EP3SE50F484I4L - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel
부품 번호: EP3SE50F484I4L ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1497.82 | $1,497.82 |
| 10 | $1480 | $14,800.00 |
| 100 | $1420 | $142,000.00 |
| 500 | $1350 | $675,000.00 |
| 1,000 | $1290 | $1,290,000.00 |
EP3SE50F484I4L 개요
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor IC whose logic function is defined by the customer after manufacture, using an HDL (Hardware Description Language) such as Verilog or VHDL. FPGAs sit hierarchically between standard logic ICs (fixed function, cheapest per gate) and ASICs (custom silicon, lowest unit cost at very high volume). The Stratix III family is positioned in the high-end, mid-density tier - above entry-level Cyclone devices but below the largest Stratix V/10/Agilex families - and targets applications such as ASIC prototyping, high-speed DSP, and communications infrastructure.
Key features of the EP3SE50F484I4L include a maximum core clock of 717 MHz (per third-party listings), 12 transceiver-like PLLs (per Stratix III E family literature), 24 global clock networks, and partial reconfiguration support. The FBGA-484 package enables dense board routing and supports up to 296 user I/O pins with multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL) per the Stratix III device handbook.
Architecturally, the Stratix III E family uses an adaptive logic module (ALM) of eight inputs, allowing finer-grained packing than the 4-input LUT of older families. The 40 nm process node combined with programmable power technology enables lower static power than the prior Stratix II generation while preserving transceivers and DSP density.
Typical applications for this device include ASIC prototyping and emulation, high-speed DSP (radar, video processing), communications infrastructure (bridges, line cards), industrial imaging, and test & measurement backplanes. In systems where a Stratix III E FPGA already exists, the speed grade 4 part is commonly chosen for the lowest unit cost.
When designing, verify the I/O voltage bank assignments against the Stratix III Device Handbook pin tables; the -4 speed grade trades roughly 25-30% of Fmax versus -2 grades, so timing closure must be budgeted accordingly in Quartus II. The industrial temperature range (-40C to +100C junction) makes this part suitable for outdoor and factory-floor equipment.
This page synthesizes distributor pricing, the Stratix III E family datasheet context, and drop-in alternate speed-grade and pin-compatible variants not all listed on a single manufacturer page.
드롭인 대체품: EP3SE50F484I4L — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SE50F484I4L (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, RoHS Status, Process Technology, Embedded Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SE50F484I4
✅ 드롭인✓ 재고 있음
$730 / 개
데이터시트 보기 →EP3SE50F484I4G
✅ 드롭인✓ 재고 있음
$285 / 개
데이터시트 보기 →EP3SE50F484I3N
✅ 드롭인✓ 재고 있음
$841.66 / 개
데이터시트 보기 →EP3SE50F484I3
✅ 드롭인✓ 재고 있음
$188 / 개
데이터시트 보기 →EP3SE50F484I3G
✅ 드롭인✓ 재고 있음
$1180 / 개
데이터시트 보기 →EP3SE50F484I4L 최대 정격 & 전기적 특성
| Family | Stratix III E |
| Logic Elements (LE) | 47,500 |
| Logic Array Blocks (LABs) | 1,900 |
| Embedded Memory | 5,760 Kbit (5.625 Mbit) |
| Embedded Multipliers (18x18) | 384 |
| Maximum User I/O | 296 |
| Maximum Core Clock | 717 MHz (per third-party listing) |
| Speed Grade | 4 (slowest) |
| 동작 온도 범위 | Industrial (I): -40C to +100C junction |
| Process Node | 40 nm CMOS |
| 패키지 | 484-ball FCBGA (FBGA-484) |
| 실장 유형 | Surface Mount (BGA) |
| 공급 전압 | Multiple rails: core 0.9V, I/O 1.2V-3.3V (per Stratix III handbook) |
| Configuration Method | Quartus II / EPCS serial / parallel |
| Lead-Free (Pb-free) | Yes (L suffix) |
| RoHS 상태 | Compliant |
| MSL 레벨 | MSL3 (per JEDEC J-STD-020, typical for FBGA-484) |
EP3SE50F484I4L 484-ball fcbga (fbga-484) 핀 구성 가이드
EP3SE50F484I4L(484-ball fcbga (fbga-484) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SE50F484I4L.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SE50F484I4L 적합 용도: 7 애플리케이션s: ASIC Prototyping and Emulation, High-Speed DSP (Radar / Video Processing), Communications Infrastructure (Line Cards), Industrial Imaging and Machine Vision, Test and Measurement Instrumentation, Legacy Defense / Aerospace System Refresh, Medical Imaging Back-End Processing.
ASIC Prototyping and Emulation
The EP3SE50F484I4L fits ASIC prototyping and emulation because its 47,500 logic elements, 384 (18x18) hardware multipliers, and 5.625 Mbit embedded memory allow mapping of mid-complexity ASIC RTL blocks directly. The FBGA-484 footprint exposes 296 user I/Os for connecting to DUT boards via high-speed LVDS pairs. Compared with using an ASIC, this FPGA cuts bring-up time from months to days and supports in-system debug with SignalTap II logic analyzer built into Quartus II. Typical use: a network processor ASIC is mapped onto the EP3SE50 with clock-accurate pre-silicon validation running at 200-300 MHz core clock.
추천
High-Speed DSP (Radar / Video Processing)
The EP3SE50F484I4L is well suited to high-speed DSP workloads because its 384 (18x18) hardware multipliers and 5.625 Mbit M9K block RAM enable parallel FIR filtering and FFT implementations at hundreds of MSPS. For radar baseband processing, the FPGA can implement 1024-point FFTs in pipeline mode. For HD video processing, the LVDS I/O supports SMPTE SDI input at up to 1.485 Gbps via external serializer/deserializer chips. Industrial temperature range suits outdoor radar enclosures and factory vision systems.
추천
Communications Infrastructure (Line Cards)
The EP3SE50F484I4L suits communications line cards because its 296 user I/Os and multiple LVDS channels enable bridging between network processors, SERDES framer ICs, and backplane connectors. Per Stratix III handbook, the LVDS I/O can run up to 840 Mbps with internal SERDES, and the device has 24 global clock networks to support source-synchronous parallel interfaces. Power consumption benefits come from Stratix III's programmable power technology - logic blocks can be put into low-power mode when traffic bursts idle.
추천
Industrial Imaging and Machine Vision
The EP3SE50F484I4L fits industrial imaging and machine vision because the 296 user I/Os allow connection to multiple image sensors (Camera Link, MIPI via external bridge) and the embedded multipliers accelerate image preprocessing kernels (Sobel, Gaussian, thresholding). The industrial temperature range (-40C to +100C junction) covers factory-floor enclosures. FBGA-484 board design needs careful thermal management - typical vision systems consume 3-5 W from the FPGA, requiring 4-layer PCB with thermal vias under the package.
추천
Test and Measurement Instrumentation
The EP3SE50F484I4L works well in test and measurement instruments because the 5.625 Mbit embedded memory acts as deep sample storage and 296 I/Os connect to ADC/DAC front-ends. Per the Stratix III handbook, the ALM-based architecture enables arbitrary waveform generation and protocol-aware pattern generation up to 540 Mbps per LVDS pair. Industrial temperature and FBGA-484 footprint make it suitable for benchtop or rack-mount instruments that may be deployed in factory environments.
추천
Legacy Defense / Aerospace System Refresh
The EP3SE50F484I4L is commonly chosen for legacy defense and aerospace system refresh programs because the Stratix III E family was designed for high-reliability industrial/military environments and the FBGA-484 package supports standard surface-mount reflow assembly. Programs with 15-20 year lifecycle requirements often stockpile the EP3SE50 variant before Last Time Buy cutoffs. Compared with migrating to a newer family, dropping in a speed-grade 4 part minimizes requalification effort because timing margins are typically met without rework.
추천
Medical Imaging Back-End Processing
The EP3SE50F484I4L suits medical imaging back-end processing because the 384 hardware multipliers and M9K memory blocks enable real-time ultrasound beamforming and image reconstruction at clinically relevant frame rates. LVDS I/O connects directly to the ADC outputs from the analog front-end (typically 12-14 bits at 40-80 MSPS per channel). Industrial temperature and lead-free (L suffix) compliance ease regulatory approval for medical device manufacturers. Compared with GPU-based processing, this FPGA approach delivers deterministic latency and lower power consumption.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SE50F484I4L — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SE50F484I4 | EP3SE50F484I4G | EP3SE50F484I3N | EP3SE50F484I3 | EP3SE50F484I3G |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-ball FBGA | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Speed Grade | 4 | 4 | 4 | 3 (faster) | 3 (faster) | 3 (faster) |
| Temperature Range | Industrial (I): -40C to +100C | Industrial (I): -40C to +100C | Industrial (I): -40C to +100C | Industrial (I): -40C to +100C | Industrial (I): -40C to +100C | Industrial (I): -40C to +100C |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| Maximum User I/O | 296 | 296 | 296 | 296 | 296 | 296 |
| Embedded Memory | 5,625 Kbit | 5,625 Kbit | 5,625 Kbit | 5,625 Kbit | 5,625 Kbit | 5,625 Kbit |
| Lead-Free Marking (L suffix) | Yes (L) | No (non-L) | No L, but G (gold-wire) variant | No L, but N (no-lead-free finish option) | No (non-L) | No L, but G (gold-wire) variant |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
주요 차별점
- Lowest-cost speed grade in the Stratix III E family (vs EP3SE50F484I3N)
- Explicit lead-free (Pb-free) marking on datasheet and label (vs EP3SE50F484I4 (non-L))
- Industrial temperature range with lead-free compliance (vs EP3SE50F484C4L (commercial temp variant))
설계 노트
Estimated: The FBGA-484 EP3SE50 has typical junction-to-ambient thermal resistance of approximately 8-12 C/W on a 4-layer JEDEC test board with thermal vias under the package. At full utilization (47.5K LE @ ~70% toggle rate, 296 I/O switching at LVCMOS 3.3V), typical core power is 3-5 W. With 10 C/W theta_JA, this yields a 30-50 C junction rise above ambient - within the industrial +100 C limit but leaving little margin in enclosed cabinets. For sealed enclosures, recommend a thermal pad or heatsink attached to the package top.
The 484-ball FBGA requires microvia or laser-drilled via PCB technology for breakout routing. Standard 0.4 mm pitch BGA escape rules demand at least 4 routing layers for full I/O access. Per Intel's Stratix III pin connection guidelines, VCCINT (core 0.9V), VCCD_PLL, and VCCIO bank supplies each require their own decoupling network: 0.1 uF X7R ceramic within 100 mil of each ball, plus 10 uF bulk per supply rail. Failure to provide adequate high-frequency decoupling results in PLL jitter and unreliable JTAG configuration.
When substituting EP3SE50F484I4L with a speed-grade -3 part (e.g., EP3SE50F484I3N), be aware that timing margins change: -3 parts run ~12% faster internally. If your design was timing-closed at -4 grade, it will still pass at -3 with positive slack, so the substitution is safe. However, the reverse (placing a -4 part where -3 was specified) can fail timing closure - do not substitute in that direction without re-running Quartus TimeQuest timing analysis. Quartus II software version 13.1 is the last officially supported release for Stratix III.
Estimated: The Stratix III E family uses Programmable Power Technology that allows unused ALMs to be put into low-power mode, achieving roughly 30% lower static power than Stratix II. A typical EP3SE50 design at 50% utilization draws 1.5-3.0 W from VCCINT (0.9V core) plus 0.5-1.5 W from VCCIO banks. Design PowerPlay Power Analyzer in Quartus II should be run with realistic toggle rates to get an accurate pre-layout power estimate, then validated against post-layout power with Vectorless Power Estimation.
For DDR/DDR2/DDR3 SDRAM interfaces on the EP3SE50F484I4L, use the OCT (On-Chip Termination) calibration feature in Quartus II to automatically adjust series and parallel termination. Match DQ/DQS trace lengths within +/-25 mil and keep address/command traces within +/-100 mil of clock for DDR2 at 400 MHz. Use 50-ohm microstrip or stripline controlled-impedance routing on the outer or inner layers. Pin assignment matters: place DQS groups on the same I/O bank to share VREF and OCT resources.
규정 준수 정보
RoHS compliant per L suffix and Intel/Altera product page. Not AEC-Q100 qualified - this is an industrial-temperature FPGA, not automotive-grade. Halogen-free status not stated in the verified data; many Stratix III variants use halogen-free laminate but the FPGA package itself may not be certified. For new automotive designs use a Cyclone 10 GX or Arria 10 device with AEC-Q100 qualification.
