EP3SE110F780C4LN - Stratix III E FPGA, 488 I/O, 780-FBGA | Intel
부품 번호: EP3SE110F780C4LN ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4129.66 | $4,129.66 |
| 5 | $3995 | $19,975.00 |
| 10 | $3870 | $38,700.00 |
| 25 | $3740 | $93,500.00 |
| 100 | $3450 | $345,000.00 |
EP3SE110F780C4LN 개요
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and hardened I/O cells. Within the broader taxonomy, FPGAs sit under programmable logic devices -> digital ICs -> integrated circuits. The Stratix III E family specifically emphasizes enhanced DSP blocks, high-speed transceivers, and on-chip memory density, making it a mid-generation platform that bridges early Stratix II architectures and the later Stratix IV/Stratix V families.
Key features of the EP3SE110F780C4LN include the 780-FBGA footprint (29 mm x 29 mm typical), 4,300 LABs, 107,500 logic elements, 8,936,448 memory bits, 488 user I/O, and operating temperature range tailored for industrial (-40C to +85C). The 'C4' speed grade and 'N' suffix indicate commercial temperature rating with lead-free / RoHS-compliant assembly. The 780-ball FBGA package supports both 1.0 mm and 1.27 mm pitch variants per the Stratix III device handbook.
Architecturally, the Stratix III E series implements an 8-input adaptive logic module (ALM) that doubles effective logic capacity per area over prior generations. It also integrates MLAB (memory logic array blocks) and M9K/M144K block RAM tiles, providing a heterogeneous memory fabric that can be partitioned between register files and large data buffers.
Typical applications include high-speed DSP pipelines, telecommunications line-card processing, video broadcast equipment, and prototyping for ASIC/ASSP designs. The 780-FBGA package also makes it suitable for PCI Express Gen1/Gen2 endpoint and bridge designs. When designing with this device, ensure the Quartus II design suite (12.0sp2 or later) supports the C4 speed grade and that the 780-FBGA PCB land pattern matches the Intel reference footprint.
드롭인 대체품: EP3SE110F780C4LN — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SE110F780C4LN (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Process Technology, Embedded Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SE110F780C4L
✅ 드롭인✓ 재고 있음
$1550 / 개
데이터시트 보기 →EP3SE110F780C4
✅ 드롭인✓ 재고 있음
$2380 / 개
데이터시트 보기 →EP3SE110F780C3N
✅ 드롭인✓ 재고 있음
$1245 / 개
데이터시트 보기 →EP3SE110F780C3
✅ 드롭인✓ 재고 있음
$220 / 개
데이터시트 보기 →EP3SE110F780C2N
✅ 드롭인✓ 재고 있음
$305 / 개
데이터시트 보기 →EP3SE110F780C2
✅ 드롭인✓ 재고 있음
$4350 / 개
데이터시트 보기 →EP3SE110F780C4LN 최대 정격 & 전기적 특성
| Family | Stratix III E |
| Logic Elements (LE) | 107,500 |
| Logic Array Blocks (LABs) | 4,300 |
| Embedded Memory | 8,936,448 bits |
| User I/O Pins | 488 |
| 패키지 | 780-BBGA, FCBGA (Fine-pitch) |
| Supply Voltage Core | 0.9 V (typical) |
| 동작 온도 | 0C to +85C (Commercial) |
| Speed Grade | C4 |
| Lead-Free / RoHS | Yes (N suffix) |
| 실장 유형 | Surface Mount (SMT) |
| Process Technology | 40 nm TSMC |
| DSP Blocks | Yes (18x18 multipliers) |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| Tray Packaging | Yes (per distributor listings) |
EP3SE110F780C4LN 780-bbga, fcbga (fine-pitch) 핀 구성 가이드
EP3SE110F780C4LN(780-bbga, fcbga (fine-pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SE110F780C4LN.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SE110F780C4LN 적합 용도: 6 애플리케이션s: High-Speed DSP Pipeline Processing, Telecommunications Line-Card Processing, Video Broadcast Equipment, ASIC/ASSP Prototyping, PCI Express Bridge / Endpoint Designs, Test & Measurement Instrumentation.
High-Speed DSP Pipeline Processing
The EP3SE110F780C4LN's 107,500 logic elements and 4,300 LABs make it a strong fit for DSP-intensive pipelines such as radar baseband, beamforming, and channelization. The Stratix III E 18x18 multiplier blocks deliver hundreds of GMACs per second when fully utilized, while 8,936,448 bits of embedded memory absorb per-stage data buffers without external SRAM. The 780-FBGA package exposes 488 user I/O for high-fanout parallel datapaths running LVDS at 1+ Gbps. The 0.9 V core minimizes dynamic power during sustained 100+ MHz DSP workloads. Recommended companion MPNs include EP3C55F780C7 for auxiliary DSP boards and EP3SE110F1152I4N for larger sibling designs.
추천
Telecommunications Line-Card Processing
In telecom line cards, the EP3SE110F780C4LN serves as the central packet-processing engine, mapping its 107,500 LE to multi-channel framer/MAC/SAR pipelines. The 8,936,448-bit memory fabric implements deep packet FIFOs and lookup tables for OAM and QoS classification, while 488 user I/O expose UTOPIA/SPI-4/Interlaken-style parallel interfaces to PHY and switch ASICs. The 780-FBGA package preserves board area for high-density backplane designs, and the commercial C4 speed grade is sufficient for typical 200-300 MHz fabric clocking. Stratix III E is widely deployed in legacy line-card designs through 2026. Recommended companion MPNs: EP3C40F780C7 for sibling line cards, EP3CLS100F780C7 for power-constrained variants.
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Video Broadcast Equipment
Broadcast video routers and format converters benefit from the EP3SE110F780C4LN's substantial LE count, which absorbs wide SDI/HDMI multiplexing, audio embedding, and color-space conversion logic. The 488 user I/O accommodate multiple 3G-SDI streams at 2.97 Gbps plus ancillary data lanes, while 8.9 Mbits of block RAM buffer line-quincunx and frame-store data without external memory. The 780-FBGA enables compact ATCA/AMC boards with high pin density, and the C4 speed grade supports the >150 MHz internal fabric clocking typical of 3G-SDI pipelines. Compared to ASSP video crosspoints, this FPGA gives broadcasters reconfigurable matrix sizes. Recommended companion MPNs: EP3C40F780C7 for cost-optimized daughter cards and EP3C55F780C7 for mid-density variants.
추천
ASIC/ASSP Prototyping
The EP3SE110F780C4LN's 107,500 LE provide a faithful representation of mid-range ASICs in the 1M-3M gate class, making it a workhorse for pre-silicon validation. The 780-FBGA exposes ample GPIO for emulating multi-bus ASIC interfaces (PCIe, DDR2/3, SRIO, custom parallel), and the 8.9 Mbit block RAM emulates on-chip SRAM arrays. Quartus II supports pin-out migration to ASIC libraries, accelerating handoff. The commercial 0C-85C temperature grade suits lab and chassis environments; industrial variants require -40C+85C screens. Stratix III E prototyping has been the de facto choice for wireless baseband ASIC validation. Recommended companion MPNs: EP3SE110F1152I4N (industrial, larger FBGA) and EP3C80F780C7 (lower-density prototype).
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PCI Express Bridge / Endpoint Designs
The Stratix III E IP catalog includes hardened PCIe Gen1/Gen2 controllers that pair well with the EP3SE110F780C4LN's 488 user I/O for endpoint and root-port designs. The 107,500 LE implement protocol stacks, DMA engines, and application logic while 8.9 Mbits of block RAM back descriptor rings and payload buffers. The 780-FBGA keeps board real-estate tight for adapter cards; C4 speed grade supports PCIe Gen2 line rates. Compared to a discrete PCIe switch, this FPGA enables custom transaction-layer behaviors. Stratix III E PCIe is widely supported by Quartus II IP catalog. Recommended companion MPNs: EP3C40F780C7 for low-cost PCIe endpoint variants and EP3CLS70F780C7 for minimal PCIe implementations.
추천
Test & Measurement Instrumentation
In T&M equipment such as logic analyzers, protocol analyzers, and arbitrary waveform generators, the EP3SE110F780C4LN functions as the timing-critical capture/pattern generator engine. Its 488 user I/O support parallel probe channels at 1 Gbps+, while 107,500 LE implement deep state machines and trigger logic. 8.9 Mbits of block RAM buffer real-time trace data before DMA to the analysis software. The 780-FBGA package suits multi-board chassis instrumentation, and the C4 speed grade supports typical 300-400 MHz internal timing budgets. Compared to discrete timing-ASIC designs, this FPGA gives T&M vendors reconfigurable protocol support. Recommended companion MPNs: EP3C55F780C7 (lower-density T&M sibling) and EP3SE110F780C3N (higher speed bin variant).
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SE110F780C4LN — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SE110F780C4L | EP3SE110F780C4 | EP3SE110F780C3N | EP3SE110F780C3 | EP3SE110F780C2N | EP3SE110F780C2 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 780-FBGA | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Logic Elements | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 |
| LABs | 4,300 | 4,300 | 4,300 | 4,300 | 4,300 | 4,300 | 4,300 |
| Embedded Memory (bits) | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 |
| User I/O | 488 | 488 | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | C4 | C4 | C4 | C3 (faster) | C3 (faster) | C2 (fastest) | C2 (fastest) |
| Lead-Free / N Suffix | Yes (N suffix) | L suffix only (may be SnPb) | No L or N suffix | Yes (N suffix) | No L or N suffix | Yes (N suffix) | No L or N suffix |
주요 차별점
- Highest logic density in the 780-FBGA Stratix III E family (vs EP3C55F780C7)
- Dedicated 18x18 multiplier DSP blocks at scale (vs EP3CLS100F780C7)
- Hard PCIe Gen1/Gen2 controller support via IP (vs EP3C40F780C7)
- Same-package C3/C2 speed bin upgrades available (vs EP3SE110F780C2N)
설계 노트
Stratix III E in 780-FBGA at full fabric utilization and 0.9 V core can dissipate 8-15 W depending on toggle rate and DSP activity. Estimate: with theta_JA of ~14 C/W (typical for 29 mm FBGA with thermal vias and airflow), a 12 W load yields a 168 C junction rise above 25 C ambient. For production deployments, use a thermal pad tied to an inner copper plane and ensure >100 LFM airflow, or consider heatsink attachment if chassis temperature exceeds 55 C. Industrial-grade variants (-40C to +85C ambient) require forced airflow above 70 C ambient.
The 780-FBGA ball pitch (typically 1.0 mm) requires a 4-6 layer PCB stack-up with buried vias and a 0.4 mm via-in-pad microvia stack for inner rows. Per Intel's Stratix III handbook, assign at least one solid ground plane beneath the device to provide a low-impedance return path for high-speed transceivers. Decoupling must include 0402-sized 0.1 uF X7R caps within 3 mm of every VCC pin, plus bulk 22 uF/47 uF polymer or tantalum caps on each voltage rail. Use differential via length-matching within 0.13 mm for LVDS pairs above 500 Mbps.
Common pitfalls when designing with EP3SE110F780C4LN include: (1) configuring unused user I/O as analog input rather than driving them to a defined logic level - this can cause leakage on internal pull-ups; (2) mixing voltage standards across I/O banks without configuring VREF per bank - always consult Quartus II Pin Planner warnings; (3) omitting the dedicated CONF_DONE and nCONFIG pull-ups on JTAG/AS configuration pins, leading to intermittent configuration failures; (4) ignoring MSL-3 floor life (168 hours) and baking at 125 C for 48 hours before rework to prevent popcorn cracking; (5) selecting C3/C2 speed bin parts in designs that were characterized for C4 - speed bin swaps require full STA re-run.
For multi-Gbps LVDS and SERDES signals, use a 100 ohm differential impedance with 85 ohm common-mode. Keep SERDES traces within 2 cm of the device edge; longer runs must be length-matched to within 0.05 mm and routed over a continuous reference plane. Avoid routing signals over plane splits - the Stratix III E transceivers require uninterrupted ground return paths. For DDR2/DDR3 interfaces, follow JEDEC JESD79-2F/JESD79-3-1A trace-length matching rules and use Fly-By topology for command/address lines on the EP3SE110F780C4LN with 488 I/O.
규정 준수 정보
The 'N' suffix indicates lead-free, RoHS-compliant ball finish per Intel/Altera part-numbering convention. Halogen-free status is not explicitly confirmed in verified data and marked unknown. AEC-Q100 is not applicable as this is a commercial-grade FPGA; industrial (-40C to +85C) variants exist as the EP3SE110F780I4-series in the Stratix III E family.
