EP3SE110F780C4LN vs EP3SE50F780C4N 비교
다음의 상세 나란히 비교: EP3SE110F780C4LN 제조: Intel 및 EP3SE50F780C4N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP3SE110F780C4LN | EP3SE50F780C4N |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | NRND |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $3,450.00 | $1,430.00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 107,500 | 47,500 |
| Logic Array Blocks (LABs) | 4,300 | — |
| Embedded Memory | 8,936,448 bits | — |
| User I/O Pins | 488 | — |
| 패키지 | 780-BBGA, FCBGA (Fine-pitch) | 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch |
| Supply Voltage Core | 0.9 V (typical) | — |
| 동작 온도 | 0C to +85C (Commercial) | 0C to +85C (C4 commercial grade) |
| Speed Grade | C4 | — |
| Lead-Free / RoHS | Yes (N suffix) | — |
| 실장 유형 | Surface Mount (SMT) | Surface Mount (BGA) |
| Process Technology | 40 nm TSMC | — |
| DSP Blocks | Yes (18x18 multipliers) | — |
| MSL 레벨 | 3 (per JEDEC J-STD-020) | 3 (per JEDEC J-STD-020, FBGA package) |
| Tray Packaging | Yes (per distributor listings) | — |
| Embedded Memory Bits | — | 5,760,000 |
| Embedded Memory (M9K/M144K blocks) | — | 488 (per family datasheet) |
| Number of LABs | — | 1900 |
| Maximum User I/Os | — | 488 |
| DSP Blocks (18x18 multipliers) | — | 432 |
| PLLs | — | 12 (per family datasheet) |
| Maximum Operating Frequency | — | 717 MHz |
| Transceiver Channels | — | Up to 12 (per family, model-dependent) |
| Transceiver Data Rate | — | Up to 6.375 Gbps (per Stratix III E family) |
| Process Node | — | 40 nm |
| 공급 전압 | — | Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail) |
| Configuration Modes | — | JTAG, Passive Serial, Fast Passive Parallel |
| RoHS 상태 | — | Lead-free / RoHS compliant |
| Hard Memory Controller | — | DDR2/DDR3 SDRAM (per Stratix III E family) |