coupling capacitors (0.01 uF) must be placed on each transmit pair at the FPGA end. Reference the Stratix II GX Device Handbook Chapter 6 for recommended channel loss budgets at 3.125 Gbps. Avoid routing any high-speed signal across plane splits to prevent return-path discontinuities.
규정 준수 정보
RoHS/REACH compliance data was not available in the verified web data. AEC-Q100 does not apply because this is an FPGA, not an automotive-qualified IC. Conflict-minerals compliance assumed per Altera's standard corporate policy.
