EP3SL200F1517I4LN - Stratix III L FPGA, 200K LE, 1517-BGA | Intel
부품 번호: EP3SL200F1517I4LN ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $7993.16 | $7,993.16 |
| 10 | $7600 | $76,000.00 |
| 100 | $7100 | $710,000.00 |
| 500 | $6650 | $3,325,000.00 |
| 1,000 | $6300 | $6,300,000.00 |
EP3SL200F1517I4LN 개요
A Field Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic fabric, interconnect, and I/O resources can be configured by the designer after manufacture. FPGAs occupy the top of the programmable logic hierarchy, sitting above CPLDs and below structured ASICs, and are widely used as glue logic, signal-processing accelerators, and high-speed interface bridges. The Stratix III L family in particular targets applications that demand very high logic density combined with the lowest-possible static power consumption in its generation.
The device includes 8,000 Logic Array Blocks (LABs) and 384 (18x18) multipliers supporting up to 288 GMACS of DSP throughput, with dedicated transceivers suited for memory interfaces and high-speed serial links. Adaptive Logic Modules (ALMs) provide 8-input fracturable look-up tables, and the device supports up to 12.5 Gbps transceiver operation in related Stratix IV GT parts. Industrial temperature grade (-40C to +100C) and lead-free assembly make it suitable for harsh-environment embedded systems.
The EP3SL200F1517I4LN architecture is built on a TSMC 65 nm low-power process with Altera's Programmable Power Technology, which allows unused logic, memory, and DSP blocks to enter low-power states. The 1517-ball FCBGA exposes 976 user I/O for parallel memory buses and chip-to-chip interconnects, while on-chip termination and dynamic phase alignment simplify DDR3 SDRAM interface design. Configuration is supported via fast passive parallel, fast active serial, or JTAG modes.
Typical applications include high-performance digital signal processing, ASIC prototyping, high-throughput data acquisition, software-defined radio baseband, wireline backbone packet processing, and high-end test and measurement equipment. The combination of high logic density and embedded transceiver/memory resources enables designers to consolidate multiple functions onto a single device.
When designing with this FPGA, careful PCB layout is essential due to the 40 mm x 40 mm 1517-BGA package with 1.0 mm ball pitch. A multi-layer PCB with buried vias, length-matched differential pairs for transceivers, and dedicated power planes for core, I/O, and auxiliary supplies is required. Quartus II software (or compatible) is required for design entry, synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, verified drop-in alternatives within the Stratix III L family, and practical design notes that complement the manufacturer datasheet, helping engineers evaluate the EP3SL200F1517I4LN for current designs and second-source supply decisions.
드롭인 대체품: EP3SL200F1517I4LN — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL200F1517I4LN (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Family, Operating Temperature, Embedded Memory Bits.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL200F1517I4N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4400 / 개
데이터시트 보기 →EP3SL200F1517I4L
✅ 드롭인✓ 재고 있음
$2280 / 개
데이터시트 보기 →EP3SL200F1517I4
✅ 드롭인✓ 재고 있음
$1325 / 개
데이터시트 보기 →EP3SL200F1517I3N
✅ 드롭인✓ 재고 있음
$1620 / 개
데이터시트 보기 →EP3SE260F1517I4N
✅ 드롭인✓ 재고 있음
$10500 / 개
데이터시트 보기 →EP3SE260F1517I4LN
✅ 드롭인✓ 재고 있음
$2895 / 개
데이터시트 보기 →EP3SL200F1517I4LN 최대 정격 & 전기적 특성
| Family | Stratix III L |
| Logic Elements | 200,000 |
| Embedded Memory Bits | 10,901,504 |
| Logic Array Blocks (LABs) | 8,000 |
| User I/O Pins | 976 |
| 패키지 | 1517-BBGA, FCBGA |
| Process Technology | 65 nm TSMC low-power |
| 동작 온도 | -40C to +100C (Industrial) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
| DSP Blocks (18x18 multipliers) | 384 |
| DSP Performance | 288 GMACS |
| Configuration Method | Passive Parallel / Active Serial / JTAG |
| Ball Pitch | 1.0 mm |
| Package Dimensions | 40 mm x 40 mm |
EP3SL200F1517I4LN 40 mm x 40 mm 핀 구성 가이드
EP3SL200F1517I4LN(40 mm x 40 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL200F1517I4LN.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL200F1517I4LN 적합 용도: 7 애플리케이션s: ASIC Prototyping and Emulation, High-Performance DSP and Signal Processing, Wireline Backbone Packet Processing, High-End Test and Measurement Equipment, Medical Imaging and Diagnostics, Industrial Automation and Machine Vision, Aerospace and Defense Signal Intelligence.
ASIC Prototyping and Emulation
The EP3SL200F1517I4LN is widely used to prototype and emulate large ASIC designs before tape-out, taking advantage of its 200,000 logic elements, 10.9 Mbits of embedded memory, and 384 18x18 multipliers. Quartus II RTL synthesis and incremental compile flows map multi-million-gate ASIC netlists onto a single device, with high-bandwidth on-chip M20K memory emulating SRAM blocks and dedicated DSP blocks accelerating arithmetic units. Compared with smaller FPGAs, the 200K LE capacity lets designers emulate an entire SoC subsystem in one device, eliminating multi-FPGA partitioning overhead.
추천
High-Performance DSP and Signal Processing
The 384 18x18 multipliers delivering up to 288 GMACS make the EP3SL200F1517I4LN ideal for high-throughput DSP workloads such as radar baseband, multi-channel beamforming, and software-defined radio physical-layer processing. Pipelined FIR filters, FFT engines, and matrix multipliers fit comfortably into the available DSP blocks, while 10.9 Mbits of M20K memory provides coefficient and sample buffer storage close to the multipliers. The Stratix III L family variant specifically optimizes the static-power side of the equation, allowing dense DSP farms to run continuously without exceeding thermal envelopes.
추천
Wireline Backbone Packet Processing
The 976 user I/O pins and abundant memory enable the EP3SL200F1517I4LN to implement 10G/40G wireline packet processors, including packet classifiers, QoS schedulers, and encryption accelerators. On-chip M20K memory blocks deliver low-latency lookup-table accesses for TCAM replacements and routing tables, while external DDR3 SDRAM interfaces (via dedicated PHY) handle bulk packet buffering. The low static power of the L variant suits densely-packed line-card designs where multiple FPGAs share a constrained cooling envelope in carrier-grade equipment.
추천
High-End Test and Measurement Equipment
Test instruments such as protocol analyzers, logic analyzers, and arbitrary waveform generators benefit from the EP3SL200F1517I4LN's combination of high logic density, abundant memory, and 976 I/O for parallel sampling. Custom triggering, pattern generation, and protocol-decode logic fit within the 200K LE budget, while M20K memory blocks store deep capture buffers. Industrial temperature rating (-40C to +100C) supports test equipment deployed in factory automation environments, and the lead-free 1517-FCBGA package suits modern RoHS-compliant product designs.
추천
Medical Imaging and Diagnostics
The EP3SL200F1517I4LN powers image-processing pipelines in ultrasound beamformers, MRI reconstruction engines, and CT image pre-processors. Its 200K logic elements handle real-time pixel-rate processing, while the 384 DSP multipliers accelerate back-projection, beamforming, and convolution operations. Industrial temperature grade and lead-free assembly satisfy IEC 60601 medical safety constraints, and the large user I/O count interfaces to high-resolution display panels and multi-channel ADC front-ends used in clinical imaging carts.
추천
Industrial Automation and Machine Vision
Factory-automation systems leverage the EP3SL200F1517I4LN for high-speed machine vision inspection, motion control, and multi-axis robotics. Multiple GigE Vision or Camera Link camera streams are received and processed in parallel, with defect-detection algorithms running on the abundant DSP and logic resources. Industrial temperature grade (-40C to +100C) supports deployment near motors and furnaces, and the lead-free BGA package withstands vibration and thermal cycling in production-line environments. The 976 I/O supports direct connection to multi-axis stepper/servo drives.
추천
Aerospace and Defense Signal Intelligence
Software-defined radio and signal-intelligence platforms use the EP3SL200F1517I4LN for wideband digital downconversion, channelization, and modulation recognition. The combination of high logic density, 384 DSP multipliers, and abundant on-chip memory enables wideband FFTs and polyphase filter banks to be implemented in a single chip. Industrial temperature grade and the package's compatibility with conduction-cooled chassis designs make it suitable for deployed electronic-warfare and signal-intelligence subsystems where power efficiency and density are both critical.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL200F1517I4LN — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL200F1517I4N | EP3SL200F1517I4L | EP3SL200F1517I4 | EP3SL200F1517I3N | EP3SE260F1517I4N | EP3SE260F1517I4LN |
|---|---|---|---|---|---|---|---|
| Package | 1517-BBGA, FCBGA (40x40 mm, 1.0 mm pitch) | 1517-BBGA, FCBGA (same) | 1517-BBGA, FCBGA (same) | 1517-BBGA, FCBGA (same) | 1517-BBGA, FCBGA (same) | 1517-BBGA, FCBGA (same) | 1517-BBGA, FCBGA (same) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III E | Stratix III E |
| Logic Elements | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 254,000 | 254,000 |
| Embedded Memory (bits) | 10,901,504 | 10,901,504 | 10,901,504 | 10,901,504 | 10,901,504 | 14,283,648 | 14,283,648 |
| LABs | 8,000 | 8,000 | 8,000 | 8,000 | 8,000 | 10,160 | 10,160 |
| User I/O | 976 | 976 | 976 | 976 | 976 | 976 | 976 |
| DSP Blocks (18x18) | 384 | 384 | 384 | 384 | 384 | 384 | 384 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | I4 (mid) | I4 | I4 | I4 | I3 (slower) | I4 | I4 |
| Static Power Profile | Low (L family) | Low (L) | Low (L) | Low (L) | Low (L) | Higher (E family, ~25% more idle current) | Higher (E family, ~25% more idle current) |
주요 차별점
- Lowest static power at 200K LE density in Stratix III generation (vs EP3SE260F1517I4N (Stratix III E))
- Highest-density Stratix III L variant available (vs EP3SL110F1152I3N)
- Industrial temperature grade with same package as commercial I4 variant (vs EP3SL200F1517I4 (commercial 0C to +85C))
설계 노트
The 1517-BBGA FCBGA at 1.0 mm pitch requires a high-layer-count PCB (typically 12-16 layers) with HDI micro-via and buried-via technology to fan out the 976 user I/O plus power/ground. Power plane stackup must dedicate separate planes to VCC (core), VCCIO (I/O banks), VCCPD, VCCA_PLL, and VCCBAT, with adequate decoupling (10 uF bulk + 100 nF per supply pin pair). Per the Stratix III handbook pin connection guidelines, every VCC pin must be decoupled; leaving VCC pins unconnected risks supply droop and logic errors.
Estimated: at full utilization (~85% LE, 80% DSP, full I/O toggle), the EP3SL200F1517I4LN dissipates approximately 8-12 W static plus dynamic power. Without heatsink or airflow, the 1517-FCBGA's typical theta_JA of 14-16 C/W would push junction temperature beyond 100C in industrial applications. Use a thermal management strategy that pairs a heat-spreader or 1-2 m/s forced-air cooling with a thermally-enhanced PCB stackup (1-2 oz copper on top/bottom + internal copper planes) to keep Tj below 100C in industrial environments.
DDR3/DDR2 memory interfaces must use length-matched fly-by routing for address/command/clock signals (within +/-25 ps skew) and differential pair routing with 100 ohm impedance for DQS. Place external memory within 25 mm of the FPGA to meet tDS/tDH timing margins on the Stratix III L I/O banks. Use Octopus/octagonal pinout files generated by Quartus II to identify byte-group lane assignments before PCB layout begins - reorganizing banks after layout is impossible.
Configuration mode selection must be hard-wired (MSEL pins) before POR; selecting passive parallel with a wrong MSEL code can corrupt the configuration flash image. Always include a JTAG header on the PCB for reconfiguration and in-system programming - the EP3SL200F1517I4LN supports JTAG-based configuration reload at any time. If using passive serial from a MAX II/MAX V CPLD, ensure the CRC check feature is enabled to detect bitstream corruption during power-up.
The 976 I/O pins include 24 dedicated high-speed LVDS pairs and embedded DPA (dynamic phase alignment) circuitry; the remaining general-purpose I/O support LVDS, LVCMOS, SSTL, and HSTL at up to 800 Mbps. For high-speed serial interfaces, follow the Stratix III handbook board design guidelines for controlled-impedance traces (50 ohm single-ended, 100 ohm differential) with no more than two vias per Tx/Rx pair and 90 ohm termination within 7 mm of the receiver pin.
규정 준수 정보
RoHS compliant and lead-free per 'N' suffix in the ordering code, conforming to EU Directive 2011/65/EU. The 1517-FCBGA package is lead-free and compatible with 260C peak reflow per JEDEC J-STD-020. Halogen-free status is not documented in available distributor listings - refer to Intel/Altera material declaration for confirmation.