EP3C80F484C8N - 81K LE Cyclone III FPGA, 484-FBGA | Intel
부품 번호: EP3C80F484C8N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $308.9 | $308.90 |
| 10 | $278.1 | $2,781.00 |
| 100 | $248.5 | $24,850.00 |
| 500 | $225 | $112,500.00 |
| 1,000 | $208.75 | $208,750.00 |
EP3C80F484C8N 개요
An FPGA is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. In the system hierarchy it sits between ASICs (highest performance, highest NRE) and microcontrollers (lowest flexibility, lowest unit cost) and is the workhorse for parallel data paths, custom interfaces, and DSP pipelines. The Cyclone III family specifically targets applications that need tens of thousands of logic elements, embedded memory and multipliers without the power and cost of a mid-range FPGA.
Key features include 81,264 logic elements, 2,810,880 RAM bits distributed in M9K blocks, 244 embedded 18 x 18 multipliers, four general-purpose PLLs, 20 global clock networks, and support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports up to 402 MHz internal operation and operates from a 1.2 V core supply. Configuration can be loaded through JTAG, Active Serial (AS), or Passive Serial (PS) modes using external flash.
Typical applications for the EP3C80F484C8N span industrial control and machine vision, video processing and display pipelines, telecommunications line cards, motor and motion control, test and measurement instrumentation, and entry-level DSP cards. The combination of embedded multipliers and distributed RAM allows designers to implement FIR filters, FFT engines, and image-processing kernels without external DSP chips.
When designing with this part, pay attention to the 484-FBGA ball pitch (typically 1.0 mm) and follow Intel's PCB layout and decoupling guidelines to maintain signal integrity on LVDS pairs. The device is lead-free / RoHS compliant and supports commercial (0 C to 85 C) operating temperature range as denoted by the 'C8' speed-grade suffix.
드롭인 대체품: EP3C80F484C8N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3C80F484C8N (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Package, Operating Temperature, Speed Grade, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3C80F484C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$306.54 / 개
데이터시트 보기 →EP3C80F484C6N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$369.38 / 개
데이터시트 보기 →EP3C80F484I7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$286.91 / 개
데이터시트 보기 →EP3C80F484C8
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$182.76 / 개
데이터시트 보기 →EP3C55F484C8N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$58.5 / 개
데이터시트 보기 →EP3C80F484C8N 최대 정격 & 전기적 특성
| Family | Cyclone III |
| Logic Elements | 81,264 |
| Embedded Memory (bits) | 2,810,880 |
| Embedded 18x18 Multipliers | 244 |
| User I/O | 295 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Maximum Operating Frequency | 402 MHz |
| Core Voltage | 1.2 V |
| Process Technology | 65 nm |
| 패키지 | 484-FBGA |
| 실장 유형 | Surface Mount |
| Speed Grade | 8 |
| 동작 온도 | 0 C to +85 C (commercial) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
EP3C80F484C8N 484-fbga 핀 구성 가이드
EP3C80F484C8N(484-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3C80F484C8N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3C80F484C8N 적합 용도: 6 애플리케이션s: Industrial Machine Vision and Image Processing, Motor Control and Motion Drive Systems, Telecommunications Line Cards and Protocol Bridging, Test and Measurement Instrumentation, Video and Display Processing Pipelines, Embedded DSP and Signal Processing Cards.
Industrial Machine Vision and Image Processing
The EP3C80F484C8N is well matched to industrial camera and machine-vision pipelines. Its 244 embedded 18x18 hardware multipliers run convolutional kernels and Sobel edge-detection filters at real-time frame rates, while the 2.81 Mbit of distributed M9K RAM holds line buffers without external SRAM. The 295 user I/Os drive parallel image-sensor interfaces and the LVDS pairs support Camera Link at full 80 MHz pixel clock.
추천
Motor Control and Motion Drive Systems
Three-phase motor drives benefit from the EP3C80F484C8N's combination of 402 MHz DSP performance and 244 multipliers. Field-oriented control (FOC) loops, space-vector PWM, and encoder decoding all run inside the fabric, freeing the host processor from microsecond-rate tasks. The device's industrial temperature tolerance and 295 LVCMOS I/Os accommodate multiple gate-driver, Hall-sensor, and resolver inputs on a single board.
추천
Telecommunications Line Cards and Protocol Bridging
Telecom line cards use the EP3C80F484C8N to bridge legacy TDM/E1 streams to packet networks. The 81,264 logic elements are sufficient for HDLC controllers, TDM crossbars, and small packet-classification engines, while the embedded RAM stores jitter buffers. Four PLLs provide the multiple reference clocks required to lock onto independent E1/T1 streams simultaneously.
추천
Test and Measurement Instrumentation
Digital storage oscilloscopes, logic analyzers, and protocol testers use the EP3C80F484C8N for real-time data capture and post-processing. The 295 user I/Os accept wide parallel busses from high-speed ADCs, while the 402 MHz fabric can run trigger engines, decoders, and compression algorithms in parallel. The 2.81 Mbit of embedded RAM pages acquired waveforms into host memory at full sample rate.
추천
Video and Display Processing Pipelines
Video-converter boards and multi-display controllers use the EP3C80F484C8N to scale, deinterlace, and blend video streams. The 244 multipliers execute scaling coefficients in real time, and the device's LVDS pairs drive HDMI/DVI transmitter PHYs up to 1080p. The 295 I/Os are sufficient to support a 24-bit RGB interface plus a parallel camera input alongside the video output.
추천
Embedded DSP and Signal Processing Cards
Software-defined radio, audio processing, and vibration-analysis cards rely on the EP3C80F484C8N's high multiplier count. FFT engines, FIR filters, and adaptive noise cancellers fit easily into the 81,264 logic elements and 244 multipliers. The device supports up to 805 Mbps LVDS, enabling direct connection to high-speed ADCs used in software-defined radio front-ends.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3C80F484C8N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C80F484C7N | EP3C80F484C6N | EP3C80F484I7N | EP3C55F484C8N |
|---|---|---|---|---|---|
| Package | 484-FBGA | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
| Logic Elements | 81,264 | 81,264 | 81,264 | 81,264 | 55,000 (-32%) |
| Speed Grade | 8 | 7 | 6 | 7 | 8 |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C | 0 C to +85 C | -40 C to +100 C (industrial) | 0 C to +85 C |
| Embedded Memory (bits) | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 | 2,396,160 (-15%) |
| Embedded Multipliers (18x18) | 244 | 244 | 244 | 244 | 156 |
| User I/O | 295 | 295 | 295 | 295 | 314 (+6%) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Highest speed grade available for the EP3C80 family (vs EP3C80F484C7N)
- Commercial temperature range for cost-sensitive designs (vs EP3C80F484I7N)
- Full 81K logic element density versus smaller Cyclone III devices (vs EP3C55F484C8N)
- More embedded memory than lower-density same-package parts (vs EP3C55F484C8N)
설계 노트
Estimated: with core VCCINT at 1.2 V and typical utilization around 50%, the EP3C80F484C8N draws approximately 0.6-0.9 A from the core rail and 50-200 mA from VCCAUX (2.5 V). Designers must provide at least 22 uF of bulk decoupling plus 0.1 uF and 0.01 uF high-frequency caps near each power pin group. Power sequencing should follow the Cyclone III handbook: VCCINT must come up before or simultaneously with VCCAUX and VCCIO to prevent latch-up.
The 484-FBGA uses 1.0 mm ball pitch and requires a 4-6 layer PCB with controlled-impedance routing for LVDS pairs (typically 100 ohm differential). Use micro-vias or sub-0.5 mm trace-and-space to fan-out the inner ball rows; keep all length matching within 150 mils for DDR-grade LVDS signals. Mount the device on a symmetrical land pattern and avoid routing high-speed signals under the package to reduce crosstalk and return-path discontinuity.
Do not assume all 484 BGA balls are usable I/O: roughly 25-30% are power, ground, configuration, or no-connects. Estimate: a typical 484-FBGA Cyclone III device exposes 295-314 user I/Os, with the remaining balls reserved. Also avoid placing the JTAG chain on a shared bus if any device is in reset, since the chain will appear broken to the programmer.
Estimated: at 1.2 V core and 0.8 A draw, power dissipation is approximately 1.0 W, plus dynamic power that scales with toggle rate and utilization. The 484-FBGA has a junction-to-ambient theta-JA around 15-20 C/W with standard JEDEC PCB, so a heatsink is usually not required but thermal vias under the package thermal pad are recommended to keep junction temperature below 85 C in commercial-temperature applications.
규정 준수 정보
RoHS and lead-free per distributor listings (DigiKey, Mouser). Halogen-free and conflict-mineral status not explicitly stated in the verified data; set to unknown. AEC-Q100 not applicable - this is a commercial-grade FPGA.