EP4CE6E22C9L - Cyclone IV E FPGA, 6.3K LE, 144-LQFP | Intel
부품 번호: EP4CE6E22C9L ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $14.09 | $14.09 |
| 10 | $12.85 | $128.50 |
| 100 | $11.4 | $1,140.00 |
| 500 | $9.95 | $4,975.00 |
| 1,000 | $8.75 | $8,750.00 |
EP4CE6E22C9L 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, configurable interconnect, and I/O pads that can be reconfigured by the designer after manufacturing. FPGAs sit above fixed-function ASICs and microcontrollers in the programmable logic hierarchy, offering parallel processing, deterministic timing, and hardware-level flexibility for glue logic, digital signal processing, and custom interface bridging.
Key features of the EP4CE6E22C9L include 15 embedded 18x18 multipliers (up to 266 MHz), up to 270 Kbits of distributed RAM, configuration via standard serial/parallel modes, and a 1.2 V core supply with multi-voltage I/O banks supporting 1.2 V to 3.3 V interfacing. The device family integrates PLL-based clock management and supports LVDS, SSTL, and LVTTL I/O standards.
The Cyclone IV E architecture uses a 60 nm process and emphasizes low static and dynamic power consumption, making it well-suited for battery-powered and thermally constrained embedded designs. The 144-LQFP exposed-pad package improves thermal dissipation and allows hand-solderable assembly for prototypes and low-volume builds.
Typical applications include industrial control and motor drives, video processing pipelines, software-defined radio front ends, portable test and measurement equipment, and LED display controllers. The combination of 6,272 logic elements and 91 user I/O provides headroom for medium-complexity glue logic, custom peripherals, and parallel DSP functions.
When designing with this device, ensure adequate decoupling on each VCCINT and VCCA rail and follow Intel's pin connection guidelines for the EP4CE6 family. The exposed pad must be soldered to a properly sized copper pour for thermal and electrical performance, especially when running the multipliers near their maximum frequency.
This page synthesizes drop-in alternatives, distributor pricing, and practical design considerations not consolidated in the manufacturer datasheet, helping engineers shorten evaluation cycles and avoid common PCB layout pitfalls.
드롭인 대체품: EP4CE6E22C9L — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CE6E22C9L (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, PLLs, RoHS Status, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CE6E22C8N
✅ 드롭인✓ 재고 있음
$10.5 / 개
데이터시트 보기 →EP4CE6E22C7N
✅ 드롭인✓ 재고 있음
$18.5 / 개
데이터시트 보기 →EP4CE6E22C6N
✅ 드롭인✓ 재고 있음
$11.2 / 개
데이터시트 보기 →EP4CE10E22C8N
✅ 드롭인✓ 재고 있음
$11.1 / 개
데이터시트 보기 →EP4CE15E22C8N
✅ 드롭인✓ 재고 있음
$15.95 / 개
데이터시트 보기 →EP4CE6E22A7N
✅ 드롭인✓ 재고 있음
$17.4 / 개
데이터시트 보기 →EP4CE6E22C9L 최대 정격 & 전기적 특성
| Series | Cyclone IV E |
| Logic Elements (LE) | 6,272 |
| Total RAM Bits | 276,480 bits |
| Embedded Multipliers (18x18) | 15 |
| Maximum User I/O | 91 |
| Core Voltage (VCCINT) | 1.2 V |
| 패키지 | 144-LQFP Exposed Pad (EQFP-144) |
| Package Dimensions | 22 x 22 mm |
| Lead Pitch | 0.5 mm |
| 실장 유형 | Surface Mount |
| Process Node | 60 nm |
| 동작 온도 | 0C to +85C (Commercial) |
| Speed Grade | C9 |
| RoHS 상태 | Compliant |
EP4CE6E22C9L 핀 구성
| 핀 1 | I/O — User I/O pin (bank-specific voltage) |
| 핀 2 | I/O — User I/O pin (bank-specific voltage) |
| 핀 3 | I/O — User I/O pin (bank-specific voltage) |
| 핀 4 | VCCIO1 — I/O bank 1 supply voltage |
| 핀 5 | I/O — User I/O pin (bank-specific voltage) |
| 핀 6 | I/O — User I/O pin (bank-specific voltage) |
| 핀 7 | I/O — User I/O pin (bank-specific voltage) |
| 핀 8 | GND — Ground |
| 핀 9 | I/O — User I/O pin (bank-specific voltage) |
| 핀 10 | I/O — User I/O pin (bank-specific voltage) |
| 핀 11 | I/O — User I/O pin (bank-specific voltage) |
| 핀 12 | VCCINT — Core supply voltage (1.2 V) |
| 핀 13 | I/O — User I/O pin (bank-specific voltage) |
| 핀 14 | I/O — User I/O pin (bank-specific voltage) |
| 핀 15 | I/O — User I/O pin (bank-specific voltage) |
| 핀 16 | GND — Ground |
| 핀 17 | I/O — User I/O pin (bank-specific voltage) |
| 핀 18 | I/O — User I/O pin (bank-specific voltage) |
| 핀 19 | I/O — User I/O pin (bank-specific voltage) |
| 핀 20 | VCCIO2 — I/O bank 2 supply voltage |
| 핀 21 | I/O — User I/O pin (bank-specific voltage) |
| 핀 22 | I/O — User I/O pin (bank-specific voltage) |
| 핀 23 | I/O — User I/O pin (bank-specific voltage) |
| 핀 24 | GND — Ground |
| 핀 25 | I/O — User I/O pin (bank-specific voltage) |
| 핀 26 | I/O — User I/O pin (bank-specific voltage) |
| 핀 27 | I/O — User I/O pin (bank-specific voltage) |
| 핀 28 | VCCINT — Core supply voltage (1.2 V) |
| 핀 29 | I/O — User I/O pin (bank-specific voltage) |
| 핀 30 | I/O — User I/O pin (bank-specific voltage) |
| 핀 31 | I/O — User I/O pin (bank-specific voltage) |
| 핀 32 | GND — Ground |
| 핀 33 | I/O — User I/O pin (bank-specific voltage) |
| 핀 34 | I/O — User I/O pin (bank-specific voltage) |
| 핀 35 | I/O — User I/O pin (bank-specific voltage) |
| 핀 36 | VCCIO3 — I/O bank 3 supply voltage |
| 핀 37 | I/O — User I/O pin (bank-specific voltage) |
| 핀 38 | I/O — User I/O pin (bank-specific voltage) |
| 핀 39 | I/O — User I/O pin (bank-specific voltage) |
| 핀 40 | GND — Ground |
| 핀 41 | I/O — User I/O pin (bank-specific voltage) |
| 핀 42 | I/O — User I/O pin (bank-specific voltage) |
| 핀 43 | I/O — User I/O pin (bank-specific voltage) |
| 핀 44 | VCCINT — Core supply voltage (1.2 V) |
| 핀 45 | I/O — User I/O pin (bank-specific voltage) |
| 핀 46 | I/O — User I/O pin (bank-specific voltage) |
| 핀 47 | I/O — User I/O pin (bank-specific voltage) |
| 핀 48 | GND — Ground |
| 핀 49 | I/O — User I/O pin (bank-specific voltage) |
| 핀 50 | I/O — User I/O pin (bank-specific voltage) |
| 핀 51 | I/O — User I/O pin (bank-specific voltage) |
| 핀 52 | VCCIO4 — I/O bank 4 supply voltage |
| 핀 53 | I/O — User I/O pin (bank-specific voltage) |
| 핀 54 | I/O — User I/O pin (bank-specific voltage) |
| 핀 55 | I/O — User I/O pin (bank-specific voltage) |
| 핀 56 | GND — Ground |
| 핀 57 | I/O — User I/O pin (bank-specific voltage) |
| 핀 58 | I/O — User I/O pin (bank-specific voltage) |
| 핀 59 | I/O — User I/O pin (bank-specific voltage) |
| 핀 60 | VCCINT — Core supply voltage (1.2 V) |
| 핀 61 | I/O — User I/O pin (bank-specific voltage) |
| 핀 62 | I/O — User I/O pin (bank-specific voltage) |
| 핀 63 | I/O — User I/O pin (bank-specific voltage) |
| 핀 64 | GND — Ground |
| 핀 65 | I/O — User I/O pin (bank-specific voltage) |
| 핀 66 | I/O — User I/O pin (bank-specific voltage) |
| 핀 67 | I/O — User I/O pin (bank-specific voltage) |
| 핀 68 | VCCIO5 — I/O bank 5 supply voltage |
| 핀 69 | I/O — User I/O pin (bank-specific voltage) |
| 핀 70 | I/O — User I/O pin (bank-specific voltage) |
| 핀 71 | I/O — User I/O pin (bank-specific voltage) |
| 핀 72 | GND — Ground |
| 핀 73 | I/O — User I/O pin (bank-specific voltage) |
| 핀 74 | I/O — User I/O pin (bank-specific voltage) |
| 핀 75 | I/O — User I/O pin (bank-specific voltage) |
| 핀 76 | VCCINT — Core supply voltage (1.2 V) |
| 핀 77 | I/O — User I/O pin (bank-specific voltage) |
| 핀 78 | I/O — User I/O pin (bank-specific voltage) |
| 핀 79 | I/O — User I/O pin (bank-specific voltage) |
| 핀 80 | GND — Ground |
| 핀 81 | I/O — User I/O pin (bank-specific voltage) |
| 핀 82 | I/O — User I/O pin (bank-specific voltage) |
| 핀 83 | I/O — User I/O pin (bank-specific voltage) |
| 핀 84 | VCCIO6 — I/O bank 6 supply voltage |
| 핀 85 | I/O — User I/O pin (bank-specific voltage) |
| 핀 86 | I/O — User I/O pin (bank-specific voltage) |
| 핀 87 | I/O — User I/O pin (bank-specific voltage) |
| 핀 88 | GND — Ground |
| 핀 89 | I/O — User I/O pin (bank-specific voltage) |
| 핀 90 | I/O — User I/O pin (bank-specific voltage) |
| 핀 91 | I/O — User I/O pin (bank-specific voltage) |
| 핀 92 | VCCINT — Core supply voltage (1.2 V) |
| 핀 93 | I/O — User I/O pin (bank-specific voltage) |
| 핀 94 | I/O — User I/O pin (bank-specific voltage) |
| 핀 95 | I/O — User I/O pin (bank-specific voltage) |
| 핀 96 | GND — Ground |
| 핀 97 | I/O — User I/O pin (bank-specific voltage) |
| 핀 98 | I/O — User I/O pin (bank-specific voltage) |
| 핀 99 | I/O — User I/O pin (bank-specific voltage) |
| 핀 100 | VCCIO7 — I/O bank 7 supply voltage |
| 핀 101 | I/O — User I/O pin (bank-specific voltage) |
| 핀 102 | I/O — User I/O pin (bank-specific voltage) |
| 핀 103 | I/O — User I/O pin (bank-specific voltage) |
| 핀 104 | GND — Ground |
| 핀 105 | I/O — User I/O pin (bank-specific voltage) |
| 핀 106 | I/O — User I/O pin (bank-specific voltage) |
| 핀 107 | I/O — User I/O pin (bank-specific voltage) |
| 핀 108 | VCCINT — Core supply voltage (1.2 V) |
| 핀 109 | I/O — User I/O pin (bank-specific voltage) |
| 핀 110 | I/O — User I/O pin (bank-specific voltage) |
| 핀 111 | I/O — User I/O pin (bank-specific voltage) |
| 핀 112 | GND — Ground |
| 핀 113 | I/O — User I/O pin (bank-specific voltage) |
| 핀 114 | I/O — User I/O pin (bank-specific voltage) |
| 핀 115 | I/O — User I/O pin (bank-specific voltage) |
| 핀 116 | VCCIO8 — I/O bank 8 supply voltage |
| 핀 117 | I/O — User I/O pin (bank-specific voltage) |
| 핀 118 | I/O — User I/O pin (bank-specific voltage) |
| 핀 119 | I/O — User I/O pin (bank-specific voltage) |
| 핀 120 | GND — Ground |
| 핀 121 | I/O — User I/O pin (bank-specific voltage) |
| 핀 122 | I/O — User I/O pin (bank-specific voltage) |
| 핀 123 | I/O — User I/O pin (bank-specific voltage) |
| 핀 124 | VCCINT — Core supply voltage (1.2 V) |
| 핀 125 | I/O — User I/O pin (bank-specific voltage) |
| 핀 126 | I/O — User I/O pin (bank-specific voltage) |
| 핀 127 | I/O — User I/O pin (bank-specific voltage) |
| 핀 128 | GND — Ground |
| 핀 129 | I/O — User I/O pin (bank-specific voltage) |
| 핀 130 | I/O — User I/O pin (bank-specific voltage) |
| 핀 131 | I/O — User I/O pin (bank-specific voltage) |
| 핀 132 | VCCA_PLL — PLL analog supply voltage |
| 핀 133 | I/O — User I/O pin (bank-specific voltage) |
| 핀 134 | I/O — User I/O pin (bank-specific voltage) |
| 핀 135 | I/O — User I/O pin (bank-specific voltage) |
| 핀 136 | GND — Ground |
| 핀 137 | nCONFIG — Configuration control (active-low) |
| 핀 138 | nSTATUS — Configuration status (active-low) |
| 핀 139 | CONFIG_DONE — Configuration done signal |
| 핀 140 | TCK — JTAG test clock |
| 핀 141 | TMS — JTAG test mode select |
| 핀 142 | TDI — JTAG test data in |
| 핀 143 | TDO — JTAG test data out |
| 핀 144 | EPAD — Exposed thermal pad (tie to GND) |
일반적인 애플리케이션
EP4CE6E22C9L 적합 용도: 6 애플리케이션s: Industrial Motor Control (FOC / Servo Drive), LED Video Wall Display Controller, Software Defined Radio (SDR) Front End, Portable Test and Measurement Equipment, Automotive Infotainment / CAN Gateway, Educational FPGA Development Boards.
Industrial Motor Control (FOC / Servo Drive)
The EP4CE6E22C9L fits industrial motor control drives because its 15 embedded 18x18 multipliers and 91 user I/O pins support field-oriented control (FOC) algorithms, space-vector PWM generation, encoder quadrature decoding, and multi-axis timing. The 6,272 logic elements handle state machines for commutation, current-loop PI controllers, and safety interlocks. The 0C to +85C commercial temperature range suits sealed drive enclosures, while the 1.2 V core supply keeps dissipation low in always-on factory automation systems. The exposed-pad 144-LQFP package enables a compact, hand-solderable PCB layout suitable for low-volume industrial SKUs.
추천
LED Video Wall Display Controller
The EP4CE6E22C9L is well-matched to LED video wall controllers, where its 91 user I/O drive parallel data and clock lines to hundreds of LED driver ICs while its 6,272 logic elements handle scan-line multiplexing, gamma correction, and refresh-rate conversion. The 276,480 bits of embedded RAM serve as line buffers for color-space conversion (RGB to LED PWM duty cycles). Compared with a microcontroller, the FPGA's parallel fabric supports higher refresh rates without taxing a single CPU core, eliminating visible flicker on large panels. The LQFP-144 footprint eases prototype builds in custom display enclosures.
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Software Defined Radio (SDR) Front End
For SDR baseband processing, the EP4CE6E22C9L provides sufficient logic density to implement digital down-conversion (DDC), finite impulse response (FIR) filters, and quadrature demodulation. Its 15 hardware 18x18 multipliers accelerate complex-mix multiply-accumulate operations required for tuner I/Q channelization. The 276 Kbits of block RAM hold FIR coefficients and small FFT windows without needing external memory. Combined with an external ADC and DAC pair, the EP4CE6E22C9L can implement a single-channel HF or VHF SDR receiver. The 144-LQFP exposed-pad package fits a credit-card-sized PCB for portable SDR kits.
추천
Portable Test and Measurement Equipment
Battery-powered oscilloscopes, logic analyzers, and protocol testers benefit from the EP4CE6E22C9L's low dynamic power and 91 flexible user I/O. Logic analyzers use the FPGA for sampling-channel multiplexing and trigger-pattern matching, while arbitrary waveform generators use the embedded multipliers for DDS (direct digital synthesis) phase accumulators. The 1.2 V core supply combined with multi-voltage I/O banks (1.2 V to 3.3 V) lets the same board interface legacy 5 V-tolerant signals via external level shifters. The LQFP-144 exposed pad supports hand assembly for prototype instruments.
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Automotive Infotainment / CAN Gateway
Inside vehicle infotainment head units and CAN-to-Ethernet gateways, the EP4CE6E22C9L bridges multiple automotive buses (CAN, LIN, FlexRay) and routes audio/video streams to display controllers. Its 91 user I/O support several CAN controllers, audio I2S buses, and LVDS display links. The 6,272 logic elements accommodate protocol state machines and audio sample-rate conversion. Designers should pair this part with the industrial-temperature EP4CE6E22A7N variant for AEC-Q100-grade thermal profiles, since the EP4CE6E22C9L itself is commercial-grade. The exposed-pad package aids thermal dissipation behind dashboard enclosures.
추천
Educational FPGA Development Boards
University digital logic courses and FPGA training kits favor the EP4CE6E22C9L because it pairs the Intel Quartus Prime toolchain with a hand-solderable 144-LQFP exposed-pad package, eliminating BGA rework equipment for student labs. Its 6,272 logic elements are sufficient for full RISC-V soft-core implementations, VGA controllers, and UART peripherals commonly assigned in coursework. The exposed pad also simplifies thermal benchmarking and oscilloscope probing. Combined with low unit pricing, this makes the EP4CE6E22C9L a cost-effective platform for instructors building lab kits in volume.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CE6E22C9L — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CE6E22C8N | EP4CE6E22C7N | EP4CE6E22C6N | EP4CE10E22C8N | EP4CE15E22C8N | EP4CE6E22A7N |
|---|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 6,272 | 6,272 (same) | 6,272 (same) | 6,272 (same) | 10,320 (+64%) | 15,408 (+145%) | 6,272 (same) |
| Speed Grade | C9 | C8 (slower) | C7 (slower) | C6 (slowest) | C8 | C8 | A7 (industrial) |
| Embedded RAM (bits) | 276,480 | 276,480 (same) | 276,480 (same) | 276,480 (same) | 423,936 (+53%) | 516,096 (+87%) | 276,480 (same) |
| Embedded 18x18 Multipliers | 15 | 15 (same) | 15 (same) | 15 (same) | 23 (+53%) | 56 (+273%) | 15 (same) |
| Maximum User I/O | 91 | 91 (same) | 91 (same) | 91 (same) | 91 (same) | 91 (same) | 91 (same) |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +125C (Industrial) |
| Core Voltage | 1.2 V | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) |
주요 차별점
- Fastest Cyclone IV E speed grade in the 144-LQFP package (vs EP4CE6E22C8N)
- 6,272 logic elements - lowest density in Cyclone IV E 144-LQFP family (vs EP4CE15E22C8N)
- Commercial 0C to +85C temperature range (vs EP4CE6E22A7N)
설계 노트
Decouple every VCCINT pin (1.2 V core) with a 0.1 uF X7R ceramic capacitor placed within 3 mm of each pin, plus a bulk 10 uF tantalum or polymer capacitor near the FPGA. Each VCCIO bank (1.2 V to 3.3 V) requires its own 0.1 uF bypass cap. Failure to decouple each pin individually is a common cause of JTAG communication failures and intermittent configuration errors on Cyclone IV E devices.
The exposed pad (pin 144 / EPAD) on the 144-LQFP package MUST be soldered to a copper pour of at least 100 mm^2 on the top or bottom PCB layer, with thermal vias (0.3 mm drill, 0.5 mm pitch grid) connecting to internal ground planes. For designs running the 15 embedded multipliers near 266 MHz, the junction temperature can exceed 100C without adequate thermal copper, leading to timing failures or device damage.
Follow Intel's Pin Connection Guidelines for the Cyclone IV E family - unused I/O pins should be left floating or driven to a defined logic level per Quartus Prime device settings. Do not tie unused I/O to ground without checking the unused-pin report, as some I/O cells feed internal configuration logic that expects a default high state during power-up. Always run the Quartus Prime fitter with all pin assignments finalized before PCB layout freeze.
A frequent mistake is selecting the wrong speed grade for timing closure. The C9 grade in EP4CE6E22C9L is the fastest Cyclone IV E speed; substituting a C8 or C7 pin-compatible part can fail hold-time analysis in pipelines clocked above 200 MHz. Estimated: at 200 MHz fMAX, a C8 part provides roughly 10-15% less timing margin than C9. Always re-run timing analysis after substituting any speed grade variant.
Place the JTAG header (TCK, TMS, TDI, TDO) within 50 mm of the FPGA with 33 ohm series termination resistors on each JTAG signal to suppress ringing during programming. Route JTAG traces away from switching power supply nodes and high-speed differential pairs. For multi-FPGA JTAG chains, add a 1k pull-up on TCK and TMS to keep the chain in a benign state during board power-up.
규정 준수 정보
RoHS and lead-free compliant per Cyclone IV E product page. Commercial temperature grade - not AEC-Q100 qualified. Choose EP4CE6E22A7N for industrial-grade thermal profiles.