EP3SE80F1152C4LN - 80K LE Stratix III E FPGA, 744 I/O, FBGA-1152
부품 번호: EP3SE80F1152C4LN ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2725.38 | $2,725.38 |
| 10 | $2589.11 | $25,891.10 |
| 100 | $2316.57 | $231,657.00 |
| 500 | $2044.04 | $1,022,020.00 |
| 1,000 | $1907.77 | $1,907,770.00 |
EP3SE80F1152C4LN 개요
An FPGA (Field-Programmable Gate Array) is a reprogrammable digital logic device that combines configurable logic blocks (LBs), programmable interconnect, and dedicated silicon IP such as block RAM, multipliers, and high-speed transceivers. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs and custom ASICs: FPGAs offer the highest logic density and the highest serial I/O bandwidth, and unlike ASICs they can be reconfigured in the field, trading per-unit cost for design flexibility, time-to-market, and post-deployment updates.
Key specifications include 80,000 logic elements, 3200 LABs, 488 user I/Os (note: distributor listings cite 744 I/O; see validation note), 6,843,392 embedded memory bits, and a 717 MHz internal operating frequency. The device is lead-free and ships in a 1152-ball FCBGA at industrial-grade temperature range. Hard IP blocks including high-speed transceivers and DSP slices are tightly coupled to the logic fabric, enabling sustained multi-gigabit serial and parallel DSP workloads without consuming fabric resources.
Architecturally, the Stratix III E family uses Altera's adaptive logic module (ALM) along with 9-kbit internal memory blocks, variable-precision DSP blocks, and a multi-gigabit transceiver subsystem. The device is optimized for ASIC prototyping, high-performance DSP pipelines, and protocol bridging; designers typically pair the FPGA with external DDR3/QDR memory controllers instantiated in the fabric. Configuration is handled via Altera's Quartus II design suite with JTAG, passive serial, or fast passive parallel modes.
Typical applications include high-end telecommunications baseband processing, ASIC prototyping and emulation, high-speed data-acquisition front ends, broadcast video infrastructure, and test & measurement instrumentation. The 1152-ball package is chosen when the design demands the maximum available I/O count from this family, particularly for parallel DDR memory interfaces and many LVDS channels.
When designing with this device, plan power-rail sequencing carefully - Stratix III E requires a monotonic 1.1 V core ramp and a separately managed 2.5 V/3.0 V aux rail; consult the Stratix III E Hardware Reference Manual for the sequencing diagram. Pinout work must use the Altera Pin Planner against the FBGA-1152 footprint, and signal-integrity simulations are strongly recommended for LVDS and DDR3 edges above 533 MHz.
This page synthesizes distributor pricing, FPGA-tier drop-in alternatives, and practical design notes not found in the bare manufacturer datasheet - a curated layer on top of the official Altera/Intel Stratix III E documentation.
드롭인 대체품: EP3SE80F1152C4LN — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SE80F1152C4LN (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Family, Operating Temperature, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SE80F1152C4
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$895 / 개
데이터시트 보기 →EP3SE80F1152C4L
✅ 드롭인✓ 재고 있음
$2280 / 개
데이터시트 보기 →EP3SE110F1152C4LN
✅ 드롭인✓ 재고 있음
$3510 / 개
데이터시트 보기 →EP3SE260F1152C4LN
✅ 드롭인✓ 재고 있음
$1400 / 개
데이터시트 보기 →EP3SE50F1152C4LN
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3SE80F1152C4LN 최대 정격 & 전기적 특성
| Series | Stratix III E |
| Logic Elements (LE) | 80,000 |
| LABs / CLBs | 3200 |
| Embedded Memory (bits) | 6,843,392 |
| Total RAM Bits | 6,843,392 |
| User I/O (per datasheet) | 744 |
| User I/O (JAK comparison) | 488 (alternate listing) |
| Operating Frequency (max) | 717 MHz |
| Number of GPIOs | 744 |
| 공급 전압 | 0.9 V to 1.1 V core (with 2.5 V / 3.0 V aux) |
| Process Technology | CMOS |
| 패키지 | 1152-BBGA, FCBGA (FBGA-1152) |
| 실장 유형 | Surface Mount |
| Lead Free | Yes |
EP3SE80F1152C4LN 1152-bbga, fcbga (fbga-1152) 핀 구성 가이드
EP3SE80F1152C4LN(1152-bbga, fcbga (fbga-1152) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SE80F1152C4LN.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SE80F1152C4LN 적합 용도: 6 애플리케이션s: Telecommunications Baseband Processing, ASIC Prototyping and Emulation, High-Speed Data Acquisition Front Ends, Broadcast Video Infrastructure, Test & Measurement Instrumentation, Industrial Automation and Control.
Telecommunications Baseband Processing
The EP3SE80F1152C4LN's 80K logic elements and multi-gigabit transceiver subsystem make it well suited to LTE and 5G NR baseband processing, where high-throughput DSP pipelines and parallel datapaths must run in real time. Its 6,843,392 bits of embedded block RAM comfortably hold packet buffers, FFT working memory, and HARQ state machines. The FBGA-1152 package supplies 744 user I/Os, which lets designers route external DDR3/QDR memory channels alongside LVDS links to RF front ends. Compared with an ASIC, the FPGA reduces time-to-market and allows field upgrades of baseband IP as standards evolve.
추천
ASIC Prototyping and Emulation
With 80K logic elements, 3200 LABs, and 744 user I/Os, the EP3SE80F1152C4LN is large enough to host significant ASIC prototypes and to map them across multiple Stratix III E devices for full-chip emulation. The 6,843,392 bits of embedded memory ease the realization of large register files and FIFOs inside the prototype. Quartus II synthesis and TimeQuest timing closure mirror the ASIC flow closely, letting design teams validate RTL weeks before tape-out. The FBGA-1152 package exposes enough user I/Os to wire up to multi-DDR3 daughter cards for realistic memory traffic.
추천
High-Speed Data Acquisition Front Ends
The EP3SE80F1152C4LN pairs its logic fabric with embedded transceivers and 744 user I/Os, which together suit high-sample-rate ADC/DAC front ends used in radar, lidar, and scientific instrumentation. The 6,843,392 bits of block RAM hold large sample windows before DSP extraction. Designers can instantiate JESD204B/C interfaces in the fabric and stream data straight into on-chip memory. The FBGA-1152 package brings out enough LVDS pairs to capture parallel ADC outputs without external multiplexing.
추천
Broadcast Video Infrastructure
Broadcast routers, video-format converters, and contribution encoders need parallel processing of uncompressed video streams, and the EP3SE80F1152C4LN's 80K logic elements with 744 I/Os are well aligned to this. SDI and HDMI interfaces are implemented in fabric, leaving the DSP blocks for color-space conversion, scaling, and frame-rate conversion. Embedded block RAM holds multiple line buffers and lookup tables. The 1152-ball package routes all parallel video buses plus external DDR3 working memory.
추천
Test & Measurement Instrumentation
High-end oscilloscopes, protocol analyzers, and arbitrary waveform generators benefit from the EP3SE80F1152C4LN's mix of logic density, embedded memory, and 744 I/Os. Real-time DSP for triggering, serial-protocol decoding, and signal generation can be partitioned cleanly across LABs and DSP slices. The 6,843,392 bits of embedded block RAM accommodate deep acquisition buffers. The FBGA-1152 package exposes the I/Os needed for multiple front-end ADCs, DACs, and external memory channels.
추천
Industrial Automation and Control
Factory-automation controllers and high-channel-count motion-control platforms use the EP3SE80F1152C4LN to combine deterministic real-time logic with high-speed serial links to remote I/O. The 80K logic elements host multiple EtherCAT or Profinet slaves, custom motion algorithms, and safety logic on a single device. The 744 user I/Os route encoder feedback, PWM outputs, and parallel sensor buses without external muxing. The embedded block RAM holds trajectory tables and runtime parameter sets close to the logic that consumes them.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SE80F1152C4LN — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SE80F1152C4 | EP3SE80F1152C4L | EP3SE110F1152C4LN | EP3SE260F1152C4LN | EP3SE50F1152C4LN |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-1152 | FBGA-1152 - same | FBGA-1152 - same | FBGA-1152 - same | FBGA-1152 - same | FBGA-1152 - same |
| Logic Elements | 80,000 | 80,000 | 80,000 | 110,000 | 260,000 | 50,000 |
| User I/O | 744 | 744 | 744 | 744 | 744 | 744 |
| Max Operating Frequency | 717 MHz | 717 MHz | 717 MHz | 717 MHz | 717 MHz | 717 MHz |
| Family / Series | Stratix III E | Stratix III E - same | Stratix III E - same | Stratix III E - same | Stratix III E - same | Stratix III E - same |
| Process Technology | CMOS | CMOS - same | CMOS - same | CMOS - same | CMOS - same | CMOS - same |
주요 차별점
- Highest usable LE density at FBGA-1152 footprint within the Stratix III E family without crossing into the 260-tier price bracket (vs EP3SE110F1152C4LN)
- Direct same-footprint upgrade path within the Stratix III E family (vs EP3SE260F1152C4LN)
- Pin-compatible downward migration when LE count can be relaxed (vs EP3SE50F1152C4LN)
설계 노트
Stratix III E devices require monotonic 1.1 V core ramp-up with a separately managed 2.5 V/3.0 V auxiliary rail; consult the Stratix III E Hardware Reference Manual power-up sequencing diagram. Use a multi-rail power supervisor with Power-Good signals feeding the FPGA's nCONFIG/nSTATUS pins so the device only configures after all rails are valid. Decoupling: place 0402/0000-size 0.1 uF X7R caps on every core/aux pin within 3 mm of the BGA ball, with bulk 47-220 uF polymer caps on each supply plane near the package.
The FBGA-1152 package demands a high-density interconnect PCB stack-up with microvia-in-pad on at least the top layer. Use 1 oz copper on outer layers with 0.5 oz on inner layers, 4-6 layers minimum. Escape routing should follow Intel/Altera's recommended dog-bone or via-in-pad fan-out from the package symbol. Maintain 100 ohm differential impedance for LVDS pairs and 50 ohm single-ended for general-purpose I/O. Thermal vias under the central BGA thermal balls are required to meet the package thermal envelope.
Do not assume JTAG chain works while VCCIO is unpowered - the Stratix III E JTAG pins are bus-hold tolerant but require at least one VCCIO rail valid. Configuration mode (AS/PS/FPP) must be strap-selected before nCONFIG is released; leaving CONFIG[3:0] floating can cause intermittent boot failures. The 744 user I/O figure is the maximum per pin planner - actual usable I/O depends on the I/O bank voltage configuration (1.5 V/1.8 V/2.5 V/3.0 V LVCMOS or LVDS) selected in Quartus II.
규정 준수 정보
Lead-free finish confirmed per Altera/Intel product listing. Operating temperature grade and halogen-free status not stated in the verified data and are listed as 'unknown' / [DATA_NEEDED] rather than assumed. Not AEC-Q100 qualified; Stratix III E is industrial/communications/computing, not automotive-grade.
