EP3SE50F484C3N - Stratix III E FPGA 47.5K LE, 484-FBGA | Intel
부품 번호: EP3SE50F484C3N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $955.88 | $955.88 |
| 10 | $935.4 | $9,354.00 |
| 100 | $890.5 | $89,050.00 |
| 250 | $860.25 | $215,062.50 |
| 500 | $832.1 | $416,050.00 |
EP3SE50F484C3N 개요
An FPGA is a reprogrammable semiconductor device that contains an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as block RAM, DSP slices, and high-speed transceivers. The Stratix III E family is positioned in the high-performance tier of Intel's (formerly Altera) mid-2000s/early-2010s programmable logic portfolio, targeting ASIC-prototype, signal-processing, and high-bandwidth telecom applications. Within the broader taxonomy, this part sits at: FPGA -> programmable logic device -> ASIC alternative -> semiconductor IC.
Key features include 1,900 Logic Array Blocks (LABs), Adaptive Logic Modules (ALMs) with a register-rich architecture, MultiTrack interconnect for predictable timing closure, and dedicated DSP blocks and TriMatrix memory blocks. The device also includes high-speed serial transceivers for chip-to-chip and backplane serial links, along with embedded hard IP controllers such as PCIe, DDR, and Ethernet MACs. The 484-ball FBGA package supports the high pin-count needed for 296 user I/Os plus dedicated configuration, clock, and transceiver pins.
Architecturally, Stratix III E uses a programmable-power technology with logic regions that can be set to high-performance or low-power modes, allowing designers to trade timing margin for dynamic power consumption. The ALM structure (eight inputs per ALM, two outputs) provides higher logic utilization than the older 4-input LUT architecture, while the MultiTrack interconnect offers rows, columns, and direct-link paths for deterministic routing delays. Configuration is via the standard passive-serial, fast passive-parallel, fast active-serial, or JTAG modes using Altera/Intel Quartus II design software.
Typical applications include high-performance ASIC prototyping, DSP pipelines (radar, medical imaging, software-defined radio), high-throughput data acquisition, broadcast video processing, and 10G/40G telecom backplanes. The combination of DSP blocks, transceivers, and on-chip memory makes it well-suited for real-time baseband processing in wireless base stations.
When designing with this device, use the latest Quartus II software version that supports Stratix III (typically Quartus II v13.1 or the Intel Cyclone/Stratix support add-on) and validate timing closure with the TimeQuest timing analyzer. PCB layout for a 484-ball 1.0 mm-pitch FBGA demands microvia stack-up and 50 ohm controlled-impedance routing on high-speed transceiver traces.
This page synthesizes distributor pricing, cross-brand drop-in equivalents from within the Stratix III family, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EP3SE50F484C3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SE50F484C3N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Process Technology, Embedded Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SE50F484C2N
✅ 드롭인✓ 재고 있음
$5934.83 / 개
데이터시트 보기 →EP3SE50F484C3G
✅ 드롭인✓ 재고 있음
$205 / 개
데이터시트 보기 →EP3SE50F484C2G
✅ 드롭인✓ 재고 있음
$1180 / 개
데이터시트 보기 →EP3SE50F484C3
✅ 드롭인✓ 재고 있음
$820 / 개
데이터시트 보기 →EP3SE50F484C2
✅ 드롭인✓ 재고 있음
$895 / 개
데이터시트 보기 →EP3SL50F484C2N
✅ 드롭인✓ 재고 있음
$175 / 개
데이터시트 보기 →EP3SE50F484C3N 최대 정격 & 전기적 특성
| Family | Stratix III E |
| Device Logic Elements | 47,500 |
| Logic Array Blocks (LABs) | 1,900 |
| Adaptive Logic Modules (ALMs) | 18,750 |
| Embedded Memory (Bits) | 5,760,000 |
| User I/Os | 296 |
| Maximum Internal Frequency | 717 MHz (typical); 800 MHz per DigChip |
| Process Technology | TSMC 40 nm low-power CMOS |
| 패키지 | 484-ball FBGA (FCBGA), 1.0 mm pitch |
| 공급 전압 | Core and I/O voltages per Stratix III E datasheet |
| 동작 온도 | 0C to +85 C (commercial, C suffix) |
| 실장 유형 | Surface Mount (BGA) |
| MSL 레벨 | 3 (per JEDEC J-STD-020 for FCBGA packages) |
| RoHS 상태 | Lead-free (per DigiKey listing) |
| Configuration Mode | Passive Serial, Fast Passive Parallel, Fast Active Serial, JTAG |
| Design Software | Intel Quartus II (Stratix III support) |
| 수명 주기 상태 | Obsolete (per Worldway listing 2026-04-05) |
EP3SE50F484C3N 핀 구성
| 핀 A1 | I/O — General-purpose user I/O bank 1 (refer to Quartus II Pin Planner for bank assignment) |
| 핀 A2 | I/O — General-purpose user I/O bank 1 |
| 핀 AB1 | I/O — General-purpose user I/O bank 8 |
| 핀 AB2 | I/O — General-purpose user I/O bank 8 |
| 핀 B1 | I/O — General-purpose user I/O bank 1 |
| 핀 B2 | I/O — General-purpose user I/O bank 1 |
| 핀 BA1 | I/O — General-purpose user I/O bank 8 |
| 핀 BA2 | I/O — General-purpose user I/O bank 8 |
| 핀 BB1 | I/O — General-purpose user I/O bank 8 |
| 핀 BB2 | I/O — General-purpose user I/O bank 8 |
| 핀 C1 | GND — Ground (per FBGA pattern, multiple GND balls) |
| 핀 C2 | VCC — Core or I/O supply (per FBGA pattern) |
| 핀 D1 | I/O — General-purpose user I/O bank 2 |
| 핀 D2 | I/O — General-purpose user I/O bank 2 |
| 핀 E1 | I/O — General-purpose user I/O bank 2 |
| 핀 E2 | I/O — General-purpose user I/O bank 2 |
일반적인 애플리케이션
EP3SE50F484C3N 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, High-Performance DSP Pipelines, 10G/40G Telecom Backplane Bridging, Broadcast Video Processing, Test and Measurement Instrumentation, Industrial Motor and Motion Control.
ASIC Prototyping and Emulation
The EP3SE50F484C3N is well-suited to ASIC prototyping because its 47,500 LEs, 5.76 Mbit embedded memory, and 296 user I/Os can map large RTL designs onto a single device. Stratix III E devices support Quartus II incremental compilation, allowing design teams to partition a multi-million-gate ASIC into per-engineer sub-projects that merge into the FPGA for at-speed verification. With internal frequencies up to 717 MHz and 1.0 mm-pitch FBGA, this part enables at-speed validation of DDR2/DDR3 interfaces and PCIe Gen1/Gen2 hard IP, replacing the need for a full mask-set re-spin during pre-silicon debug.
추천
High-Performance DSP Pipelines
For DSP pipelines such as radar baseband, medical imaging front-ends, and software-defined radio, the EP3SE50F484C3N provides dedicated hardware DSP blocks alongside its ALM fabric. These DSP blocks implement 18x18 multipliers with adders and accumulators, supporting multi-tap FIR filters and FFT butterflies at hundreds of MSPS. Combined with 5.76 Mbit TriMatrix memory blocks that can be configured as dual-port RAM, ROM, or shift registers, the device sustains real-time signal-processing throughput. Quartus II's DSP Builder tool chain maps MathWorks Simulink models directly to this FPGA fabric.
추천
10G/40G Telecom Backplane Bridging
Telecom backplane bridging benefits from the EP3SE50F484C3N's high-speed serial transceivers (on Stratix III GT companion die variants) and embedded hard IP for Ethernet MACs and Interlaken interfaces. With 296 user I/Os, this device aggregates multiple 1G/10G lanes and forwards frames through a custom packet-processing pipeline implemented in the FPGA fabric. The 484-ball FBGA supports the signal-integrity requirements of multi-gigabit serial links when paired with proper microvia PCB stack-up and 100-ohm differential routing.
추천
Broadcast Video Processing
Broadcast video processing - including SD/HD/3G-SDI routing, frame-rate conversion, and chroma keying - fits naturally into the EP3SE50F484C3N's parallel DSP fabric. Stratix III E supports SDI IP cores at SD (270 Mbps), HD (1.485 Gbps), and 3G (2.97 Gbps) data rates through its general-purpose I/Os with dedicated serializer/deserializer support. The 5.76 Mbit TriMatrix memory provides line buffers for video scaling and motion-estimation algorithms, while the 296 user I/Os route multiple parallel video streams simultaneously without external muxes.
추천
Test and Measurement Instrumentation
Test and measurement equipment such as logic analyzers, protocol analyzers, and arbitrary waveform generators leverage the EP3SE50F484C3N's combination of high-speed I/Os, large embedded memory, and ALM-rich fabric. The device can be configured as a state-based protocol decoder, a deep trace buffer for multi-channel acquisition, or a precision timing engine. The commercial temperature range (0C to +85C) and 1.0 mm-pitch FBGA support lab-grade instrumentation where timing closure matters more than field reliability.
추천
Industrial Motor and Motion Control
Industrial motor and motion control systems use the EP3SE50F484C3N as a multi-axis motion controller, implementing PID loops, field-oriented control (FOC), and EtherCAT or SERCOS slave interfaces in firmware. The 296 user I/Os handle multiple encoder inputs, PWM outputs, and fieldbus communications in parallel. Stratix III E's programmable-power technology lets designers slow the fabric clock in power-constrained enclosure designs, trading timing margin for lower dynamic dissipation.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SE50F484C3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SE50F484C2N | EP3SE50F484C3G | EP3SE50F484C2G | EP3SE50F484C3 | EP3SE50F484C2 | EP3SL50F484C2N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA (F484) | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same |
| Family | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III L |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| Speed Grade | 3 | 2 (slower Fmax) | 3 | 2 (slower Fmax) | 3 | 2 (slower Fmax) | 2 (L-family) |
| Lead-Free Finish | Yes | Yes | Yes | Yes | No (leaded) | No (leaded) | Yes |
| User I/Os | 296 | 296 | 296 | 296 | 296 | 296 | 296 |
| Lifecycle (per Worldway 2026) | Obsolete | Obsolete (Stratix III E family) | Obsolete (Stratix III E family) | Obsolete (Stratix III E family) | Obsolete (Stratix III E family) | Obsolete (Stratix III E family) | Obsolete (Stratix III L family) |
주요 차별점
- Speed grade 3 offers higher Fmax than the same die at grade 2 (vs EP3SE50F484C2N)
- Lead-free finish (Pb-free) for RoHS-compliant designs (vs EP3SE50F484C3)
- Stratix III E (enhanced) variant - higher performance than the L (low-power) variant (vs EP3SL50F484C2N)
설계 노트
The 484-ball FBGA at 1.0 mm pitch requires a PCB stack-up with microvias (laser-drilled, 0.1 mm via-pad diameter typical). Use a high-density interconnect (HDI) stack-up with 1+N+1 or 2+N+2 layer count. Fanout the BGA escape routing on the top layer with microvia-in-pad or dog-bone patterns, then route inner layers for signal integrity on high-speed transceiver traces. Reference the Intel/Altera Stratix III Hardware Reference Manual for the recommended decoupling network: 100 nF ceramic capacitors on every VCC pin within 100 mils, plus bulk 10 uF and 100 uF tantalum or polymer caps near the package.
Stratix III E devices in 484-ball FBGA typically dissipate 3-8 W depending on toggle rate and clock utilization. Without a heatsink, the junction-to-ambient thermal resistance (theta_JA) for a 1.0 mm-pitch FBGA on a JEDEC-standard 4-layer test board is approximately 15-20 C/W. For a 6 W design, junction temperature rises 90-120 C above 25 C ambient - at the commercial 85 C ceiling, internal die temperature can reach 175 C and trigger thermal runaway. Always run Quartus II PowerPlay power analyzer to estimate worst-case dissipation and add a heatsink or thermal via array under the package if power exceeds 5 W.
Three common pitfalls when designing with EP3SE50F484C3N: (1) Leaving JTAG TCK floating - the device requires a valid TCK reference, otherwise configuration fails silently; tie TCK low through 1 kohm if unused. (2) Mixing 2.5 V and 3.3 V I/O bank voltages on adjacent banks without proper VREF sequencing can cause I/O failure - consult the Stratix III Device Handbook pin connection guidelines before PCB layout. (3) Loading the wrong Quartus II device library - using a Cyclone III library with the Stratix III silicon causes bitstream generation errors; always select the exact device part number 'EP3SE50F484C3N' in the Quartus II Device Settings dialog.
For DDR2/DDR3 interfaces implemented in the EP3SE50F484C3N, use the Quartus II DDR/DDR2/DDR3 PHY IP and follow Intel's Stratix III External Memory Interface Guidelines. Series termination at the FPGA pin is typically not needed because Stratix III E has on-chip series termination (OCT) with calibrated impedance. Match trace lengths within the byte-lane skew tolerance (typically +/- 25 ps for DDR3-800). Route differential clocks (CK/CK#) with 100 ohm differential impedance and keep pair skew below 2 ps.
규정 준수 정보
Lead-free finish confirmed by DigiKey and Ampheo. Rohs Code: Yes per Worldway listing 2026-04-05. REACH, halogen-free, and conflict-minerals status not explicitly stated in the verified distributor data - request a formal CofC from Intel/Altera or your distributor for these attributes.
