EP3SL200F1517I4N - Stratix III L FPGA, 200K LE, 1517-FCBGA | Intel
부품 번호: EP3SL200F1517I4N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5800 | $5,800.00 |
| 10 | $5520 | $55,200.00 |
| 100 | $5100 | $510,000.00 |
| 500 | $4720 | $2,360,000.00 |
| 1,000 | $4400 | $4,400,000.00 |
EP3SL200F1517I4N 개요
An FPGA (Field-Programmable Gate Array) is a reconfigurable digital integrated circuit containing an array of programmable logic blocks, programmable interconnects, and dedicated hardened IP such as memory, transceivers, DSP blocks, and PLLs. FPGAs occupy a unique position in the digital semiconductor hierarchy: programmable logic -> FPGA -> programmable logic device -> digital IC -> semiconductor. Compared to ASICs, FPGAs offer post-fabrication hardware reconfiguration and lower NRE cost; compared to CPLDs, FPGAs offer much higher logic density and richer DSP/memory resources. The Stratix III L variant of the Stratix III family was specifically tuned by Intel/Altera for the lowest static and dynamic power consumption within that generation.
Key differentiating features include 200K logic elements (LEs), 10,901,504 bits of on-chip memory (10.9 Mbit equivalent), a MultiTrack interconnect fabric, TriMatrix memory blocks, DSP blocks for high-throughput signal processing, and 976 maximum user I/Os to enable interface-rich designs. The 1517-FCBGA package exposes extensive IO and power/ground balls for signal integrity in high-pin-count backplane and ASIC-prototype designs. Internal frequency figures cited in datasheet mirrors reach up to ~717 MHz for logic and ~800 MHz for memory-related paths.
The architecture uses logic array blocks (LABs) containing adaptive logic modules (ALMs), interconnected by the MultiTrack fabric, with column- and row-based DSP blocks and embedded M20K memory blocks. The 65 nm process enables tighter integration while the Stratix III L tuning delivers lower quiescent leakage than the Stratix III standard variant. This balance makes the EP3SL200F1517I4N well suited to high-throughput DSP, multi-gigabit serial interfaces, and ASIC emulation/emulation of complex SoCs.
Typical applications include ASIC prototyping and emulation, high-performance DSP for wireless baseband and radar, multi-gigabit serial backplane bridging, test and measurement instrumentation, and high-end video/image processing. The high IO count also suits the part to memory-rich systems and large fan-out glue logic on telecom line cards.
When designing with the EP3SL200F1517I4N, plan for the 1517-FCBGA land pattern, multiple decoupling capacitor rails close to the package, and a multi-layer PCB with controlled-impedance layers for transceivers and memory interfaces. Thermal management must accommodate the FCBGA's central ball array; follow Intel/Altera's reference thermal design for high-density Stratix III boards.
This page synthesizes distributor pricing, drop-in same-package alternatives within the Stratix III lineup, and practical design notes not aggregated on a single manufacturer or distributor page.
드롭인 대체품: EP3SL200F1517I4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL200F1517I4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Core Voltage, Family, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL200F1517I4
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1325 / 개
데이터시트 보기 →EP3SL200F1517I4L
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2280 / 개
데이터시트 보기 →EP3SL200F1517I4LN
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$6300 / 개
데이터시트 보기 →EP3SL200F1517I3N
✅ 드롭인✓ 재고 있음
$1620 / 개
데이터시트 보기 →EP3SL200F1517I4N 최대 정격 & 전기적 특성
| Family | Stratix III L |
| Logic Elements | 200,000 |
| Embedded Memory Bits | 10,901,504 |
| Maximum User I/Os | 976 |
| 동작 온도 | -40C to +100C (Industrial) |
| Speed Grade | I4 |
| Core Voltage | 1.1 V |
| Process Technology | 65 nm CMOS |
| 패키지 | 1517-ball FCBGA |
| 실장 유형 | Surface Mount |
| Internal Logic Frequency (max, datasheet mirror) | 717 MHz |
| Memory Path Frequency (datasheet mirror) | 800 MHz |
| Lead-Free Status | Yes |
| RoHS 상태 | Compliant |
EP3SL200F1517I4N 1517-ball fcbga 핀 구성 가이드
EP3SL200F1517I4N(1517-ball fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL200F1517I4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL200F1517I4N 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, High-Performance DSP (Wireless Baseband / Radar), Multi-Gigabit Serial Backplane Bridging, Test and Measurement Instrumentation, High-End Video and Image Processing, Industrial Control and Motor Drive.
ASIC Prototyping and Emulation
The EP3SL200F1517I4N fits ASIC prototyping because it offers 200K logic elements and 10.9 Mbit of embedded memory - large enough to map medium-complexity SoCs and validate RTL before tape-out. Its 976 user I/Os allow direct fan-out to system memory buses, PHY interfaces, and JTAG/trace headers without external muxes. Designers typically instantiate multiple EP3SL200F1517I4N devices in a multi-FPGA partition for sub-1M-gate ASICs, using the Quartus II TimeQuest flow for static timing closure. The 1517-FCBGA package exposes the IO bandwidth required for chip-to-chip interconnect at LVDS and SSTL signaling rates.
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High-Performance DSP (Wireless Baseband / Radar)
The Stratix III L DSP blocks deliver hundreds of GMACs of 18x18 multiply-accumulate throughput, well matched to wireless baseband and radar signal-processing pipelines. The EP3SL200F1517I4N's 10.9 Mbit of embedded memory supplies the data buffering required by FFT, channelization, and pulse-compression algorithms without depending on external SRAM. The 65 nm L process variant reduces static leakage compared with the standard Stratix III, an advantage in always-on radio heads. Multi-gigabit transceivers on the die handle ADC-to-FPGA links at typical JESD204B rates.
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Multi-Gigabit Serial Backplane Bridging
Backplane bridging between chassis on telecom and data-center line cards requires multi-gigabit transceivers with deterministic latency, both of which the EP3SL200F1517I4N supplies. The 976 user I/Os let designers route multiple CPRI, OBSAI, 10G-KR, or PCI Express Gen2 lanes through a single device. Stratix III L tuning holds static power low across the unused transceiver channels, important for always-reachable systems. The 1517-FCBGA supports the controlled-impedance stack-up required by 6+ Gbps signaling.
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Test and Measurement Instrumentation
The EP3SL200F1517I4N's mix of high IO count, large memory, and DSP resources suits high-end oscilloscopes, protocol analyzers, and arbitrary waveform generators. Embedded M9K/M144K blocks buffer deep acquisition windows, while DSP blocks compute FFTs and digital demodulation in real time. The -40C to +100C industrial temperature grade supports bench, lab, and field-deployed instruments. Engineers typically pair it with high-speed ADCs and DACs through the LVDS and SERDES banks.
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High-End Video and Image Processing
Video broadcast routers, medical imaging pre-processors, and machine-vision inspection systems benefit from the EP3SL200F1517I4N's parallel DSP pipelines and 10.9 Mbit on-chip memory. Frame buffers fit into M144K blocks, eliminating external SRAM for resolutions up to about 1080p60 in moderate pipeline depth. The 976 user I/Os accommodate parallel Camera Link, HDMI, and DisplayPort LVDS interfaces. Designers typically run multi-tap filter chains (Sobel, Gaussian, motion estimation) at full pixel rate within the device.
추천
Industrial Control and Motor Drive
Although FPGA use in industrial control is more common with low-power Cyclone families, the EP3SL200F1517I4N serves high-channel-count motion controllers and high-end PLCs that need parallel deterministic processing. Its logic density supports multi-axis servo loops at sub-microsecond cycle times, while the industrial -40C to +100C range tolerates factory-floor environments. The 1517-FCBGA package suits sealed enclosures with chassis-mounted thermal solutions.
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추천 제품 요약
엔지니어링 참조 데이터: EP3SL200F1517I4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL200F1517I4 | EP3SL200F1517I4L | EP3SL200F1517I4LN | EP3SL200F1517I3N | EP3SL200F1152I4N |
|---|---|---|---|---|---|---|
| Package | 1517-ball FCBGA | 1517-ball FCBGA | 1517-ball FCBGA | 1517-ball FCBGA | 1517-ball FCBGA | 1152-ball FCBGA |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| Embedded Memory (bits) | 10,901,504 | 10,901,504 | 10,901,504 | 10,901,504 | 10,901,504 | 10,901,504 |
| Maximum User I/Os | 976 | 976 | 976 | 976 | 976 | 744 (approx., smaller package) |
| Speed Grade | I4 (industrial, fastest) | I4 | I4 | I4 | I3 (slower) | I4 |
| Operating Temperature | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
주요 차별점
- Lowest-power variant within the 200K-LE Stratix III family (vs EP3SE260F1517I4N (Stratix III E, 260K LE))
- Highest speed grade in the 1517-FCBGA 200K-LE lineup (vs EP3SL200F1517I3N (I3 speed grade))
- Pin-compatible density upgrade available within the Stratix III generation (vs EP3SL200F1152I4N (1152-ball FCBGA variant))
설계 노트
The 1517-ball FCBGA concentrates heat at the die center. At full utilization of 200K logic elements with high toggle rates, the EP3SL200F1517I4N can dissipate 5-10 W depending on clocking and IO activity. Designers must use the Intel Stratix III thermal model with a custom theta_JB based on the PCB stack-up; a thermal interface material and heatsink are typically required for sealed industrial enclosures. Junction temperature must remain below 100C at the industrial speed grade.
Use a high-layer-count PCB (12+ layers) with continuous reference planes for the FCBGA break-out. Place decoupling capacitors on the bottom side directly under the package balls using microvia-in-pad construction where permitted by the fab house. Provide at least 1 oz copper for power planes supplying the 1.1 V core rail and dedicated ground returns for each transceiver bank. Follow the Intel/Altera Stratix III hardware design guide for BGA escape routing.
Multi-gigabit transceiver channels on the EP3SL200F1517I4N require 100-ohm differential controlled-impedance traces with matched length within each channel. Use the Quartus II PCB Toolkit to export IBIS-AMI or HSPICE models for system-level channel simulation before tape-out. Separate transceiver reference clock routing from data lanes, and isolate analog supply (VCCA_PLL, VCCA_TX/RX) from digital supplies with ferrite beads and pi-filters.
Do not confuse the EP3SL200F1517I4N (Stratix III L, low power, 1517-ball) with EP3SE260F1517I4N (Stratix III E, higher logic density, standard power) - both share the 1517-FCBGA but thermal and power profiles differ. Also verify the Quartus II version supports the I4 speed grade; older Quartus versions may not have updated timing models. Always revalidate pin assignments against the Quartus pin-out file for the specific package option.
규정 준수 정보
Lead-free and RoHS compliant per Intel/Altera product marking on FCBGA package. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. Halogen-free status not confirmed by verified data.