EP3SL340H1152C4LN - Stratix III L FPGA 337.5K LE 1152-BGA | Intel
부품 번호: EP3SL340H1152C4LN ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2680 | $26,800.00 |
| 100 | $2450 | $245,000.00 |
| 500 | $2210 | $1,105,000.00 |
| 1,000 | $1980 | $1,980,000.00 |
EP3SL340H1152C4LN 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic function is defined after manufacturing by a user-supplied configuration bitstream, allowing the same silicon to be repurposed across many designs. Within the broader programmable-logic taxonomy, an FPGA sits above CPLDs (smaller, non-volatile, lower-density) and below ASICs (application-specific, higher NRE but lower unit cost at volume). FPGAs are typically used in prototyping, low-volume designs, and applications demanding hardware reconfiguration such as DSP pipelines, high-speed serial interfaces, and parallel compute fabrics.
Key features of the EP3SL340H1152C4LN include 744 maximum user I/Os, 24 transceivers (per Stratix III family architecture), support for multiple I/O standards (LVDS, LVPECL, HSTL, SSTL), and integrated PCIe hard IP blocks. The 65 nm low-power process combined with programmable power technology enables fine-grained power gating of unused logic, registers, and memory blocks. Hard memory controllers and DSP blocks accelerate common data-path functions such as FFT, FIR filtering, and external memory interfacing.
Typical applications include high-end telecommunications baseband processing, high-performance computing accelerators, software-defined radio (SDR) platforms, ASIC prototyping, video broadcast infrastructure, and test and measurement equipment. The 337.5K LE density makes this part particularly well-suited to designs that exceed the capacity of smaller Stratix III members such as the EP3SL200 family.
When designing with this device, ensure that the PCB layout meets the flip-chip BGA escape and signal-integrity requirements, including matched-length pairs for LVDS and controlled impedance for high-speed serial links. Quartus II design software is required for synthesis, place-and-route, and bitstream generation. Note that this part is in Last Time Buy / Not Recommended for New Designs (NRND) status; consider Stratix IV or Stratix V for new projects.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix III family, and practical FPGA design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EP3SL340H1152C4LN — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL340H1152C4LN (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Core Voltage, Operating Temperature Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL340H1152C4L
✅ 드롭인✓ 재고 있음
$3500 / 개
데이터시트 보기 →EP3SL340H1152C4
✅ 드롭인✓ 재고 있음
$11000 / 개
데이터시트 보기 →EP3SL340H1152C3N
✅ 드롭인✓ 재고 있음
$1895 / 개
데이터시트 보기 →EP3SL340H1152C3
✅ 드롭인✓ 재고 있음
$2550 / 개
데이터시트 보기 →EP3SL340H1152C2N
✅ 드롭인✓ 재고 있음
$3400 / 개
데이터시트 보기 →EP3SL340H1152C2
✅ 드롭인✓ 재고 있음
$15800 / 개
데이터시트 보기 →EP3SL340H1152C4LN 최대 정격 & 전기적 특성
| Family | Stratix III L |
| Logic Elements | 337,500 |
| Embedded Memory Bits | 18,822,144 |
| Maximum User I/O | 744 |
| LABs (Logic Array Blocks) | 1,350 |
| Process Technology | 65 nm |
| Core Voltage | 0.9 V |
| 동작 온도 | 0C to +85C (commercial) |
| Speed Grade | C4 |
| 패키지 | 1152-BBGA, FCBGA (flip-chip) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Lead Free | Yes |
| 할로겐 프리 | Unknown |
| Configuration Memory | SRAM-based, volatile |
EP3SL340H1152C4LN 1152-bbga, fcbga (flip-chip) 핀 구성 가이드
EP3SL340H1152C4LN(1152-bbga, fcbga (flip-chip) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL340H1152C4LN.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL340H1152C4LN 적합 용도: 6 애플리케이션s: Telecommunications Baseband Processing, Software-Defined Radio (SDR) Platforms, ASIC Prototyping, High-Performance Computing Accelerator, Video Broadcast Infrastructure, Test and Measurement Equipment.
Telecommunications Baseband Processing
The EP3SL340H1152C4LN fits 4G/early-5G baseband processing applications because its 337,500 logic elements plus 18.8 Mb of embedded block RAM can implement multi-carrier channelization, FFT/iFFT pipelines, and Turbo/LDPC decoder cores at sufficient throughput. The integrated DSP blocks accelerate complex multiply-accumulate operations common in OFDM signal chains. With 744 user I/Os, the part can interface multiple CPRI/OBSAI fronthaul links plus external memory such as DDR3/QDR-II+. The C4 speed grade is typically adequate for sub-250 MHz baseband clocking; designs requiring higher Fmax should select the C3 or C2 grades via the same H1152 package.
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Software-Defined Radio (SDR) Platforms
The EP3SL340H1152C4LN is well-suited for wideband SDR platforms because its combination of high logic capacity, embedded memory, and DSP blocks enables digital down-conversion (DDC), digital up-conversion (DUC), and channelization filters in a single device. The 1152-BGA package supports up to 744 user I/Os for connecting multiple ADC/DAC channels, while the Stratix III L low-power process minimizes heat in fanless embedded SDR enclosures. The part's LVDS and HSTL support enables direct interface to high-speed ADCs such as the ADS62Pxx family without external buffers, simplifying RF-to-baseband receiver designs.
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ASIC Prototyping
The EP3SL340H1152C4LN is a popular ASIC prototyping vehicle because its 337,500 logic elements and abundant memory map a wide range of mid-complexity ASIC RTL into a single device. Quartus II compiles production ASIC netlists into Stratix III resources with predictable timing closure, and the 1152-BGA's 744 user I/Os are sufficient to bring out typical ASIC pin counts. Multi-FPGA partitioning is straightforward when the design exceeds 337K LE; the EP3SL340F1760C4N variant with 880 user I/Os is the next step up for pin-limited partitioning. NRND status makes it ideal for prototyping legacy ASICs where cost (not longevity) is the priority.
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High-Performance Computing Accelerator
The EP3SL340H1152C4LN can be deployed as a PCIe-attached compute accelerator for HPC workloads where custom datapath parallelism outperforms CPUs. Its 337,500 LE plus DSP blocks enable custom SIMD engines, streaming compression accelerators, or bioinformatics pipelines that benefit from FPGA fabric's deterministic latency. The hard PCIe IP block simplifies host interfacing at Gen1/Gen2 rates, while 744 user I/Os permit multiple external DDR3/QDR memory channels for working-set caching. The C4 speed grade targets ~200-250 MHz internal Fmax, sufficient for memory-bound HPC kernels where external bandwidth dominates over clock rate.
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Video Broadcast Infrastructure
The EP3SL340H1152C4LN fits broadcast video processing such as 3G-SDI/HD-SDI routing, format conversion, and multi-channel video mixing because its logic capacity can host multiple video processing pipelines simultaneously. The 744 user I/Os support many SDI inputs/outputs plus genlock and ancillary data interfaces, while embedded block RAM serves as line/frame buffers for scaling and deinterlacing. The Stratix III L variant's low static power helps meet broadcast rack thermal budgets. LVDS signaling supports direct connection to SDI serializer/deserializer chips like the LMH0340/0341 family without external glue logic.
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Test and Measurement Equipment
The EP3SL340H1152C4LN is suitable for high-end test equipment such as logic analyzers, protocol testers, and arbitrary waveform generators because its combination of high I/O count, embedded memory, and DSP blocks can implement deep capture buffers plus real-time protocol decoding. The 744 user I/Os can probe multi-lane buses like PCIe Gen2, USB 3.0, or SATA, while the block RAM serves as a circular capture buffer. NRND status makes it cost-effective for low-volume test equipment where Stratix III's mature Quartus II toolchain shortens development cycles versus newer families.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL340H1152C4LN — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL340H1152C4L | EP3SL340H1152C4 | EP3SL340H1152C3N | EP3SL340H1152C3 | EP3SL340H1152C2N | EP3SL340H1152C2 |
|---|---|---|---|---|---|---|---|
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 |
| Speed Grade | C4 | C4 | C4 | C3 (faster) | C3 (faster) | C2 (slower) | C2 (slower) |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial | Commercial | Commercial |
| User I/O | 744 | 744 | 744 | 744 | 744 | 744 | 744 |
| Embedded Memory | 18,822,144 bits | 18,822,144 bits | 18,822,144 bits | 18,822,144 bits | 18,822,144 bits | 18,822,144 bits | 18,822,144 bits |
| Process / Family | 65 nm Stratix III L | 65 nm Stratix III L | 65 nm Stratix III L | 65 nm Stratix III L | 65 nm Stratix III L | 65 nm Stratix III L | 65 nm Stratix III L |
주요 차별점
- Highest-density Stratix III L in 1152-BGA package (vs EP3SL200F1152C4N)
- Smaller BGA footprint than F1760 variant (vs EP3SL340F1760C4N)
- Low-power variant of Stratix III family (vs EP3SE260F1152C4N)
설계 노트
The 1152-BGA flip-chip package uses a 1.0 mm ball pitch and demands a PCB with via-in-pad or microvia technology for inner-row escape routing. Estimated: a 12-layer stack-up with 0.5 oz copper is typical; smaller designs can use 8 layers if signal count allows. Use the manufacturer's symbol library to confirm ball A1 orientation; mismatched orientation is a common cause of first-spin failures. Decoupling follows Intel's Stratix III PDN recommendation: one 0.1 uF + one 10 nF per power pin pair, plus bulk 22 uF per voltage rail.
Estimated: at full toggle activity across all 337,500 logic elements, the Stratix III L device can dissipate 10-15 W. The 1152-BGA exposes a thermal pad on the package underside that must be soldered to the PCB with a continuous ground plane and thermal vias (estimated 0.3 mm diameter, 1.2 mm pitch, filled with solder). Without proper thermal management, junction temperature can exceed 100 C and trigger thermal limiting. For production designs, follow the Stratix III handbook thermal design guideline section.
DDR3 memory interfaces require matched-length fly-by routing and proper write leveling; the Stratix III PHY has built-in dynamic phase shifting but PCB must still meet 50 ohm +/- 10% impedance control. LVDS pairs must be length-matched to within 20 ps; use serpentine routing if needed. Reference Intel's Stratix III External Memory Interfaces Handbook for trace length, skew, and termination requirements specific to DDR3/DDR2/QDR-II+/RLDRAM-II controllers.
Do not confuse speed grade suffix: 'C4' is a slower bin than 'C3' which is slower than 'C2'. Quartus II software will warn if a chosen speed grade is unlikely to close timing at the target Fmax. The 'N' suffix typically denotes lead-free/Pb-free assembly; omitting it on re-orders can cause RoHS compliance issues. Configuration bitstream is device-specific; recompiling for a different speed grade produces a new bitstream but the same JTAG programming file structure.
규정 준수 정보
RoHS and lead-free status per Intel/Altera product page; AEC-Q100 not applicable for FPGA industrial/commercial part. Halogen-free status not stated in verified web data.
