EP4SGX70HF35C2N - 72.6K LE Stratix IV GX FPGA 1152-FBGA | Intel
부품 번호: EP4SGX70HF35C2N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2680 | $26,800.00 |
| 100 | $2495 | $249,500.00 |
| 500 | $2310 | $1,155,000.00 |
| 1,000 | $2125 | $2,125,000.00 |
EP4SGX70HF35C2N 개요
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened IP such as transceivers, block RAM, and DSP blocks. The Stratix IV GX family sits in Intel's high-end programmable logic portfolio above Cyclone (low-cost) and Arria (mid-range), targeting applications that need multi-gigabit transceivers and high logic density. FPGAs are hierarchically classified as programmable logic devices (PLD) within the broader integrated circuit family, alongside ASICs and CPLDs.
Key features include 2,904 logic array blocks (LABs), 488 user I/O pins distributed across 12 I/O banks, multi-gigabit transceivers supporting protocols such as PCI Express Gen1/Gen2, Serial RapidIO, and Gigabit Ethernet, dedicated hard memory controllers, and on-chip DSP blocks. The 1152-pin FC-FBGA package supports high I/O count with flip-chip interconnect, reducing electrical parasitics relative to wire-bond alternatives. The device operates from 0.9V core supply with separate PLL and transceiver supplies.
The Stratix IV GX architecture employs a 40nm process with adaptive logic modules (ALMs) that combine LUT-based logic with register-rich paths, enabling efficient implementation of register-intensive pipelines. Transceiver channels support data rates from 600 Mbps up to 8.5 Gbps depending on speed grade, with on-die termination, equalization, and pattern detection. Hard IP blocks for PCI Express Gen2 (x1/x4/x8) and external memory interfaces (DDR3, QDRII+, RLDRAM II) eliminate soft-logic overhead.
Typical applications include high-end ASIC prototyping, high-speed serial interface bridging (PCIe to SRIO, XAUI to SFI), radar and signal processing front-ends, broadcast video infrastructure, and high-performance computing accelerators. The 8.5 Gbps transceivers make this family well suited for 40G/100G Ethernet MAC designs and FPGA-based protocol conversion cards.
When designing with this device, plan power delivery for the 0.9V core rail (high current) and separate PLL/transceiver supplies. Thermal management is critical: at full transceiver and logic utilization, the device can dissipate 20-30W, requiring airflow and a properly designed heatsink. PCB layout must follow Altera/Intel pinout guidelines for the HF35 package footprint and maintain 100-ohm differential impedance on all serial links.
This page synthesizes distributor availability, drop-in Stratix IV alternatives, and design guidance not found on the manufacturer datasheet alone, accelerating board bring-up and second-source qualification.
드롭인 대체품: EP4SGX70HF35C2N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX70HF35C2N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Mounting Type, Process Technology, Operating Temperature, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX70HF35C2G
✅ 드롭인✓ 재고 있음
$1490 / 개
데이터시트 보기 →EP4SGX70HF35C2G
✅ 드롭인✓ 재고 있음
$1490 / 개
데이터시트 보기 →EP4SGX70HF35C3N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP4SGX70HF35C4N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP4SGX70HF35I4N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP4SGX70HF35C2N 최대 정격 & 전기적 특성
| Family | Stratix IV GX |
| Logic Elements | 72,600 |
| Logic Array Blocks (LABs) | 2,904 |
| Embedded Memory Bits | 7,564,880 |
| User I/Os | 488 |
| Maximum User I/O | 488 |
| 패키지 | 1152-BBGA, FCBGA (HF35) |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Speed Grade | C2 (commercial) |
| 동작 온도 | 0C to +85C (commercial) |
| Transceiver Data Rate | Up to 8.5 Gbps |
| Program Memory Type | SRAM |
| 실장 유형 | Surface Mount |
EP4SGX70HF35C2N 핀 구성
| 핀 1 | I/O Bank 8A — User I/O (bank 8A) |
| 핀 2 | I/O Bank 8A — User I/O (bank 8A) |
| 핀 3 | VCCIO8A — Bank 8A I/O supply |
| 핀 4 | I/O Bank 8A — User I/O (bank 8A) |
| 핀 5 | GND — Ground |
| 핀 6 | I/O Bank 8A — User I/O (bank 8A) |
| 핀 7 | VCCIO8A — Bank 8A I/O supply |
| 핀 8 | I/O Bank 8A — User I/O (bank 8A) |
| 핀 9 | REFCLK_8A — Bank 8A reference clock input |
| 핀 10 | GXB_RX_CH0p — Transceiver 0 receive positive |
| 핀 11 | GXB_RX_CH0n — Transceiver 0 receive negative |
| 핀 12 | VCCRT — Receiver termination supply |
| 핀 13 | GXB_RX_CH1p — Transceiver 1 receive positive |
| 핀 14 | GXB_RX_CH1n — Transceiver 1 receive negative |
| 핀 15 | VCCR — Receiver analog supply |
| 핀 16 | GND — Ground |
| 핀 17 | VCCL_GXB — Transceiver clock supply |
| 핀 18 | GXB_TX_CH0p — Transceiver 0 transmit positive |
| 핀 19 | GXB_TX_CH0n — Transceiver 0 transmit negative |
| 핀 20 | VCCT — Transmitter supply |
| 핀 21 | GXB_TX_CH1p — Transceiver 1 transmit positive |
| 핀 22 | GXB_TX_CH1n — Transceiver 1 transmit negative |
| 핀 23 | GND — Ground |
| 핀 24 | VCC — Core supply (0.9 V) |
| 핀 25 | VCC — Core supply (0.9 V) |
| 핀 26 | GND — Ground |
| 핀 27 | CONFIG_DONE — Configuration status output |
| 핀 28 | nSTATUS — Configuration status |
| 핀 29 | nCONFIG — Configuration control input |
| 핀 30 | TCK — JTAG test clock |
| 핀 1152 | GND — Ground (corner ball) |
일반적인 애플리케이션
EP4SGX70HF35C2N 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, High-Speed Serial Interface Bridging, Radar and Signal Processing Front-Ends, Broadcast Video Infrastructure, High-Performance Computing Accelerators, Telecom Line Card Processing.
ASIC Prototyping and Emulation
The EP4SGX70HF35C2N is a strong fit for ASIC prototyping where designers need high logic density to map multi-million-gate ASICs. Its 72,600 logic elements and 2,904 LABs can absorb 5-10 million ASIC gates when mapped through synthesis, while the 7.5 Mbits of embedded block RAM models ASIC register files and FIFOs. The 488 user I/Os provide ample pins for prototyping board-to-FPGA connectors, and the 8.5 Gbps transceivers let prototypes replicate ASIC SerDes interfaces such as XAUI or Serial RapidIO. Compared to ASIC bring-up, an FPGA-based prototype cuts validation time from months to weeks.
추천
High-Speed Serial Interface Bridging
The 8.5 Gbps multi-gigabit transceivers make the EP4SGX70HF35C2N well suited for protocol-bridging cards that connect PCI Express, Serial RapidIO, XAUI, and CEI-6G interfaces. Each transceiver channel integrates PCS and PMA hard IP, offloading serialization, clock data recovery, and 8B/10B encoding from the FPGA fabric. This leaves the 72,600 logic elements free for protocol stack layers, DMA engines, and application logic. Industrial designers typically use this part in telecom line cards where PCI Express Gen2 x4 backplanes must interface to legacy RapidIO endpoints.
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Radar and Signal Processing Front-Ends
Defense and weather-radar systems benefit from the EP4SGX70HF35C2N's combination of multi-Gbps transceivers and DSP blocks. ADC samples captured at 1-3 GSPS stream into the transceivers, then are decimated and FFT-processed by the on-chip DSP blocks and 7.5 Mbits of block RAM. The 488 I/Os connect to high-pin-count ADCs and DAC mezzanines. Compared with general-purpose processors, the FPGA's parallel DSP architecture delivers 10-100x throughput per watt for radar pulse compression and moving-target indication algorithms.
추천
Broadcast Video Infrastructure
Broadcast studios use the EP4SGX70HF35C2N for SDI routing, format conversion, and overlay processing. The 8.5 Gbps transceivers accept 3G-SDI and emerging 6G/12G-SDI feeds, while the 72,600 logic elements handle de-interlacing, color-space conversion, and alpha blending in real time. The 488 user I/Os support multiple SDI inputs plus HDMI/DVI monitor outputs. The 1152-ball FCBGA package enables high-density boards required by 1U broadcast frames, with predictable thermal performance thanks to the flip-chip attach.
추천
High-Performance Computing Accelerators
In HPC clusters and financial-trading appliances, the EP4SGX70HF35C2N accelerates compute-intensive kernels such as Monte Carlo simulations, option pricing, and cryptography. The 488 user I/Os feed DDR3/QDRII+ memories at hundreds of MHz, while the 8.5 Gbps transceivers link to neighbouring accelerators over low-latency serial channels. The 40nm process offers a favourable performance-per-watt profile compared with older 65nm FPGAs, making this part a common choice for latency-sensitive trading systems where sub-microsecond response times are critical.
추천
Telecom Line Card Processing
Telecom OEMs integrate the EP4SGX70HF35C2N into OTN, SDH/SONET, and Ethernet line cards for framing, mapping, and OAM processing. The 8.5 Gbps transceivers interface to SFP+ and XFP optical modules, while the FPGA fabric implements GFP, LCAS, and Ethernet MAC protocols. The 1152-ball FCBGA provides the I/O density required for backplane-facing SERDES plus front-panel optical connections. Compared with ASIC alternatives, the FPGA enables rapid feature upgrades as telecom standards evolve, justifying the higher unit cost in early-production deployments.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4SGX70HF35C2N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX70HF35C2G | EP4SGX70HF35C2 | EP4SGX70HF35C3N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel (Altera) | Intel |
| Package | 1152-BBGA, FCBGA (HF35) | 1152-BBGA, FCBGA (HF35) | 1152-BBGA, FCBGA (HF35) | 1152-BBGA, FCBGA (HF35) |
| Logic Elements | 72,600 | 72,600 | 72,600 | 72,600 |
| Embedded Memory (bits) | 7,564,880 | 7,564,880 | 7,564,880 | 7,564,880 |
| User I/Os | 488 | 488 | 488 | 488 |
| Speed Grade | C2 | C2 | C2 | C3 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Lead-Free Finish | Yes (N suffix) | Yes (G suffix) | No (SnPb) | Yes (N suffix) |
| Lifecycle Status | NRND | NRND | NRND | NRND |
| Approx. Unit Price (qty 1, USD) | 2850.00 | 2880.00 | 2750.00 | 3200.00 |
주요 차별점
- Drop-in lead-free variant on the same HF35 footprint (vs EP4SGX70HF35C2G)
- Faster -3 speed grade with same pin-out (vs EP4SGX70HF35C3N)
- Full drop-in compatibility with -C2 speed grade (vs EP4SGX70HF35C2)
설계 노트
The Stratix IV GX core operates from a 0.9 V supply that can demand 15-25 A at full utilization. Use a buck converter with at least 30 A headroom and place ceramic decoupling (10 µF bulk + 0.1 µF + 0.01 µF) within 100 mils of each VCC pin. Separate VCCRT, VCCR, VCCT, and VCCL_GXB supplies are required for the transceiver analog and clock domains; isolate them from the digital core with ferrite beads and star-ground to the PCB ground plane. According to the Stratix IV GX power management user guide, do not share a regulator between digital and analog transceiver rails - switching noise couples into CDR bandwidth.
Estimated: at 0.9 V core × 20 A = 18 W core dissipation plus 8 W transceiver power, the HF35 package can dissipate 25-30 W at full transceiver and logic utilization. The 1152-ball FCBGA with theta_JA around 8-10 C/W (with 200 LFM airflow) requires either a heat spreader bonded to the top of the BGA or a heat sink with thermal interface material. Without airflow, derate utilization to 70% to keep junction below 100 C. Monitor the on-die temperature diode via the TEMP_SENSE pins during bring-up.
The 1152-ball FCBGA uses 1.0 mm ball pitch with flip-chip attach - PCB manufacturing requires laser-drilled micro-vias (5-6 mil diameter) and high-density interconnect (HDI) stack-up. Maintain 100-ohm differential impedance (90-ohm optional) on all transceiver channels and reference to a continuous ground plane in layer 2. According to Intel pin-out guidelines, route all 8.5 Gbps signals with matched lengths within 5 mils of each other and minimize the via count to two or fewer per channel.
Pre-emphasis and equalization settings on the Stratix IV GX transceivers must be tuned per channel using the Quartus Transceiver Toolkit with PRBS-31 patterns. Use the on-chip eye-monitor feature to validate post-equalization opening against a 0.5 UI mask at the rated BER (10^-12 for most protocols). Place AC-coupling capacitors (100 nF 0402) within 200 mils of each transmitter output, sized for the protocol's lowest data rate.
Configuration failures on the EP4SGX70HF35C2N are commonly caused by insufficient MSEL pin settings (must match the desired configuration scheme) and incorrect DCLK routing during passive serial modes. Verify all power supplies are within 3% tolerance before releasing nCONFIG - out-of-spec voltages trigger brown-out detection and abort configuration. Avoid in-system reconfiguration while transceivers are active; pause data flow before triggering partial reconfiguration to prevent CDR unlock.
규정 준수 정보
Lead-free terminal finish per 'N' suffix in Intel/Altera ordering nomenclature. RoHS and REACH compliance certificates should be requested from the distributor at quote time. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC.
