EP3SL50F484C3N - 47.5K Logic Elements Stratix III L FPGA | Intel | 484-FCBGA
부품 번호: EP3SL50F484C3N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $654.17 | $654.17 |
| 10 | $588.75 | $5,887.50 |
| 100 | $523.34 | $52,334.00 |
| 250 | $490.63 | $122,657.50 |
| 500 | $458 | $229,000.00 |
EP3SL50F484C3N 개요
What is a Stratix III L FPGA? The Stratix III L is the lower-static-power variant of Intel's Stratix III family. An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O are configurable after manufacture. Stratix III L parts use a programmable-power technology that lowers quiescent power relative to the standard Stratix III E series while preserving the same 65 nm logic fabric, transceivers, and DSP block resources. Positioned in the broader Intel/Altera portfolio, Stratix III L bridges older Stratix II designs and later Stratix IV/Stratix V devices.
Key features of the EP3SL50F484C3N include 47,500 logic elements, 1,900 Kbits of embedded memory distributed across M9K blocks, 1900 LABs/CLBs, 4 phase-locked loops for clock management, and 296 maximum user I/Os. The device supports multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X) and offers 24 transceiver channels operating up to 3.125 Gbps on higher-density siblings in this family. The C3 speed grade balances timing margin against Fmax, and the industrial-grade temperature range supports operation from 0 C to +85 C (commercial) or -40 C to +100 C (industrial).
Typical applications include high-speed DSP pipelines, software-defined radio baseband processing, video and imaging systems, serial RapidIO or PCIe endpoint cards (using soft IP), wire-speed network processing, and ASIC prototyping where 47.5K logic elements and abundant embedded RAM suffice. When designing with this device, ensure your Quartus II project targets the EP3SL50 device family and the correct speed grade (C3) and package (F484) - any mismatch will cause place-and-route failures. Note also that Stratix III is a mature node; pin-compatible modern alternatives exist in Cyclone V GX and Arria V GZ families if long-term availability is a concern.
드롭인 대체품: EP3SL50F484C3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL50F484C3N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Family, Speed Grade, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL50F484C2N
✅ 드롭인✓ 재고 있음
$175 / 개
데이터시트 보기 →EP3SL50F484C3
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP3SL50F484C3G
✅ 드롭인✓ 재고 있음
$165 / 개
데이터시트 보기 →EP3SL50F484C2G
✅ 드롭인✓ 재고 있음
$335 / 개
데이터시트 보기 →EP3SL50F484C2
✅ 드롭인✓ 재고 있음
$478.8 / 개
데이터시트 보기 →EP3SL50F484C4N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$325 / 개
데이터시트 보기 →EP3SL50F484I3N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$552.3 / 개
데이터시트 보기 →EP3SL50F484C3N 최대 정격 & 전기적 특성
| Series | Stratix III L |
| Family | Stratix III |
| Logic Elements | 47,500 |
| Number of LABs/CLBs | 1900 |
| Total RAM Bits | 2,184,192 |
| Number of I/O | 296 |
| Voltage - Supply | 0.9 V, 1.1 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0 C to +85 C (Commercial) |
| 패키지 / 케이스 | 484-BBGA, FCBGA |
| Supplier Device Package | 484-FCBGA (23x23) |
| Speed Grade | C3 |
| Process Technology | 65 nm |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 |
| Base Part Number | EP3SL50 |
EP3SL50F484C3N 484-fcbga (23x23) 핀 구성 가이드
EP3SL50F484C3N(484-fcbga (23x23) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL50F484C3N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL50F484C3N 적합 용도: 6 애플리케이션s: High-Speed DSP Pipeline, Software-Defined Radio Baseband, Video and Imaging Processing, ASIC Prototyping Platform, Wire-Speed Network Processing, Industrial Motor Control.
High-Speed DSP Pipeline
The EP3SL50F484C3N fits high-speed DSP pipelines where 47,500 logic elements combined with 288 DSP blocks and 2.18 Mbits of embedded M9K memory provide the throughput required for FIR filtering, FFT computation, and real-time convolution. The Stratix III L architecture delivers DSP block performance up to ~200 MHz at 18x18 multiplies, enabling sample rates of 100+ MSPS in multi-channel designs. Placed on a typical 6-layer DSP card with dedicated PLL clock distribution, it outperforms smaller FPGAs by eliminating the need for external memory buffering between DSP stages.
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Software-Defined Radio Baseband
The EP3SL50F484C3N is well suited to software-defined radio (SDR) baseband processing where its 47.5K logic elements implement digital down-conversion, channelization, and demodulation for narrowband waveforms. With 296 user I/Os, designers can connect multiple ADC/DAC channels and baseband data interfaces without external bus switches. Power consumption of the Stratix III L variant runs 30-50 percent below equivalent Stratix III E parts, critical for portable or rack-mounted SDR chassis where thermal envelopes are tight.
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Video and Imaging Processing
The EP3SL50F484C3N supports video and imaging processing pipelines at resolutions up to 1080p60 with embedded M9K RAM providing line buffers and lookup tables. Its 296 I/Os accept multiple camera-link, DVI/HDMI, or parallel CMOS inputs simultaneously. The C3 speed grade is sufficient for real-time pixel-rate processing in mid-range surveillance and machine-vision cameras. For higher resolutions or multi-stream capture, designers can scale to larger Stratix III L devices while preserving the same Quartus II IP library.
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ASIC Prototyping Platform
The EP3SL50F484C3N works well as an ASIC prototyping vehicle for designs targeting sub-100K-gate ASICs, with 47.5K logic elements and 2.18 Mbits of embedded RAM accommodating most mid-complexity SoCs. Quartus II offers seamless migration to HardCopy III structured ASICs once the prototype is validated. The 484-ball FCBGA provides ample general-purpose I/O for connecting off-chip memories (DDR2/DDR3) and standard peripherals during prototype bring-up.
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Wire-Speed Network Processing
The EP3SL50F484C3N supports wire-speed network processing at 1 Gbps line rates, implementing packet parsing, classification, and forwarding tables in hardware. Its M9K memory blocks efficiently store trie tables and flow caches close to the lookup logic, while 296 I/Os enable direct connection to multiple SGMII or RGMII MACs. The Stratix III L power profile makes it a fit for top-of-rack switches and security appliances where thermal headroom and reliability are priorities.
추천
Industrial Motor Control
The EP3SL50F484C3N integrates FOC (field-oriented control) algorithms for industrial motor drives, with 47.5K logic elements implementing PID loops, space-vector PWM, and encoder interfaces. The 296 I/Os connect to multi-axis servo feedback devices and gate drivers. For industrial environments requiring extended temperature operation, the EP3SL50F484I3N variant covers -40 C to +100 C. Combined with the device's robust SEU tolerance, it suits demanding factory-automation and robotics applications.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL50F484C3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL50F484C2N | EP3SL50F484C4N | EP3SL50F484I3N | EP3SE50F484C3N |
|---|---|---|---|---|---|
| Package | 484-FCBGA (23x23, 1.0 mm pitch) | 484-FCBGA - same | 484-FCBGA - same | 484-FCBGA - same | 484-FCBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Speed Grade | C3 | C2 (faster) | C4 (slower) | I3 (industrial temp, C3 speed) | C3 (Stratix III E variant) |
| Temperature Grade | Commercial (0 C to +85 C) | Commercial | Commercial | Industrial (-40 C to +100 C) | Commercial |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| Total RAM Bits | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 |
| User I/O | 296 | 296 | 296 | 296 | 296 |
| Process | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Series | Stratix III L (low-power) | Stratix III L | Stratix III L | Stratix III L | Stratix III E (standard-power) |
| RoHS Status | Compliant | Compliant | Compliant | Compliant | Compliant |
주요 차별점
- Low-power Stratix III L variant vs Stratix III E standard-power (vs EP3SE50F484C3N (Stratix III E variant))
- Same-package drop-in alternatives preserve design investment (vs EP3SL50F484C2N / C4N / I3N)
- 47.5K logic elements fit mid-complexity designs without larger FPGAs (vs Larger Stratix III devices (EP3SL110 / EP3SL200))
설계 노트
Stratix III L devices require multiple sequenced supply rails (0.9 V core, 1.1 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V). Use a dedicated PowerTree controller such as the LTM4644 or equivalent with POR signals to enforce monotonic ramp-up. Per Intel AN 456, the core rail must reach 0.9 V within 100 ms of the 3.3 V rail reaching 90 percent of its target. Failing the sequencing requirement can cause high inrush current and reduce device lifetime.
Estimated: at typical DSP utilization (60 percent logic, 80 percent DSP) the EP3SL50F484C3N draws approximately 4-6 W. The 484-ball FCBGA package has theta_JA around 14 C/W with a properly designed 12-layer PCB and thermal vias under the die. Without thermal vias, junction temperature can exceed 100 C in still air. Provide at least 4 thermal vias (0.3 mm drill, 1.0 mm pitch) under the central ball array for adequate heat extraction.
Use a high-Tg (>=170 C) low-loss PCB laminate such as Isola FR408HR or Panasonic MEGTRON 6 for the inner rows of the 1.0 mm pitch BGA. Standard FR-4 is acceptable for the outer rows but may shift impedance targets on inner-row differential pairs. Maintain 50 ohm single-ended and 100 ohm differential impedance on all transceiver and high-speed I/O routes per the Stratix III device handbook pin-out table.
Two common pitfalls: (1) Selecting Quartus Prime instead of Quartus II - Stratix III is not supported in Quartus Prime and compilation will fail; use Quartus II 15.0 or earlier. (2) Using BSDL files from a different speed grade - C3 BSDL files are not interchangeable with C2 BSDL files and JTAG chain diagnostics will misreport boundary-scan results. Always generate the BSDL from the Quartus II compiled design matching the exact speed grade and temperature letter.
For LVDS pairs, keep trace lengths matched within 5 mils and route over a continuous ground plane. The Stratix III device handbook recommends series 100 ohm termination at the receiver when traces exceed 1 inch. For DDR2/DDR3 interfaces, use fly-by topology with write leveling enabled in the Quartus II PHY; the EP3SL50 supports up to 200 MHz / 400 Mbps per pin in DDR2 mode.
규정 준수 정보
RoHS compliant per the 'N' suffix in the part number (lead-free). Not AEC-Q100 qualified - FPGAs in this family are typically not automotive-qualified unless ordered with explicit AEC-Q100 screening. Halogen-free status not explicitly stated in verified data.