EP4CE15F17C6N - Cyclone IV E FPGA, 15408 LE, 256-FBGA | Intel
부품 번호: EP4CE15F17C6N ✓ 활성EP4CE15F17C6N 개요
An FPGA (field-programmable gate array) is a semiconductor device whose digital logic, interconnect and I/O are configured after manufacture, so a single silicon part can implement many different circuit functions. Within the power management IC and digital ASIC hierarchy, an FPGA sits above fixed-function logic and below an ASIC: it offers field-updatable parallelism, deterministic timing and reconfigurability in exchange for higher unit cost than a mask-programmed ASIC. The Cyclone IV E family targets cost-sensitive, low-power embedded designs.
Key device attributes include 15,408 logic elements organized as 963 logic blocks, 165 dedicated user I/O pins, 516,096 bits of listed embedded memory and a stated maximum operating frequency of 472.5 MHz. The 256-ball FBGA keeps the die compact while still exposing enough I/O for external DDR memory, parallel data buses and industrial peripheral interfaces.
The 15,408-logic-element density matters because it defines how much combinational and sequential logic can be mapped before the device runs out of routing resources. The 963 configurable logic blocks each carry a 4-bit lookup table, so total logic capacity scales with block count rather than raw I/O count. The listed 472.5 MHz figure is the headline performance class for the F17 speed grade, which determines how fast external memory interfaces and logic pipelines can be clocked.
Typical uses include industrial control and factory automation gateways, video and image processing front ends, communications and protocol-conversion equipment, instrumentation front panels, and low-cost embedded systems requiring high logic density with a small package footprint. Because the device is reconfigurable, one PCB can cover several product variants by swapping the bitstream.
When designing around this part, budget the 1 mm ball-pitch BGA layout early: it demands careful escape routing, via-in-pad or via-under-ball strategies, and X-ray or cross-section inspection after reflow. Plan the core, I/O and auxiliary supply rails as separate filtered domains, and confirm the exact speed and temperature grade ordering suffix against your production requirements before releasing a design.
This page consolidates distributor availability, package-level detail, drop-in replacement options and practical layout guidance for the Cyclone IV E family, so you can qualify the EP4CE15F17C6N for an existing 256-FBGA board without re-running the full device selection from scratch.
드롭인 대체품: EP4CE15F17C6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CE15F17C6N (동일 폼 팩터 및 풋프린트) — 차이점: Embedded Memory, Mounting Type, Core Voltage (VCCINT), Package, Process Technology.
EP4CE15F17C7N
✅ 드롭인가격 문의
데이터시트 보기 →EP4CE15F17C8N
✅ 드롭인가격 문의
데이터시트 보기 →EP4CE15F17I7N
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →EP4CE10F17C8N
✅ 드롭인가격 문의
데이터시트 보기 →EP4CE10F17C6N
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →EP4CE22F17I7N
✅ 드롭인가격 문의
데이터시트 보기 →EP4CE22F17C6N
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →EP4CE15F17C6N 최대 정격 & 전기적 특성
| Device Type | FPGA (Field Programmable Gate Array) |
| Device Family | Cyclone IV E |
| Logic Elements | 15,408 |
| Configurable Logic Blocks (CLBs) | 963 |
| User I/O Pins | 165 |
| Embedded Memory | 516,096 bits |
| Maximum Frequency | 472.5 MHz |
| Core Supply Voltage | 1.2 V |
| Package Type | 256-LBGA (FBGA-256) |
| Package Size | 17 x 17 mm |
| Ball Pitch | 1.0 mm |
| Number of Balls | 256 |
| 실장 유형 | Surface Mount |
| Lead-Free Status | Lead Free |
EP4CE15F17C6N 17 x 17 mm 핀 구성 가이드
EP4CE15F17C6N(17 x 17 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4CE15F17C6N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4CE15F17C6N 적합 용도: 6 애플리케이션s: Industrial Control and Automation Gateways, Machine Vision and Image Processing Front Ends, Communications and Protocol Conversion Equipment, Test, Measurement and Instrumentation Front Panels, Video Encoding and Display Processing, Consumer and Embedded IoT Devices.
Industrial Control and Automation Gateways
The EP4CE15F17C6N suits mid-complexity PLC and factory gateway designs that must aggregate multiple fieldbus segments, condition signals and drive local actuators in real time. With 15,408 logic elements and 963 configurable logic blocks you can host protocol stacks, state machines and motion sequencing logic on one device, while 165 user I/O leave room for encoder capture, discrete inputs and isolated fieldbus transceivers. The 1.2 V core supply and 256-FBGA package keep the board compact, and the device's reconfigurability lets one hardware platform cover several machine variants by loading a different bitstream. The 472.5 MHz class performance supports deterministic timing for closed-loop control without an external processor.
추천
Machine Vision and Image Processing Front Ends
EP4CE15F17C6N is a practical choice for camera and sensor front ends that need parallel pixel pipelines, colour matrixing and interface bridging before data reaches a processor. The 165 user I/O pins can absorb multi-lane sensor data and handshake signals, while the 15,408 logic elements allow a full lookup-table-based pipeline with frame buffers held in the listed 516,096 bits of embedded memory. Because the 256-LBGA keeps routing short, timing closure on high-speed parallel interfaces is far easier than on a large leaded package. Reconfigurability also lets the same board serve different sensor formats by swapping the bitstream, and the 472.5 MHz operating class comfortably times typical pixel clock rates.
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Communications and Protocol Conversion Equipment
The EP4CE15F17C6N fits protocol bridge and line-card designs that must terminate one serial or parallel interface and re-emit another at line rate. Logic blocks map directly to the byte-lane registers, FIFOs and CRC engines such protocols need, and the 963-block architecture removes the pressure of using discrete logic for width conversion. With 165 I/O, a single 256-FBGA device can host multi-lane low-voltage signalling alongside the control path, and the 1.2 V core with separate I/O supply domains allows level compatibility with modern transceivers. The 472.5 MHz class speed gives comfortable timing closure for 10G-class parallel datapaths before gearbox serialisation.
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Test, Measurement and Instrumentation Front Panels
EP4CE15F17C6N is well matched to instrumentation front ends that arbitrate many asynchronous measurement channels, control relays and format results for a display. Its 15,408 logic elements allow parallel sampling control, trigger conditioning and calibration tables to live in one programmable fabric, while the generous 165 I/O simplifies board-level fan-out to ADC and DAC front ends. Instrumentation favours reconfigurability because a single platform can support different measurement personalities through bitstream updates, and the compact 256-FBGA footprint fits narrow 3U or 4U slot mechanics. The 1.2 V core supply also simplifies rail planning beside modern mixed-signal converters.
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Video Encoding and Display Processing
The EP4CE15F17C6N can serve as the timing, scaler and colour-processing engine in cost-sensitive video infrastructure such as scalers, frame grabbers and display controllers. Pixel-rate datapaths map efficiently into the 963 configurable logic blocks, the 516,096 bits of listed embedded memory accommodate line buffers for de-interlacing and scaling, and the 165 user I/O provide the parallel pixel bus plus control signals to a display or downstream processor. Because the package is only 17 x 17 mm, it fits behind small LCD panels and compact playback appliances. The 472.5 MHz class timing supports standard-definition and moderate high-definition pixel rates with margin.
추천
Consumer and Embedded IoT Devices
EP4CE15F17C6N addresses cost-sensitive consumer and IoT products that need programmable logic for sensor fusion, display driving, touch handling or proprietary protocol support while keeping the board small. The 15,408 logic elements let one low-cost fabric replace several discrete glue devices, and the 256-FBGA package at 17 x 17 mm fits compact wearable-adjacent and smart-home enclosures. The lead-free assembly suits high-volume SMT lines, and the 1.2 V core supply works with simple buck-boost rails, reducing the power tree overhead. Reconfigurability supports product variants, security patches and protocol updates without changing hardware.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CE15F17C6N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CE15F17C7N | EP4CE15F17C8N | EP4CE10F17C8N | EP4CE22F17I7N |
|---|---|---|---|---|---|
| Package | 256-LBGA (FBGA-256), 17 x 17 mm, 1.0 mm pitch | 256-LBGA (FBGA-256), 17 x 17 mm, 1.0 mm pitch - same | 256-LBGA (FBGA-256), 17 x 17 mm, 1.0 mm pitch - same | 256-LBGA (FBGA-256), 17 x 17 mm, 1.0 mm pitch - same | 256-LBGA (FBGA-256), 17 x 17 mm, 1.0 mm pitch - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Device Family | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E |
| Logic Elements | 15,408 | 15,408 | 15,408 | 10,320 (-33%) | 22,320 (+45%) |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Temperature / Grade Code | C6N ordering code | C7N ordering code | C8N ordering code | C8N ordering code | I7N industrial ordering code |
주요 차별점
- Same-die, same-ballout family options make requalification cheap (vs EP4CE15F17C7N)
- Right-sized 15K logic density instead of over- or under-specifying (vs EP4CE22F17I7N)
- Upgrade path down to a lower-cost device on the same PCB (vs EP4CE10F17C8N)
설계 노트
The 256-LBGA uses a 1.0 mm ball pitch, so escape routing from the inner ball field must start on the top layer. Plan a via-in-pad or via-under-ball arrangement (with filled and capped microvias) so that every BGA ball has a short, low-inductance path to the escape layer. Keep the ball-to-via fanout uniform to avoid length mismatches on parallel buses, and reserve solder mask openings only where the process plan allows.
Separate the 1.2 V core rail from the I/O and auxiliary rails and give each its own decoupling network: place 0.1 uF ceramic bypass parts directly on the supply and ground balls, with bulk bulk capacitance near the regulator. Estimated: with a 1.2 V core at 100 mA, the core dissipation is about 0.12 W, so core rail droop from layout inductance rather than average power is the real risk. Use a low-noise, high-PSRR source for analog-adjacent rails feeding the same board.
Most of the thermal load in a Cyclone IV E design comes from core activity in the logic array, and the 256-FBGA has no exposed heat sink pad. Estimated: at 1.2 V and roughly 30% utilisation of 15,408 logic elements, device dissipation is on the order of 0.2-0.5 W, which a 17 x 17 mm BGA can conduct to the board without a heatsink. Provide a solid ground plane under the device and avoid placing hot components directly beneath the BGA footprint.
Do not treat the ordering suffix as cosmetic. The C6N, C7N, C8N and I7N codes in the Cyclone IV E family encode grade and speed combinations, and substituting a part with a different code can change temperature qualification or timing closure even though the ballout is identical. Verify the exact ordering part number against the device datasheet ordering information table, and confirm that the configuration flash and bitstream are compatible with the substituted grade before release.
규정 준수 정보
The device is listed as LEAD FREE in distributor product attributes. RoHS and REACH status appear as compared fields in distributor comparison listings without explicit values in this data set, so they are recorded as unknown. AEC-Q100 is not applicable to this industrial/commercial FPGA family.
