Intel

EP3SE260F1152C4LN - Stratix III E FPGA 255K LE 1152-FCBGA | Intel

Name: EP3SE260F1152C4LN - Stratix III E FPGA 255K LE 1152-FCBGA | Intel
Brand: Intel
SKU: EP3SE260F1152C4LN
Price: 1400 USD
Availability: InStock

부품 번호: EP3SE260F1152C4LN ⚠ 최종 구매

재고 있음 영업일 기준 1~3일 내 발송

0.9 V Vdss 1152-ball FC-BGA Package 375 MHz (max) Speed 16,672,768 bits Memory

시작가 $1400 USD / 개

MOQ: 1 |

가격 업데이트: 2026-09-09

볼륨 가격

수량	단가	합계
1	$1850	$1,850.00
10	$1750	$17,500.00
100	$1620	$162,000.00
500	$1500	$750,000.00
1,000	$1400	$1,400,000.00

ℹ️ 모든 가격은 USD 기준입니다

데이터시트 보기 (PDF) 대체품 보기

수량

EP3SE260F1152C4LN 개요

The Intel (formerly Altera) EP3SE260F1152C4LN is a high-density Stratix III E Field Programmable Gate Array (FPGA) featuring 255,000 logic elements, 16,672,768 bits of embedded memory, and 744 user I/Os in a 1152-ball Fine-pitch Chip-Scale Ball Grid Array (FC-BGA) package. Manufactured on a 65 nm CMOS process and fabricated on a 0.9 V core supply, it is built around an enhanced logic and DSP fabric operating up to 375 MHz core clock and 717 MHz transceiver data rate, with 10,200 Logic Array Blocks (LABs) for fine-grained logic implementation.

A Field Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic elements (LEs), dedicated block RAM, DSP blocks, and high-speed transceivers, all wired through a programmable interconnect. The Stratix III E family specifically targets high-performance applications requiring high logic density, abundant DSP resources, and multi-gigabit serial I/O. FPGAs sit at the same hierarchy tier as ASICs in digital design, but unlike ASICs they are reconfigurable after manufacture, making them ideal for prototyping, low-volume production, and designs requiring late-stage logic changes.

Key features of this device include 384 (24x16) embedded 18x18 multipliers supporting up to 136 GMACS DSP throughput, a hierarchical clock network with up to 16 global clocks, programmable power technology that reduces dynamic power by up to 50% versus Stratix II, and integrated PLLs with fractional-n synthesis. The high-pin-count FC-BGA-1152 package supports high-speed memory interfaces including DDR3 up to 800 MHz and RLDRAM II, making the device suitable for memory-intensive signal processing and data-path applications.

Typical applications include high-end wireline telecom line cards, defense and radar signal processing, ASIC prototyping, high-performance DSP pipelines, and test and measurement backplanes. The C4 speed grade and 0°C to +85°C (commercial) operating range target mainstream embedded and communications designs.

When designing with this device, pay close attention to power integrity: a Stratix III E at full utilization may dissipate more than 20 W and requires a multi-layer PCB with a low-impedance core/IO supply distribution network. Pin-compatible variants in this family include speed-grade and temperature-grade options that allow the same PCB to be populated for different deployment scenarios.

드롭인 대체품: EP3SE260F1152C4LN — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EP3SE260F1152C4LN (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Operating Temperature, Process Technology, Core Voltage.

EP3SE110F1152C4N

Intel

Package: 1152-ball FCBGA (Flip-Chip BGA)

Family: Stratix III Enhanced (E)

Process Technology: 65 nm

비교 대상: EP3SE260F1152C4LN →

EP3SE260F1152C2N

Intel

Family: FPGA - Field Programmable Gate Array

Process Technology: 65 nm

비교 대상: EP3SE260F1152C4LN →

EP3SE260F1152C3N

Intel

Package: 1152-BBGA, FCBGA

Operating Temperature: 0 C to +85 C (Commercial)

Process Technology: 65 nm

비교 대상: EP3SE260F1152C4LN →

EP3SE260F1152C4

Intel

Package: 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA)

Family: Stratix III

Operating Temperature: Commercial (0C to +85C) - inferred from speed grade C4

비교 대상: EP3SE260F1152C4LN →

EP3SE260F1152C4L

Intel

Package: 1152-ball FC-FBGA

비교 대상: EP3SE260F1152C4LN →

EP3SE260F1152C4N

Intel

Package: 1152-ball FC-FBGA (flip-chip)

Family: Stratix III (Enhanced)

Operating Temperature: 0C to +85C (commercial, 'C' suffix)

비교 대상: EP3SE260F1152C4LN →

EP3SE260F1152I4LN

Intel

Package: FCBGA-1152 (1517-ball)

Operating Temperature: -40 C to +100 C (Industrial)

Core Voltage: 0.9 V (supports 1.05-1.15 V variant)

✅ 드롭인

Intel

📦 1152-ball FC-BGA

Stratix III Enhanced (E) · 107,500 · 8,936,448 · 896 · 4300 · 744 · 1.1 V · 65 nm

✓ 재고 있음

$1395 / 개

데이터시트 보기 →

EP3SE260F1152C4LN 최대 정격 & 전기적 특성

Family	Stratix III E
Logic Elements (LE)	255,000
Embedded Memory	16,672,768 bits
Logic Array Blocks (LABs)	10,200
User I/Os	744
패키지	1152-ball FC-BGA
Process Technology	65 nm CMOS
Core Voltage	0.9 V
Core Clock Speed	375 MHz (max)
Transceiver Data Rate	717 MHz
Speed Grade	C4
동작 온도	0C to +85C (commercial)
실장 유형	Surface Mount (BGA)
RoHS 상태	Compliant

EP3SE260F1152C4LN 1152-ball fc-bga 핀 구성 가이드

EP3SE260F1152C4LN(1152-ball fc-bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

EP3SE260F1152C4LN의 1152-ball fc-bga 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: EP3SE260F1152C4LN.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

EP3SE260F1152C4LN 적합 용도: 7 애플리케이션s: High-Performance DSP and Signal Processing, Wireline Telecom Line Cards, ASIC Prototyping and Emulation, Defense and Radar Signal Processing, Test and Measurement Instrumentation, Medical Imaging Systems, High-Speed Memory Buffer and Switch Fabrics.

🖥️

High-Performance DSP and Signal Processing

The EP3SE260F1152C4LN's 255,000 logic elements and 384 embedded 18x18 multipliers make it well suited for high-performance DSP pipelines. With up to 136 GMACS throughput and a 375 MHz core clock, this Stratix III E FPGA can implement multi-channel baseband processing, FFT engines, and FIR filter banks used in 4G/5G base stations and software-defined radio platforms. The 16,672,768 bits of embedded block RAM provide on-chip storage for large sample buffers and coefficient tables, reducing external memory access and latency.

추천

EP3SE110F1152C4N · Intel EP4SGX230KF40C2N (Higher-performance Stratix IV successor for advanced DSP)

🌐

Wireline Telecom Line Cards

Wireline telecom line cards require high logic density for packet processing, traffic shaping, and queuing algorithms. The EP3SE260F1152C4LN's 10,200 LABs and 744 user I/Os enable dense implementation of 10G/40G Ethernet MACs, framers, and OTN mappers on a single device. The 1152-FCBGA package supports multiple SFI/XFI high-speed serial lanes at 717 MHz data rate, while DDR3 controller IP delivers up to 800 MHz memory bandwidth for table lookups and statistics counters. Programmable power technology reduces dynamic power versus prior Stratix generations.

추천

EP3SE110F1152C4LN · Intel EP4SGX70HF35C2N · Intel

🧩

ASIC Prototyping and Emulation

The EP3SE260F1152C4LN provides 255K logic elements with rich embedded memory and DSP resources, making it ideal for ASIC prototyping where multiple chips can be partitioned across an FPGA array. Designers partition a multi-million-gate ASIC into multiple Stratix III E FPGAs, using the GTL/HT/LVDS transceivers between devices to extend the effective logic capacity. The 1152-FCBGA package exposes enough user I/Os to support multi-FPGA prototyping boards with high-speed interconnect.

추천

EP3SE260F1152C3N · Intel EP4SGX290KF40C2N (Higher-capacity Stratix IV for larger ASIC prototypes)

✈️

Defense and Radar Signal Processing

Defense radar systems require real-time processing of high-bandwidth IF signals, beamforming, and pulse compression. The EP3SE260F1152C4LN supports 384 multipliers at 375 MHz, providing more than 100 GMACS of DSP throughput suitable for phased-array radar beamforming across hundreds of antenna elements. The 16.67 Mbit of embedded memory enables large FFT window storage and CFAR threshold tables, while the 744 I/Os interface to high-speed ADCs and DACs used in modern radar front-ends.

추천

EP3SE110F1152I4N · Intel EP4SGX530KH40C2N · Intel

🔧

Test and Measurement Instrumentation

Test and measurement equipment such as oscilloscopes, logic analyzers, and protocol testers demand deep memory buffers and high-speed serial interfaces. The EP3SE260F1152C4LN's 16.67 Mbit embedded memory captures deep waveform records at full sample rate, while the 717 MHz transceivers interface to 10 Gbps serial links for protocol analysis. The 744 user I/Os support parallel LVDS ADC/DAC interfaces at hundreds of MHz, enabling wideband digitizer and signal generator subsystems.

추천

EP3SE110F780C4N · Intel EP4CGX110CF23C2N (Cyclone IV GT companion for cost-sensitive test channels)

💊

Medical Imaging Systems

Medical imaging modalities such as CT, MRI, and ultrasound require real-time processing of high-resolution image streams. The EP3SE260F1152C4LN's 384 multipliers and 16.67 Mbit embedded memory enable multi-slice image reconstruction, real-time beamforming in ultrasound front-ends, and FFT-based MRI reconstruction pipelines. The 1152-FCBGA package supports the high-speed ADC interface requirements of modern medical imaging chains, while the Stratix III E power optimization reduces heat dissipation in clinical environments.

추천

EP3SE110F1152I4N · Intel EP4SGX230KF40C2N (Higher-performance Stratix IV for advanced imaging algorithms)

🖥️

High-Speed Memory Buffer and Switch Fabrics

Enterprise switch fabrics and storage controllers require deep buffer memory and high-radix interconnect. The EP3SE260F1152C4LN's 16.67 Mbit embedded memory supports deep packet buffers and queue tables, while the 744 user I/Os enable parallel interconnect to multiple DDR3 memory channels and SAS/SATA PHYs. Programmable PLLs with fractional-n synthesis provide precise clock synthesis for serializer/deserializer lanes operating at non-standard rates for storage and networking applications.

추천

EP3SE110F1152C4LN · Intel EP4SGX230HF40C2N (Stratix IV successor with higher transceiver count)

추천 제품 요약

EP3SE110F1152C4N Intel 사용처: High-Performance DSP and Signal Processing EP4SGX230KF40C2N Higher-performance Stratix IV successor for advanced DSP 사용처: High-Performance DSP and Signal Processing, Medical Imaging Systems EP3SE110F1152C4LN Intel 사용처: Wireline Telecom Line Cards, High-Speed Memory Buffer and Switch Fabrics EP4SGX70HF35C2N Intel 사용처: Wireline Telecom Line Cards EP3SE260F1152C3N Intel 사용처: ASIC Prototyping and Emulation EP4SGX290KF40C2N Higher-capacity Stratix IV for larger ASIC prototypes 사용처: ASIC Prototyping and Emulation EP3SE110F1152I4N Intel 사용처: Defense and Radar Signal Processing, Medical Imaging Systems EP4SGX530KH40C2N Intel 사용처: Defense and Radar Signal Processing EP3SE110F780C4N Intel 사용처: Test and Measurement Instrumentation EP4CGX110CF23C2N Cyclone IV GT companion for cost-sensitive test channels 사용처: Test and Measurement Instrumentation EP4SGX230HF40C2N Stratix IV successor with higher transceiver count 사용처: High-Speed Memory Buffer and Switch Fabrics

What is the EP3SE260F1152C4LN?

The EP3SE260F1152C4LN is a Stratix III E FPGA from Intel (formerly Altera) with 255,000 logic elements, 16,672,768 bits of embedded memory, and 744 user I/Os. According to the Stratix III Device Handbook, it is built on a 65 nm CMOS process at 0.9 V core supply and is housed in a 1152-ball FC-BGA package suitable for high-density DSP and ASIC prototyping.

How much logic does the EP3SE260F1152C4LN contain?

The EP3SE260F1152C4LN contains 255,000 logic elements organized into 10,200 Logic Array Blocks (LABs). According to Altera/Intel datasheets, this places it in the high-density tier of the Stratix III E family, suitable for designs requiring more than 200K LEs of fine-grained logic along with embedded memory and DSP blocks.

What package does the EP3SE260F1152C4LN use?

The EP3SE260F1152C4LN uses a 1152-ball Fine-pitch Chip-Scale Ball Grid Array (FC-BGA) package. Per the Stratix III Device Handbook, this high-pin-count BGA supports the 744 user I/Os required for high-bandwidth memory and multi-gigabit transceiver interfaces.

What is the difference between C4 and I4 speed grades of EP3SE260?

The C4 speed grade targets commercial temperature (0C to +85C) while the I4 grade targets industrial (-40C to +100C). Per Intel specifications, the C4 part is offered for mainstream embedded and communications designs, while I4 variants are used in industrial and harsh-environment deployments.

Where to buy EP3SE260F1152C4LN?

The EP3SE260F1152C4LN can be purchased from authorized distributors including DigiKey, Mouser, and Arrow Electronics. Lead time and pricing as of 2026-09-09 vary by quantity; the part is in last-time-buy status, so users should verify remaining inventory and future availability with the distributor before placing production orders.

What is the price of EP3SE260F1152C4LN?

The EP3SE260F1152C4LN is priced in the four-figure USD range as of 2026-09-09, with unit prices typically starting around $1,400 at 1000-piece quantity and rising to approximately $1,850 at single-piece quantity. Pricing reflects its high-density Stratix III E positioning and limited last-time-buy availability.

What is the lead time for EP3SE260F1152C4LN?

Lead time for the EP3SE260F1152C4LN depends on remaining distributor stock, as the part is in last-time-buy status as of 2026-09-09. Authorized distributors typically quote 6-12 weeks when ordering factory-direct, while in-stock units may ship same-day. Customers planning long-term production should evaluate migration to Stratix V or Cyclone V equivalents.

Is EP3SE260F1152C4LN in stock?

Distributor stock for the EP3SE260F1152C4LN fluctuates because the part is in last-time-buy status as of 2026-09-09. DigiKey and Mouser historically list limited inventory; for production volumes beyond remaining stock, customers should contact Intel FPGA authorized channels or consider Stratix V migration.

EP3SE260F1152C4LN vs EP3SE260F1152C4N - which is better for commercial use?

The EP3SE260F1152C4LN and EP3SE260F1152C4N differ primarily in operating temperature: the LN suffix typically denotes a lower-power or lead-free variant versus the standard C4N part. Both target the same 0C to +85C commercial range and share the 1152-FCBGA package, so the choice depends on power consumption targets and lead-free compliance for the deployment.

EP3SE260F1152C4LN vs EP3SE110F1152C4N - which is better for high-density logic designs?

The EP3SE260F1152C4LN offers 255,000 logic elements while the EP3SE110F1152C4N offers approximately 110,000 logic elements, both in the 1152-FCBGA package. For high-density designs that exceed 200K LEs, the EP3SE260 is required; for designs under 110K LEs, the EP3SE110 provides sufficient capacity at lower cost and power.

When should I choose EP3SE260F1152C4LN over a Stratix V equivalent?

Choose EP3SE260F1152C4LN when you have an existing Stratix III design that cannot be re-qualified on a newer family, or when you need proven 65 nm silicon at low non-recurring engineering cost. For new designs, Stratix V or Cyclone V are recommended due to lower power, higher transceiver speed, and longer lifecycle support.

What is the best drop-in replacement for EP3SE260F1152C4LN?

The best drop-in replacement for EP3SE260F1152C4LN is the EP3SE260F1152C4N (industrial grade) or the EP3SE260F1152C4L (lower-power variant) within the same Stratix III E family, all sharing the 1152-FCBGA package footprint. For forward migration, the Stratix V 5SGXEA7 device offers higher performance but is not pin-compatible and requires PCB redesign.

Can the EP3CLS200F780C8N replace the EP3SE260F1152C4LN?

No, the EP3CLS200F780C8N is not a drop-in replacement for the EP3SE260F1152C4LN. Although both are Altera/Intel FPGAs, the EP3CLS200 uses a 780-pin FBGA package versus the 1152-ball FC-BGA of the EP3SE260, and offers different logic capacity and feature set, requiring PCB redesign for substitution.

Where to download the EP3SE260F1152C4LN datasheet PDF?

The EP3SE260F1152C4LN datasheet is part of the Stratix III Device Handbook published by Intel (formerly Altera). According to Intel documentation, the handbook is available as a free download from the Intel FPGA website under the Stratix III product page; users should also reference the pin-out file specific to the 1152-ball FC-BGA package.

Where to find the EP3SE260F1152C4LN pinout?

The EP3SE260F1152C4LN pinout is documented in the Stratix III Device Handbook Volume 2 (Pin-Out Files section), available from the Intel FPGA website. According to Intel documentation, the 1152-ball FC-BGA package pinout file is a separate download from the main datasheet and should be consulted together with Quartus II device support files.

What are the key specifications of EP3SE260F1152C4LN that engineers should know?

The EP3SE260F1152C4LN is a Stratix III E FPGA with 255,000 logic elements, 16.67 Mbit embedded memory, 10,200 LABs, and 744 user I/Os in a 1152-ball FC-BGA package. According to the Stratix III Device Handbook, it operates at 0.9 V core with up to 375 MHz core clock and supports DDR3 memory interfaces up to 800 MHz.

엔지니어링 참조 데이터: EP3SE260F1152C4LN — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose EP3SE260F1152C4LN when you need the highest logic density in the Stratix III E family (255K LE) with commercial temperature range and a 1152-FCBGA package, and your design can tolerate last-time-buy supply risk. For applications that need the same capacity but at lower power, choose EP3SE260F1152C4L; if the standard N suffix is preferred, choose EP3SE260F1152C4N. For designs that cannot fully utilize 255K LE, downgrade to EP3SE110F1152C4N to save power and cost while keeping the same PCB footprint. For new designs starting today, consider migrating to Stratix V or Cyclone V families for longer lifecycle support and lower power consumption.

대체품과의 비교

파라미터	이 제품	EP3SE260F1152C4L	EP3SE260F1152C4N	EP3SE260F1152C3N	EP3SE260F1152C2N	EP3SE110F1152C4N
Package	1152-ball FC-BGA	1152-ball FC-BGA	1152-ball FC-BGA	1152-ball FC-BGA	1152-ball FC-BGA	1152-ball FC-BGA
Brand	Intel	Intel	Intel	Intel	Intel	Intel
Logic Elements	255,000	255,000	255,000	255,000	255,000	110,000
Speed Grade	C4 (commercial)	C4 (commercial)	C4 (commercial)	C3 (commercial, slower)	C2 (commercial, slowest)	C4 (commercial)
Operating Temperature	0C to +85C	0C to +85C	0C to +85C	0C to +85C	0C to +85C	0C to +85C
Core Voltage	0.9 V	0.9 V	0.9 V	0.9 V	0.9 V	0.9 V
Lifecycle Status	Last Time Buy	Last Time Buy	Last Time Buy	Last Time Buy	Last Time Buy	Last Time Buy

주요 차별점

Highest logic density in the Stratix III E family at 255K LE (vs EP3SE110F1152C4N)
Faster speed grade (C4) versus C3/C2 variants (vs EP3SE260F1152C2N)
Lower-power variant (LN) for power-constrained applications (vs EP3SE260F1152C4N)

설계 노트

Stratix III E devices at full logic utilization may exceed 20 W core power. Estimated: at 255K LE utilization with 0.9 V VCC and 50% toggle rate, core power is roughly 15-20 W depending on clock frequency. Use a multi-layer PCB with a dedicated 0.9 V plane and at least 8 decoupling capacitors (1 uF and 0.1 uF) per VCC pin cluster, plus bulk capacitance of 220 uF near the regulator. Programmable power technology should be enabled in Quartus II to reduce dynamic power on unused LABs.

The 1152-ball FC-BGA package has a thermal resistance (theta_JA) in the range of 0.5-0.8 C/W with proper thermal via array design. Estimated: at 20 W core power dissipation on a 1 oz copper 12-layer PCB with full via array, junction-to-ambient thermal resistance is approximately 0.6 C/W, yielding 12 C rise above ambient. For forced-air cooling, design for at least 200 LFM airflow; for convection-only, use a heat spreader or heat sink attached to the package lid.

BGA breakout requires via-in-pad or dog-bone via pattern with 0.5 mm pitch compatible with the FC-BGA land pattern. Use 0.2 mm finished via diameter with 1 oz copper plating. Recommend 8-layer PCB stackup with dedicated power/ground planes for VCC (0.9 V), VCCIO (1.2-3.3 V), and VCCA/VCCP_PLL analog supplies. Maintain at least 4 ground vias per ground pad cluster for low-impedance return paths at transceiver frequencies.

Do not mix LVDS and LVTTL in the same I/O bank without checking VCCIO compatibility - the EP3SE260 has 8-12 I/O banks with independent VCCIO rails. Always assign all VREF pins even if the corresponding I/O standard is not used. Hot-socketing is not supported on Stratix III E without specific configuration pin sequencing; do not insert or remove the device with power applied.

규정 준수 정보

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

무연

Yes

무할로겐

Unknown

분쟁 광물

Compliant

RoHS compliant and lead-free per Altera/Intel product page. AEC-Q100 not applicable as this is a commercial-grade FPGA, not an automotive qualified part.

데이터 검증일: 2026-09-09 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

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