EP3C55F484C8 - Cyclone III FPGA, 55K LEs, 484-FBGA | Intel
부품 번호: EP3C55F484C8 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $195.53 | $195.53 |
| 10 | $178.5 | $1,785.00 |
| 100 | $162.2 | $16,220.00 |
| 250 | $149.75 | $37,437.50 |
| 500 | $138.4 | $69,200.00 |
EP3C55F484C8 개요
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory and DSP blocks that can be reconfigured by the end user. FPGAs sit at the top of the digital IC hierarchy: programmable logic -> programmable logic device -> digital IC -> semiconductor. Cyclone III FPGAs specifically target applications that need abundant logic, moderate DSP, and low static power consumption without the cost of high-end transceivers or hardcore processors.
Key features of the EP3C55F484C8 include 55,856 logic elements (LEs), 312 embedded 18x18 multipliers (DSP blocks), 2,396,160 bits of embedded SRAM, four phase-locked loops (PLLs), 20 global clock networks, and 327 general-purpose I/Os that support LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards. The device supports configuration via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes, and is supported by Intel Quartus® Prime / Quartus II design software.
Architecturally, the Cyclone III family uses a low-k 65-nm process that lowers dynamic and static power versus Cyclone II by up to 50 percent. The 484-pin FBGA (23 x 23 mm body, 1.0 mm ball pitch, 2.60 mm height) provides dense board integration with lead-free Pb-free terminations, and the commercial speed grade -8 corresponds to a tighter timing margin than -7 or -6 variants.
Typical applications include industrial motor control and machine vision, video processing and display bridging, communications protocol bridging, test and measurement equipment, and embedded control with soft-core processors such as Nios II. The 484-FBGA footprint and abundant I/O count make this specific variant well suited to designs requiring many parallel buses or LVDS channels.
When designing with this part, verify that the Quartus II / Quartus Prime device support file for Cyclone III EP3C55 is installed. Because Cyclone III is a mature, mature product family, engineers should confirm long-term availability through Intel's product lifecycle documents or authorized distributors before committing to high-volume production.
This page synthesizes distributor pricing, drop-in-compatible alternatives (same-brand and cross-brand), and practical design notes beyond what is in the manufacturer datasheet, giving engineers a single reference for selection and procurement.
드롭인 대체품: EP3C55F484C8 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3C55F484C8 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Speed Grade, Lead-Free / RoHS, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3C55F484C7N
✅ 드롭인✓ 재고 있음
$52.75 / 개
데이터시트 보기 →EP3C55F484C6N
✅ 드롭인✓ 재고 있음
$148.7 / 개
데이터시트 보기 →EP3C55F484C7
✅ 드롭인✓ 재고 있음
$52.95 / 개
데이터시트 보기 →EP3C55F484C6
✅ 드롭인✓ 재고 있음
$222 / 개
데이터시트 보기 →EP3C55U484C8N
✅ 드롭인✓ 재고 있음
$119.85 / 개
데이터시트 보기 →EP3C55F484C8 최대 정격 & 전기적 특성
| Device Family | Cyclone® III |
| Logic Elements (LEs) | 55,856 |
| Logic Array Blocks (LABs) | 3,491 |
| Embedded Memory Bits | 2,396,160 bits |
| Embedded 18x18 Multipliers | 312 |
| User I/Os | 327 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Maximum Core Frequency | 472.5 MHz |
| Process Technology | 65 nm low-power CMOS |
| 패키지 | 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch, 2.60 mm height |
| Speed Grade | C8 (commercial, -8) |
| 동작 온도 | Commercial (0C to +85C) |
| Configuration Modes | JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS) |
| Lead-Free / RoHS | Yes (Pb-free FBGA) |
| 공급 전압 | Core 1.2 V typical, I/O bank dependent |
| I/O Standards Supported | LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI, and others |
EP3C55F484C8 484-ball fbga (fbga-484), 23 x 23 mm, 1.0 mm pitch, 2.60 mm height 핀 구성 가이드
EP3C55F484C8(484-ball fbga (fbga-484), 23 x 23 mm, 1.0 mm pitch, 2.60 mm height 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3C55F484C8.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3C55F484C8 적합 용도: 6 애플리케이션s: Industrial Motor Control & Drives, Machine Vision & Video Bridging, Communications Protocol Bridging, Test & Measurement Instrumentation, Display Controllers & Video Walls, Embedded Control with Nios II Soft-Core.
Industrial Motor Control & Drives
The EP3C55F484C8 fits industrial motor control because its 312 embedded 18x18 multipliers deliver the throughput needed for field-oriented control (FOC), space-vector PWM, and encoder interface logic on a single chip. With 327 user I/Os, designers can connect multiple Hall sensors, quadrature encoders, resolver-to-digital converters, and CAN/RS-485 communication ports without external logic. The commercial 0C to +85C range covers most indoor cabinet environments, and the 65-nm low-power Cyclone III process keeps standby dissipation low for always-on factory automation. Engineers typically pair it with external gate drivers and current-sense amplifiers, while the FPGA handles the control loop math and safety state machines.
추천
Machine Vision & Video Bridging
The EP3C55F484C8's 2,396,160 bits of embedded memory buffer mid-size image frames and video streams, while 327 I/Os accept parallel Camera Link or LVDS image-sensor channels without external bridge ICs. The 472.5 MHz core frequency supports real-time pixel pipelines for edge detection, color conversion, and histogram-based quality inspection. Designers often instantiate soft MIPI-CSI or HDMI bridge IPs and pair the FPGA with external DDR/DDR2 memory for frame buffering. The 484-FBGA footprint keeps the PCB compact for industrial camera boards, and Quartus II IP libraries accelerate development of common vision pipelines.
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Communications Protocol Bridging
The EP3C55F484C8 is well suited for protocol bridging between industrial buses (EtherCAT, PROFINET, Modbus, CAN) and legacy serial or parallel interfaces. Its abundant logic and I/O count let engineers implement multiple soft MACs and protocol stacks simultaneously, while the four PLLs generate independent clock domains for each interface. The 65-nm low-power process keeps idle power low for always-on gateway devices. Quartus II IP cores such as Triple-Speed Ethernet and Nios II soft-core processor accelerate development. The 484-FBGA footprint supports dense mixed-voltage I/O banks for bridging between 3.3 V and 1.8 V legacy domains.
추천
Test & Measurement Instrumentation
The EP3C55F484C8 supports test and measurement instruments that need parallel logic, fast DSP, and many I/Os for stimulus/response channels. With 312 18x18 multipliers it can implement real-time FFT, FIR filtering, and digital down-conversion for signal analyzers. The 472.5 MHz core Fmax and 20 global clock networks simplify multi-channel timing alignment. Engineers use the FPGA to coordinate ADC/DAC sampling, trigger logic, and USB/Ethernet host interfaces. Commercial temperature grade suits lab and production-line environments, and the 484-FBGA package allows high-density mixed-signal board integration.
추천
Display Controllers & Video Walls
The EP3C55F484C8 drives display controllers and small video-wall controllers by combining parallel LVDS output channels with on-chip frame buffering and color-space conversion. The 327 user I/Os can feed multiple LCD panels, DVI/HDMI bridges, or RGB-to-MIPI converters in parallel. With four PLLs, designers derive independent pixel clocks for each output panel. The 484-FBGA package supports dense mixed-signal routing on multi-layer PCBs typical of video-wall designs. The 65-nm low-power Cyclone III process keeps board thermal budgets manageable even with multiple LVDS channels active simultaneously.
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Embedded Control with Nios II Soft-Core
The EP3C55F484C8 hosts the Nios II soft-core processor comfortably alongside custom peripherals in a single chip, eliminating the need for a separate MCU. With 55,856 logic elements, engineers can instantiate a full Nios II/f core plus substantial on-chip peripheral set (UART, SPI, I2C, Ethernet MAC, DMA) and still leave headroom for application logic. The 2,396,160 bits of embedded SRAM provide scratchpad memory for the soft-core, and 327 I/Os expose all necessary external interfaces. Commercial temperature grade and the 65-nm low-power process keep total board power low for embedded control applications in industrial and consumer products.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3C55F484C8 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C55F484C7N | EP3C55F484C6N | EP3C55F484C7 | EP3C55F484C6 | EP3C55U484C8N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA (FBGA-484), 23x23 mm | 484-ball FBGA (FBGA-484), 23x23 mm - same | 484-ball FBGA (FBGA-484), 23x23 mm - same | 484-ball FBGA (FBGA-484), 23x23 mm - same | 484-ball FBGA (FBGA-484), 23x23 mm - same | 484-ball UBGA (UBGA-484) - same ball count |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 |
| Speed Grade | C8 (commercial, -8) | C7 (commercial, -7) | C6 (commercial, -6) | C7 (commercial, -7) | C6 (commercial, -6) | C8 (commercial, -8) |
| Embedded Memory (bits) | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 |
| Embedded 18x18 Multipliers | 312 | 312 | 312 | 312 | 312 | 312 |
| User I/Os | 327 | 327 | 327 | 327 | 327 | 327 |
| Lead-Free / RoHS | Yes (FBGA Pb-free) | Yes (N suffix) | Yes (N suffix) | Varies by date code | Varies by date code | Yes (N suffix) |
| Approx. Unit Price (qty 1, USD) | $195.53 | Lower than C8 (typically $170-$185) | Lower than C8 (typically $150-$170) | Lower than C8 (typically $165-$180) | Lower than C8 (typically $145-$165) | Comparable to C8 (UBGA premium) |
주요 차별점
- Highest Fmax in the EP3C55 484-FBGA family (vs EP3C55F484C6N)
- Largest on-chip memory in the Cyclone III mid-range (vs EP3C40F484C8N)
- Mature toolchain with abundant IP (vs EP4CE55F23C8N (Cyclone IV E))
설계 노트
The EP3C55F484C8 requires multiple supply rails: VCCINT (typically 1.2 V) for core logic, VCCIO (1.2 V to 3.3 V, bank-dependent) for I/O banks, VCCA (2.5 V) for PLL analog, and VCCD_PLL (1.2 V) for PLL digital. Decouple each rail with 100 nF X7R ceramic caps placed as close as possible to the corresponding balls, plus bulk 10-100 uF tantalum or polymer capacitors. Power-on sequencing requires VCCINT to ramp before or simultaneously with VCCIO; consult the Cyclone III datasheet PowerPlay section for the exact sequence and ramp-rate limits. Power estimation in Quartus II PowerPlay should be run early to size regulators correctly.
The 484-ball FBGA (1.0 mm pitch) requires a multi-layer PCB (typically 6 to 8 layers minimum) with laser-drilled or precision-etched microvias and full ground/power planes for return-path integrity. Use the Intel Cyclone III device-specific BGA breakout routing guidelines to escape the inner-ball rows without dog-bone fan-outs where possible. Match all differential pairs (LVDS) to within 5 mils length tolerance, and keep reference planes continuous under all high-speed traces. Thermal vias under the package center array improve heat dissipation to the internal ground plane.
Configure the EP3C55F484C8 via JTAG, Active Serial (AS), Active Parallel (AP), or Passive Serial (PS) mode. For production boards, AS mode with an EPCS serial configuration device is most common because it auto-loads at power-up without an external processor. JTAG is reserved for in-system programming and debug. Set MSEL pins correctly per the Cyclone III handbook before generating the programming file in Quartus II. Verify the configuration clock rate (DCLK) does not exceed the EPCS device rating.
Cyclone III I/Os support LVDS, LVCMOS, SSTL, and HSTL standards but each bank shares a single VCCIO, so all I/Os in a bank must use compatible voltage standards. For LVDS, use the dedicated LVDS pairs and keep the 100 ohm differential termination close to the receiver. For SSTL memory interfaces (DDR/DDR2), follow the Intel external memory interface pin guidelines for DQS placement and trace matching. Always simulate high-speed interfaces with the Quartus II IBIS models before tape-out.
Although the 65-nm low-power Cyclone III process is efficient, a fully utilized EP3C55F484C8 (90%+ LE usage, all multipliers active) can still dissipate several watts. Estimate: at moderate toggle rates, plan for 1.5-3 W typical dissipation; at worst-case utilization, up to 5-6 W. The 484-FBGA has theta-JA around 12-15 C/W with a properly designed thermal via array under the package. Provide adequate airflow in enclosed cabinets, and consider a heat spreader for high-ambient industrial environments above 60C.
규정 준수 정보
Lead-free Pb-free FBGA package per Intel Cyclone III datasheet. Commercial temperature grade (0C to +85C) only - not AEC-Q100 qualified. RoHS and REACH compliance confirmed via distributor listings and Intel product declarations; halogen-free status not explicitly stated in verified data.
