10M50SCE144A7G - MAX 10 FPGA 50KLE 144-LQFP | Intel
부품 번호: 10M50SCE144A7G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $20.73 | $20.73 |
| 10 | $18.95 | $189.50 |
| 100 | $16.4 | $1,640.00 |
| 500 | $14.2 | $7,100.00 |
| 1,000 | $12.85 | $12,850.00 |
10M50SCE144A7G 개요
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that belongs to the broader hierarchy of digital semiconductors: FPGA -> programmable logic -> logic IC -> integrated circuit. Unlike ASICs (Application Specific Integrated Circuits) which are factory-fixed, FPGAs use configurable logic blocks (CLBs), programmable interconnects, and I/O cells that the engineer programs via HDL (Hardware Description Language) to implement custom digital functions, glue logic, state machines, and parallel processing pipelines. The MAX 10 line specifically targets low-cost, non-volatile, instant-on applications where microcontrollers alone lack the I/O count or parallel throughput but full Cyclone/Stratix FPGAs are oversized.
Key differentiating features of the 10M50SCE144A7G include its 50KLE logic density (the maximum available in the MAX 10 family), 16 KBytes of user flash inside the die, 2.5 Mb embedded SRAM, 1.6 Mb of flash for configuration plus 64 Kb user-accessible flash, 12-bit 1-MSPS ADC with 16 analog inputs on select variants, and dual supply options for analog and digital rails. The device supports LPDDR2, DDR3, and LPDDR3 external memory interfaces via soft IP, making it well suited to video bridging and industrial HMI. The EQFP-144 exposed pad provides a thermal resistance of approximately 12-15 C/W with a properly soldered thermal pad, enabling reliable operation up to 100 C junction temperature in the industrial -40C to +100C ambient range.
Architecturally, the 10M50SCE144A7G uses a Look-Up Table (LUT)-based fabric of 3,125 LABs (Logic Array Blocks), each containing 16 logic elements, fed by a global and regional routing network. Configuration is stored in on-chip flash that loads at power-up in less than 5 ms, eliminating external boot PROM requirements that earlier CPLD/FPGA families needed. This instant-on capability, combined with the dual-configuration flash region, supports fail-safe field updates - critical for industrial control and automotive aftermarket designs.
Typical applications include industrial motor control and PLC I/O expansion, video processing and image aggregation for surveillance systems, factory automation bridges between legacy parallel buses and modern Ethernet/USB, automotive infotainment rear-seat displays, and consumer IoT gateway hubs. The integrated 12-bit ADC also suits battery management and analog sensor aggregation in motor-drive designs.
Designers should pay particular attention to the LQFP-144 exposed-pad soldering requirements: a 4x4 thermal via array beneath the exposed pad is mandatory to meet the package's thermal specifications. Quartus Prime Lite or Standard software is required for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, drop-in alternatives across the MAX 10 E144 family, and practical design notes not consolidated in any single manufacturer datasheet or distributor listing.
드롭인 대체품: 10M50SCE144A7G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M50SCE144A7G (동일 폼 팩터 및 풋프린트) — 차이점: Logic Elements (LE), Package, Process Technology, MSL Level, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M40SCE144A7G
✅ 드롭인✓ 재고 있음
$57.21 / 개
데이터시트 보기 →10M50SAE144C8G
✅ 드롭인✓ 재고 있음
$47.9 / 개
데이터시트 보기 →10M25SCE144A7G
✅ 드롭인✓ 재고 있음
$47.21 / 개
데이터시트 보기 →10M16SCE144A7G
✅ 드롭인✓ 재고 있음
$24.5 / 개
데이터시트 보기 →10M50SAE144C8G-Q
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10M08SCE144A7G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10M50SCE144A7G 최대 정격 & 전기적 특성
| Series | MAX 10 |
| Logic Elements (LE) | 50,000 |
| Total User Flash Bits | 1,677,312 bits |
| User I/O Count | 101 |
| Number of LABs/CLBs | 3,125 |
| Supply Voltage - Core | 1.2 V (internal) |
| Supply Voltage - I/O | 3.0 V / 3.3 V LVCMOS/LVTTL |
| 동작 온도 | -40C to +100C (industrial) |
| 실장 유형 | Surface Mount |
| 패키지 / 케이스 | 144-LQFP Exposed Pad (EQFP-144) |
| Number of PLLs | 2 |
| Integrated ADC | 12-bit, 1 MSPS (analog inputs package-dependent) |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| Configuration Method | On-chip non-volatile flash (instant-on, no external boot PROM) |
| Process Technology | TSMC 55 nm NOR-flash + SRAM |
10M50SCE144A7G 144-lqfp exposed pad (eqfp-144) 핀 구성 가이드
10M50SCE144A7G(144-lqfp exposed pad (eqfp-144) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10M50SCE144A7G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10M50SCE144A7G 적합 용도: 6 애플리케이션s: Industrial Motor Control & PLC I/O, Video Bridging & Image Aggregation, Factory Automation Protocol Bridges, Automotive Infotainment Auxiliary Displays, IoT Gateway & Edge Aggregation, Battery Management & Power Conversion.
Industrial Motor Control & PLC I/O
The 10M50SCE144A7G's 50KLE fabric and 12-bit 1 MSPS integrated ADC make it well suited to industrial motor control and PLC I/O expansion, where it can host multiple PWM generators, quadrature encoder interfaces, and a Nios II soft-core for field-oriented control loops. Operating across the full industrial -40C to +100C ambient range with on-chip non-volatile flash, the device eliminates external boot PROMs and survives factory-floor temperature swings. The 101 user I/O pins of the 144-LQFP-EP package provide sufficient headroom for multi-axis drives with current-sensor, encoder, and communication buses on a single chip. Designers typically place the FPGA between 24V-referenced gate drivers and an Ethernet/IP or EtherCAT master, reducing the BOM by 30-40% compared to microcontroller-plus-DSP architectures.
추천
Video Bridging & Image Aggregation
With 50KLE of programmable logic plus soft DDR3/LPDDR2 memory controller IP, the 10M50SCE144A7G is a strong fit for video bridging, image aggregation, and lightweight display processing applications such as industrial HMI panels and multi-camera surveillance recorders. Its 1,677,312 bits of user flash and 2.5 Mb embedded SRAM accommodate line buffers and frame-correction logic without external memory, while the 144-LQFP-EP package supports hand-reworkable prototypes that smaller BGAs cannot. Compared with discrete ASSP bridges, the 10M50 lets designers add proprietary overlays, watermarking, or protocol conversions in the same silicon. The integrated ADC also digitizes backlight or touch-panel analog signals.
추천
Factory Automation Protocol Bridges
The 10M50SCE144A7G excels as a factory automation protocol bridge, translating between legacy parallel buses (PC/104, ISA, parallel ADC) and modern Ethernet/IP, PROFINET, EtherCAT, or USB 3.0 interfaces. The 50KLE logic capacity can implement a Nios II soft-core running a real-time protocol stack in parallel with custom DMA engines, while the 101 user I/O pins of the 144-LQFP-EP footprint route legacy bus signals cleanly to internal registers. Its instant-on configuration from on-chip flash avoids external boot devices in sealed IP67 enclosures where service is impossible. Industrial temperature grading -40C to +100C and 12-bit ADC for sensor aggregation make it a single-chip solution for legacy-to-modern protocol conversion.
추천
Automotive Infotainment Auxiliary Displays
The 10M50SCE144A7G suits automotive infotainment auxiliary display applications such as rear-seat entertainment clusters, instrument-cluster repeaters, and HUD signal-conditioning, where it converts LVDS/eDP inputs to local LCD or OLED timing. Its on-chip flash and -40C to +100C ambient rating cover cabin and door-module thermal profiles, while 101 user I/O pins accommodate multi-touch and ambient-light-sensor aggregation. The 12-bit ADC digitizes backlight current and temperature signals directly, removing external monitoring ICs. Designers use the MAX 10's instant-on flash to wake displays within 100 ms of CAN bus activity - a key infotainment requirement.
추천
IoT Gateway & Edge Aggregation
In IoT gateway and edge-aggregation nodes, the 10M50SCE144A7G provides a flexible bridge between low-speed sensor buses (I2C, SPI, UART, 1-Wire, GPIO) and high-speed uplinks (Wi-Fi, Ethernet, LoRa, cellular modems). Its 50KLE fabric runs a RISC-V or Nios II soft-core aggregating data from dozens of sensors, while the integrated 12-bit ADC handles analog inputs directly. The 144-LQFP-EP package's hand-solder-friendly form factor benefits low-volume industrial gateway products, and the industrial temperature range -40C to +100C supports outdoor enclosures. On-chip user flash stores firmware updates and cryptographic keys securely.
추천
Battery Management & Power Conversion
The 10M50SCE144A7G's integrated 12-bit 1 MSPS ADC combined with 50KLE logic and 101 user I/O make it an excellent battery management system (BMS) controller for e-mobility, UPS, and energy-storage applications. The fabric implements cell-balancing algorithms, state-of-charge estimators, and CAN/Modbus communication stacks, while the ADC samples individual cell voltages and shunt currents directly. The 144-LQFP-EP exposed pad dissipates up to 1.5 W comfortably with proper via-array soldering, critical for sealed battery enclosures. Industrial -40C to +100C rating supports outdoor cabinet installations and under-hood automotive environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10M50SCE144A7G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M40SCE144A7G | 10M50SAE144C8G | 10M25SCE144A7G | 10M16SCE144A7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same |
| Logic Elements | 50,000 | 40,000 (-20%) | 50,000 (same die) | 25,000 (-50%) | 16,000 (-68%) |
| User I/O | 101 | 101 (same) | 101 (same) | 101 (same) | 101 (same) |
| User Flash Bits | 1,677,312 | 1,255,680 (-25%) | 1,677,312 (same) | 819,200 (-51%) | 549,888 (-67%) |
| Speed Grade | -7 | -7 (same) | -8 (faster) | -7 (same) | -7 (same) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial | Industrial | Industrial |
| Integrated ADC | 12-bit, 1 MSPS | 12-bit, 1 MSPS (same) | 12-bit, 1 MSPS (same) | 12-bit, 1 MSPS (same) | 12-bit, 1 MSPS (same) |
| Configuration Method | On-chip non-volatile flash | On-chip non-volatile flash (same) | On-chip non-volatile flash (same) | On-chip non-volatile flash (same) | On-chip non-volatile flash (same) |
주요 차별점
- Highest logic density in MAX 10 E144 footprint (vs 10M40SCE144A7G)
- 50KLE with industrial temperature rating (vs 10M50SAE144C8G)
- Instant-on from on-chip flash (vs 10M16SCE144A7G)
설계 노트
Estimated: The 144-LQFP-EP exposed pad must be soldered to a 4x4 thermal via array (0.3 mm via diameter, 0.5 mm pitch) connected to an inner ground or power plane to meet the datasheet theta-JA of approximately 12-15 C/W. Without the via array, junction temperature can exceed 100C at moderate loads (1.0-1.5 W dissipation), triggering thermal shutdown. Apply solder paste to the EP land pattern during stencil design; insufficient paste causes dry joints and thermal runaway under industrial-temperature load.
Place all MAX 10 decoupling capacitors within 3 mm of their respective supply pins: 0.1 uF X7R ceramic on each VCCIO/VCCINT bank plus a single 10 uF bulk capacitor on each rail. The configuration pins (nCONFIG, nSTATUS, CONF_DONE) require 4.7 kohm pull-ups to VCCIO. JTAG TMS and TCK must each have a 10 kohm pull-up to VCCIO to prevent spurious configuration entry during power-up. Route JTAG signals away from switching power and clock traces to avoid programming failures.
Do not leave the 10M50SCE144A7G's unused GPIO pins floating; configure them as outputs driving low or as inputs with internal weak pull-ups in your Quartus Prime pin assignment file. Floating pins can draw tens of milliamps through internal ESD structures and cause erratic behavior. Also, the dual-configuration flash region allows field updates, but you must implement the standard Altera remote-update IP block to safely switch images; manual bitstream swaps can brick the device in the field.
Route all differential pairs (LVDS, mini-LVDS) with 100 ohm differential impedance and length-matched within 150 mils (3.8 mm) to maintain signal integrity at the MAX 10's 304 Mbps LVDS rate. Keep PLL analog supply pins (VCCA_PLL) isolated with a ferrite bead and decoupled with 0.1 uF + 10 uF capacitors; switching noise on VCCA_PLL causes PLL jitter to exceed the datasheet 300 ps peak-to-peak spec, which corrupts DDR3 controller timing margins.
규정 준수 정보
RoHS and REACH compliance per Altera/Intel product declaration. Not AEC-Q100 qualified; for automotive applications consult Intel's MAX 10 automotive-grade variants. Halogen-free status not explicitly confirmed in available data - set to unknown.