EP3SL340H1152I3 - Stratix III L FPGA 337K LE 1152-FCBGA | Intel
부품 번호: EP3SL340H1152I3 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $22057.73 | $22,057.73 |
| 10 | $19851.96 | $198,519.60 |
| 100 | $17646.19 | $1,764,619.00 |
| 500 | $15440.41 | $7,720,205.00 |
| 1,000 | $13234.64 | $13,234,640.00 |
EP3SL340H1152I3 개요
A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, dedicated DSP blocks, embedded memory, and high-speed transceivers on a single die. Within the broader semiconductor taxonomy, an FPGA sits between application-specific integrated circuits (ASICs) and general-purpose microcontrollers: FPGAs offer hardware-level parallelism and reconfigurability that microcontrollers cannot match, without the per-unit NRE cost of an ASIC. The Stratix III L family is a derivative of the Stratix III family, optimized for low static power while preserving the architecture's high-performance DSP and memory subsystems.
Key features of the EP3SL340H1152I3 include 337,500 logic elements, 18,822,144 memory bits, 744 maximum user I/O pins, support for multiple I/O standards (LVDS, LVPECL, HSTL, SSTL), dedicated DSP blocks for high-throughput arithmetic, and up to 500 MHz internal operation. Embedded memory is partitioned into M9K and M144K blocks, allowing efficient buffer, FIFO, and lookup-table implementations without consuming fabric logic.
Architecturally, the device combines a programmable logic fabric with a column-and-row interconnect structure, hardened DSP and memory blocks, and clock management via PLLs. The 65 nm process and Stratix III L power optimizations deliver lower static power than the baseline Stratix III family while preserving DSP throughput and memory bandwidth.
Typical applications include high-performance digital signal processing, military radar and electronic warfare, medical imaging front-ends, ASIC prototyping, and high-speed data acquisition. The 1152-ball FCBGA package provides the high pin count and signal integrity required by wide-bus, parallel interfaces.
When designing with this device, follow Intel/Altera's Stratix III power-up sequencing guidelines; the 1.1 V core, PLL analog supply, and I/O supplies must ramp in the recommended order to avoid latch-up. Use the Quartus II design software for synthesis, place-and-route, and timing closure.
This page synthesizes distributor inventory, drop-in same-family variants, and design notes not found in a single manufacturer PDF, enabling engineers to evaluate the part and its substitutes faster.
드롭인 대체품: EP3SL340H1152I3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL340H1152I3 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Operating Temperature Grade, Configuration Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL340H1152C3N
✅ 드롭인✓ 재고 있음
$1895 / 개
데이터시트 보기 →EP3SL340H1152C4N
✅ 드롭인✓ 재고 있음
$1245 / 개
데이터시트 보기 →EP3SL340H1152C4LN
✅ 드롭인✓ 재고 있음
$1980 / 개
데이터시트 보기 →EP3SL340H1152C3
✅ 드롭인✓ 재고 있음
$2550 / 개
데이터시트 보기 →EP3SL340H1152C4
✅ 드롭인✓ 재고 있음
$11000 / 개
데이터시트 보기 →EP3SL340H1152C4L
✅ 드롭인✓ 재고 있음
$3500 / 개
데이터시트 보기 →EP3SL340H1152C2N
✅ 드롭인✓ 재고 있음
$3400 / 개
데이터시트 보기 →EP3SL340H1152I3 최대 정격 & 전기적 특성
| Family | Stratix III L |
| Logic Elements | 337,500 |
| Total Memory Bits | 18,822,144 |
| Number of Logic Cells | 337,500 |
| Number of I/O | 744 (maximum user I/O) |
| 패키지 | 1152-BBGA, FCBGA |
| Process Technology | 65 nm |
| Operating Frequency (max) | 500 MHz |
| Core Supply Voltage | 1.1 V |
| 동작 온도 | Industrial grade |
| 실장 유형 | Surface Mount (BGA) |
| Tray / Packaging | Tray |
| Speed Grade | I3 (industrial, speed grade 3) |
EP3SL340H1152I3 1152-bbga, fcbga 핀 구성 가이드
EP3SL340H1152I3(1152-bbga, fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL340H1152I3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL340H1152I3 적합 용도: 6 애플리케이션s: High-Performance Digital Signal Processing, Military Radar and Electronic Warfare, Medical Imaging Front-Ends, ASIC Prototyping and Emulation, High-Speed Data Acquisition Systems, Industrial Test and Measurement.
High-Performance Digital Signal Processing
The EP3SL340H1152I3's 337,500 logic elements and dedicated DSP blocks make it a strong fit for high-throughput DSP workloads. Each DSP block delivers multiplies and accumulations at the silicon level, allowing implementations of FIR filters, FFT engines, and radar baseband processors at hundreds of MSPS. The 500 MHz internal clock combined with parallel fabric architecture means engineers can build multi-channel pipelines that outrun single-core DSP microprocessors by orders of magnitude. Compared with smaller FPGAs, the 18,822,144 bits of embedded memory reduce the need for external SRAM, simplifying board layout for radar, software-defined radio, and real-time image processing.
추천
Military Radar and Electronic Warfare
Defense radar and electronic-warfare systems require FPGAs that combine high logic density with deterministic latency. The EP3SL340H1152I3 delivers 337,500 logic elements, embedded memory for sample buffering, and dedicated DSP blocks for pulse-Doppler processing on a single die, all in an industrial temperature grade suitable for ruggedized enclosures. The 744 user I/O support high-speed ADC/DAC interfaces (LVDS, LVPECL) that feed raw IF samples into the FPGA fabric for beamforming and signal classification. Compared with ASIC alternatives, the EP3SL340H1152I3 allows post-deployment algorithm updates, which is critical for evolving threat libraries.
추천
Medical Imaging Front-Ends
The EP3SL340H1152I3's embedded memory bandwidth and 744 I/O support multi-channel ultrasound, CT, and MRI front-end pre-processing. Parallel fabric lets each imaging channel run independent beamformers and filters, while the 18,822,144 bits of memory act as line buffers for image reconstruction. The 1.1 V core keeps board power manageable in dense chassis, and the industrial temperature grade supports the thermal envelope of medical imaging cabinets. Compared with microcontrollers, the FPGA can process full-rate image data without compression or dropping samples, preserving diagnostic fidelity.
추천
ASIC Prototyping and Emulation
ASIC and ASSP prototyping demands very high logic density and large memory to emulate multi-million-gate SoCs. The EP3SL340H1152I3 provides 337,500 logic elements with 18,822,144 memory bits, fitting most SoC prototypes into a single device and avoiding the partition headaches that plague smaller FPGAs. With Quartus II, engineers can map ASIC gate libraries into LUT-and-FF pairs and run real workloads at near-ASIC clock frequencies. Compared with custom ASIC development, prototyping on the EP3SL340H1152I3 compresses verification cycles from months to weeks.
추천
High-Speed Data Acquisition Systems
Data-acquisition systems digitize signals at hundreds of MSPS and need the EP3SL340H1152I3's 744 user I/O to capture parallel LVDS lanes from multi-channel ADCs. The 18,822,144 bits of embedded memory serve as a deep capture buffer, and the parallel DSP fabric can run real-time channelizers, FFTs, or decimation filters on the streaming samples. Compared with discrete buffer-plus-processor designs, the integrated FPGA approach reduces board area and improves determinism, and the 500 MHz fabric clock provides ample headroom for high-order decimation filters.
추천
Industrial Test and Measurement
ATE and bench instrumentation rely on FPGAs to drive mixed-signal patterns at sub-nanosecond edge placement. The EP3SL340H1152I3's 744 I/O and 500 MHz fabric clock support hundreds of synchronized digital channels, while the 337,500 logic elements implement pattern sequencers, timing generators, and protocol engines in a single chip. The industrial temperature grade suits factory-floor ATE racks where airflow and ambient vary. Compared with discrete sequencer ICs, integrating the sequencer in the EP3SL340H1152I3 cuts BOM cost and gives engineers full flexibility to add new test patterns in firmware.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL340H1152I3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL340H1152C3N | EP3SL340H1152C4N | EP3SL340H1152C4LN | EP3SL340H1152C3 | EP3SL340H1152C4 |
|---|---|---|---|---|---|---|
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 |
| Total Memory Bits | 18,822,144 | 18,822,144 | 18,822,144 | 18,822,144 | 18,822,144 | 18,822,144 |
| Maximum User I/O | 744 | 744 | 744 | 744 | 744 | 744 |
| Speed/Temperature Grade | I3 (industrial) | C3 (commercial) | C4 (commercial, faster) | C4L (commercial, low power) | C3 (commercial) | C4 (commercial, faster) |
| Core Supply Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Highest logic density in the Stratix III L family (vs EP3SL200H780I3)
- 1152-ball FCBGA package maximizes user I/O count (vs EP3SL200F780C4)
- Industrial temperature grade with Stratix III L low-power silicon (vs Baseline Stratix III (non-L) variants)
설계 노트
The Stratix III L family requires multi-rail power sequencing: the 1.1 V core supply, PLL analog supply (VCC_PLL), and I/O supplies (VCCIO) must ramp in the order specified in the Stratix III device handbook. Violating the sequence can cause latch-up or long-term reliability degradation. Use a dedicated FPGA power regulator (e.g., Intel-recommended controllers) and verify power-good sequencing at board bring-up before configuration. Estimate: with a typical 25% toggle rate and 50% logic utilization at 500 MHz, the device can draw several watts per voltage domain; budget PCB cooling accordingly.
The 1152-ball FCBGA has a fine 1.0 mm pitch and requires controlled-impedance stack-up and microvia technology for breakout. Use Intel/Altera's BGA escape pattern recommendations; place at least 4-8 PCB layers between the device and the power planes. Maintain short return paths for high-speed LVDS pairs to minimize crosstalk, and route differential pairs with 100 ohm differential impedance. Follow the Stratix III pin connection guidelines for unused I/O banks - do not leave them floating, tie unused pins to known states per the handbook.
Do not assume the EP3SL340H1152I3 and EP3SL340H1152C3N are equivalent - the temperature grade differs and using a commercial part in an industrial chassis can cause timing or leakage failures outside the qualified range. Likewise, do not confuse the I3 speed grade with C3, C4, or C2 grades - Quartus II timing analysis uses grade-specific delay models and may not flag a mismatch. When migrating to a Stratix III E variant (e.g., EP3SE260) confirm the device ID and configuration scheme match; not all Stratix III sub-families share the same configuration bitstream format.
규정 준수 정보
Lead-free and RoHS status not confirmed in the provided web data; check the Intel/Altera datasheet or manufacturer PCN for the EP3SL340H1152I3 specific qualification. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. N-suffixed variants in the same family (e.g., EP3SL340H1152C3N) are typically lead-free.