EP3SL70F484I3N - 67.5K LE Stratix III L FPGA, 484-FBGA | Intel
부품 번호: EP3SL70F484I3N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1367.12 | $1,367.12 |
| 10 | $1310.5 | $13,105.00 |
| 100 | $1185 | $118,500.00 |
| 250 | $1098.75 | $274,687.50 |
| 500 | $995.4 | $497,700.00 |
EP3SL70F484I3N 개요
An FPGA (Field-Programmable Gate Array) is a type of programmable logic IC that allows designers to configure digital logic blocks and interconnects after manufacture. The Stratix III L family sits in the high-performance, low-power segment of Intel's (formerly Altera's) programmable logic hierarchy: FPGA -> programmable logic -> ASIC alternative -> digital IC. The 'L' sub-family specifically trades absolute peak performance for substantially lower static and dynamic power versus the Stratix III base series, enabling higher logic density at constrained thermal envelopes.
Key features include up to 296 user I/Os, support for external memory interfaces including DDR3 with dedicated hard IP, up to 24 DSP blocks for high-throughput signal processing, and embedded transceivers in higher density variants. The 484-FBGA package (23 mm x 23 mm body) exposes the full I/O bank count while keeping board area manageable for high-performance designs. Cyclone and Stratix families remain widely supported by the Quartus II design software.
Architecturally, the EP3SL70F484I3N leverages an adaptive logic module (ALM) of 8-input fracturable look-up tables combined with dedicated MLAB memory blocks. The Programmable Power Technology allows unused logic and routing to be powered down automatically, which is the principal mechanism behind the 'L' family's power advantage. Hard memory controllers and DSP blocks improve both performance and energy efficiency compared with soft implementations.
Typical applications include high-speed digital signal processing, telecom baseband and protocol bridging, software-defined radio front-ends, industrial vision and machine control, and high-throughput data acquisition. For engineers transitioning from ASIC designs, the Stratix III L family offers a familiar Quartus tool flow while retaining the NRE cost benefit of FPGA. Choose this part when you need Stratix III L-class resources in the 484-ball BGA package.
When designing with this device, confirm the Quartus II device support status because Stratix III is now in its mature-support lifecycle and newer Intel Cyclone 10 or Stratix 10 families offer lower power at comparable logic densities. Pay attention to the I/O bank supply sequencing required by the device and reference the Intel pinout file for the 484-FBGA package before PCB layout.
This page synthesizes distributor pricing, drop-in alternatives from the same Stratix III L family, and practical design notes that are not collected together in the manufacturer datasheet, giving procurement and engineering teams a single decision-ready reference.
드롭인 대체품: EP3SL70F484I3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL70F484I3N (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Family, Operating Temperature, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL70F484I3G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$305 / 개
데이터시트 보기 →EP3SL70F484I3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1013.66 / 개
데이터시트 보기 →EP3SL70F484C3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$810 / 개
데이터시트 보기 →EP3SL70F484C3G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$985 / 개
데이터시트 보기 →EP3SL70F484C2N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$149.5 / 개
데이터시트 보기 →EP3SL70F484C2
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$980 / 개
데이터시트 보기 →EP3SL70F484I3N 최대 정격 & 전기적 특성
| Series | Stratix III L |
| Logic Elements / Cells | 67,500 |
| Number of LABs / CLBs | 2,700 |
| Total RAM Bits | 2,699,264 |
| Number of I/O | 296 |
| 패키지 / 케이스 | 484-BBGA, FCBGA |
| Supplier Device Package | 484-FBGA (23x23 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +100C (TJ) |
| Process Technology | 40 nm CMOS |
| Product Status | Obsolete (per Assypcb listing) |
| Speed Grade | 3 |
| Temperature Grade | Industrial (I) |
EP3SL70F484I3N 484-fbga (23x23 mm) 핀 구성 가이드
EP3SL70F484I3N(484-fbga (23x23 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL70F484I3N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL70F484I3N 적합 용도: 6 애플리케이션s: Telecom Line-Card Protocol Bridging, Software-Defined Radio Front-End, Industrial Machine Vision and Inspection, High-Channel-Count Data Acquisition, Medical Imaging Back-End Processing, Aerospace Avionics Data Concentrators.
Telecom Line-Card Protocol Bridging
The EP3SL70F484I3N's 67,500 logic elements and 296 user I/Os make it well-suited for telecom line cards that must bridge between backplane SERDES, framer ICs, and payload processors. Its 40 nm Programmable Power Technology keeps quiescent draw low enough for dense multi-FPGA ATCA or AdvancedMC shelves where per-slot thermal budgets are tight, while the 484-FBGA exposes enough I/O to support multiple SFI / XAUI lanes plus a DDR3 buffer memory channel. Compared with newer Stratix 10 parts the EP3SL70F484I3N is slower per MHz but offers proven Quartus II tooling and abundant legacy IP for telecom protocols. Engineering teams typically place this part between the framer and the network processor, allowing software-driven reprogrammability across CPRI, OBSAI, and Ethernet variants on a single board.
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Software-Defined Radio Front-End
Software-defined radio front-ends benefit from the EP3SL70F484I3N because its DSP blocks and embedded RAM can implement wideband digital down-conversion, channelization, and FFT engines for multi-standard baseband processing. The 2,699,264 bits of block RAM are large enough to hold complex coefficient tables and overlapping window buffers for LTE and 5G NR signal captures, while the industrial -40C to +100C temperature grade permits deployment in outdoor radio units and vehicle-mounted SDR platforms. The 484-FBGA package supports multiple LVDS pairs needed for ADC and DAC interfaces, and the Stratix III L family's reduced static power simplifies thermal management in sealed enclosures. Designs typically pair this FPGA with a high-speed ADC such as the AD9680 and a DAC such as the AD9144 to assemble a complete transmit-receive channel.
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Industrial Machine Vision and Inspection
Industrial machine vision systems use the EP3SL70F484I3N for real-time image preprocessing, defect detection, and conveyor synchronization because the FPGA can ingest Camera Link or CoaXPress streams, run edge-detection and pattern-matching kernels, and drive actuator control in a deterministic loop. The 296 user I/Os are sufficient to support multiple multi-megapixel sensors, encoder inputs, and opto-isolated GPIO for factory-floor integration. Industrial temperature grade (-40C to +100C) permits deployment in unconditioned shop-floor cabinets where ambient swings are common. Compared with GPU-based vision systems the EP3SL70F484I3N offers lower latency and deterministic jitter critical for high-speed sortation lines, while consuming less power than a mid-range embedded GPU module.
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High-Channel-Count Data Acquisition
High-channel-count data acquisition cards for ultrasound, structural monitoring, and scientific instrumentation rely on the EP3SL70F484I3N to aggregate, decimate, and packetize many parallel ADC streams. Its 2,699,264 embedded RAM bits and DSP blocks support FIR decimation filters, while the 484-FBGA footprint exposes the I/O count required to multiplex 32 to 64 LVDS ADC lanes. The industrial temperature range supports deployment in field-deployed monitoring stations and mobile labs. Stratix III L power efficiency enables dense channel counts within a single FPGA, replacing what used to require multiple FPGAs plus external logic. Designers typically combine this part with multi-channel ADCs such as the AD7606 or ADS52J90 family to build complete acquisition front-ends.
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Medical Imaging Back-End Processing
Medical imaging back-ends such as ultrasound beamformers, CT reconstruction pre-processors, and MRI receiver digitizers use the EP3SL70F484I3N to perform the deterministic, low-latency DSP that medical regulations require. The FPGA's block RAM and DSP resources enable parallel beamforming across hundreds of transducer channels, while the 484-FBGA package supports the multi-LVDS interface to high-channel-count ADCs. The industrial temperature grade allows deployment in equipment rooms and bedside carts where ambient conditions vary. The mature Stratix III L design flow and Quartus II toolchain are well documented for IEC 62304 and ISO 13485 design control processes. Compared with newer families the EP3SL70F484I3N offers a known-good silicon base for ongoing medical device certifications.
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Aerospace Avionics Data Concentrators
Aerospace avionics data concentrators that aggregate ARINC 429, MIL-STD-1553, and Ethernet traffic onto a single backplane use the EP3SL70F484I3N for its combination of deterministic timing, abundant I/O, and industrial temperature grade suitable for DO-160G environmental qualification. The 67,500 logic elements are sufficient to host multiple protocol engines plus an Ethernet switch fabric, while the 484-FBGA package simplifies board layout in compact avionics LRUs. Power efficiency from the Stratix III L family matters in unpressurized aircraft bays with limited cooling, and the 40 nm process offers known reliability data for long-life aerospace programs. Designers must still apply up-screening and component derating per DO-254 design assurance guidance before flight certification.
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추천 제품 요약
엔지니어링 참조 데이터: EP3SL70F484I3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL70F484I3G | EP3SL70F484I3 | EP3SL70F484C3 | EP3SL70F484C3G | EP3SL70F484C2N | EP3SL70F484C2 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (23x23 mm) | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same |
| Logic Elements | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 |
| Total RAM Bits | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 |
| User I/O Count | 296 | 296 | 296 | 296 | 296 | 296 | 296 |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
| Speed Grade | 3 | 3 | 3 | 3 | 3 | 2 (faster) | 2 (faster) |
| Lead Finish | SnPb (N) or Pb-free (G) per option | Pb-free (G) | Standard | Standard | Pb-free (G) | Standard (N) | Standard |
| Parametric Match | Reference | 100% | 100% | 90% | 90% | 90% | 90% |
주요 차별점
- Pb-free lead finish variant available in same package (vs EP3SL70F484I3G)
- Industrial temperature grade preserves 296 I/O count (vs EP3SL70F484C3)
- Faster speed grade available in same package (vs EP3SL70F484C2N)
설계 노트
The 484-FBGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 15 C/W with 4-layer JEDEC PCB and adequate via array under the exposed pad. For sustained junction temperatures above 100C (industrial limit), designers must add thermal vias and copper pours under the package and should size a heatsink if total power dissipation exceeds 3 W. Estimated: at 25 C ambient with 4 W total power, junction temperature will be approximately 25 C + 4 W x 15 C/W = 85 C, leaving only 15 C margin to the 100 C industrial limit.
Route all differential pairs (LVDS, DDR memory) with 100 ohm differential impedance and length-matched within 25 mils to avoid skew. The 484-FBGA ball pitch of 1.0 mm requires microvia or via-in-pad stackups for signal escape, and a minimum 4-layer PCB with continuous reference planes for power and ground. All transceiver reference clock pins must be routed with controlled impedance and isolated from noisy digital traces by ground guard traces.
Stratix III L devices require sequenced power rails: VCC (core), VCCAUX, VCCA_PLL, VCCIO banks, and VCCPD must be ramped in the order specified in the Stratix III handbook. Use a multi-rail controller such as the LTC3567 or EP3SL-specific power sequencer. Decoupling: place 0402 or 0201 ceramic capacitors every 5 mm around the BGA periphery with multiple bulk capacitors under the package to handle load transients.
Common pitfalls include selecting an unsupported Quartus II version, exceeding the MSL floor-life after BGA package exposure, and ignoring JTAG chain integrity when using a configuration device. Verify MSL rating before PCB assembly because BGA packages absorb moisture and require bake-out if exposure time exceeds the floor life. Always connect nCONFIG, nSTATUS, and CONF_DONE through 4.7 kohm pull-ups to VCCPD as specified in the handbook.
For DDR3 interfaces, use the Stratix III hard memory controller and follow the read/write leveling flow in the External Memory Interface Handbook. SSTL-18 or SSTL-15 signaling requires on-die termination (ODT) and precise PCB trace matching to 50 ohms within 12.5 mils. Signal integrity simulations with IBIS models are mandatory for memory interfaces running above 533 MHz; failure to simulate causes intermittent write errors in production.
규정 준수 정보
RoHS and lead-free status not explicitly stated in the Verified Web Data; Intel Stratix III devices are typically Pb-free by default for the G suffix variants but N-suffix parts may include SnPb lead finish. AEC-Q100 is not applicable because this is an FPGA, not an automotive-grade IC.