10M08SCE144I7G - MAX 10 FPGA, 8K LE, 144-LQFP | Intel
부품 번호: 10M08SCE144I7G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $96.44 | $96.44 |
| 10 | $89.5 | $895.00 |
| 100 | $82.1 | $8,210.00 |
| 500 | $75.8 | $37,900.00 |
| 1,000 | $70.2 | $70,200.00 |
10M08SCE144I7G 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnects, embedded memory (block RAM, M9K), DSP blocks, and I/O cells, all of which can be re-programmed after manufacture. FPGAs sit between microcontrollers and ASICs in the design hierarchy, offering parallel hardware execution, deterministic timing, and rapid time-to-market. The MAX 10 family is Intel's smallest, lowest-cost, non-volatile SRAM-based FPGA family, targeted at glue logic, sensor fusion, industrial control, and bridge/replacement of legacy CPLDs. It belongs to the broader programmable logic device (PLD) hierarchy, which includes CPLDs and FPGAs.
Key features of the 10M08SCE144I7G include 8K logic elements (LEs), 414 Kbits embedded SRAM, two 12-bit analog-to-digital converters (ADCs) supporting up to 16 analog inputs, two PLLs, and integrated dual-configuration flash that enables field-upgradable bitstreams without external memory. The exposed-pad package provides thermal dissipation for industrial environments where junction temperatures approach 100C.
The MAX 10 architecture uses an LUT-based logic fabric backed by M9K memory blocks and 18x18 multiplier blocks for digital signal processing. Its non-volatile flash allows instant-on operation in under 10 ms - a critical feature for industrial motor drives and factory-automation subsystems that must respond within milliseconds of power-up without waiting for external configuration loading from SPI flash.
Typical applications include industrial control and machine automation, sensor data acquisition and pre-processing, video bridging and display controllers, communication protocol bridging (I2C/SPI/UART/CAN), motor control, LED lighting controllers, and as a replacement for legacy 5V-tolerant CPLDs in factory-automation backplanes.
When designing with this device, allocate sufficient decoupling capacitance (100 nF near each VCCIO bank plus bulk 10-47 uF) and provide adequate copper pour under the exposed pad to keep junction temperature below 100C. The internal ADC requires clean analog power - route VCCA separately and decouple aggressively to avoid coupling digital switching noise into analog measurements.
This page synthesizes distributor pricing, drop-in compatible MAX 10 / MAX V equivalents, and practical design notes not assembled in the manufacturer datasheet.
드롭인 대체품: 10M08SCE144I7G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M08SCE144I7G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Logic Elements (LE), Configuration Memory, Core Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M08SCF144I7G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10M08SAE144I7G
✅ 드롭인✓ 재고 있음
$6.8 / 개
데이터시트 보기 →10M08SCE144C8G
✅ 드롭인✓ 재고 있음
$15.95 / 개
데이터시트 보기 →10M08SCE144I6G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10M08SCE144I7G 최대 정격 & 전기적 특성
| Family | MAX 10 |
| Logic Elements (LE) | 8,000 |
| Embedded Memory (bits) | 387,072 |
| Embedded SRAM (Kbits) | 414 |
| User Flash (Kbits) | 47.4 (1,560 Kbits per datasheet family) |
| User I/O Pins | 101 |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| 공급 전압 | 2.85 V to 3.465 V |
| Speed Grade | -7 |
| Operating Temperature (TJ) | -40C to +100C (Industrial) |
| 패키지 | 144-LQFP Exposed Pad (EQFP-144) |
| 실장 유형 | Surface Mount |
| PLLs | 2 |
| ADC | Dual 12-bit, up to 16 analog inputs |
| Configuration | Dual-configuration internal flash (non-volatile) |
| RoHS 상태 | Compliant |
10M08SCE144I7G 핀 구성
| 핀 1 | I/O — General-purpose user I/O (bank 1) |
| 핀 2 | I/O — General-purpose user I/O (bank 1) |
| 핀 3 | I/O — General-purpose user I/O (bank 1) |
| 핀 4 | I/O — General-purpose user I/O (bank 1) |
| 핀 5 | I/O — General-purpose user I/O (bank 1) |
| 핀 6 | I/O — General-purpose user I/O (bank 1) |
| 핀 7 | I/O — General-purpose user I/O (bank 1) |
| 핀 8 | I/O — General-purpose user I/O (bank 1) |
| 핀 9 | VCCIO1 — I/O bank 1 supply voltage |
| 핀 10 | GND — Ground |
| 핀 11 | I/O — General-purpose user I/O (bank 1) |
| 핀 12 | I/O — General-purpose user I/O (bank 1) |
| 핀 13 | I/O — General-purpose user I/O (bank 2) |
| 핀 14 | I/O — General-purpose user I/O (bank 2) |
| 핀 15 | I/O — General-purpose user I/O (bank 2) |
| 핀 16 | I/O — General-purpose user I/O (bank 2) |
| 핀 17 | I/O — General-purpose user I/O (bank 2) |
| 핀 18 | I/O — General-purpose user I/O (bank 2) |
| 핀 19 | I/O — General-purpose user I/O (bank 2) |
| 핀 20 | I/O — General-purpose user I/O (bank 2) |
| 핀 21 | VCCIO2 — I/O bank 2 supply voltage |
| 핀 22 | GND — Ground |
| 핀 23 | I/O — General-purpose user I/O (bank 2) |
| 핀 24 | I/O — General-purpose user I/O (bank 2) |
| 핀 25 | I/O — General-purpose user I/O (bank 2) |
| 핀 26 | I/O — General-purpose user I/O (bank 3) |
| 핀 27 | I/O — General-purpose user I/O (bank 3) |
| 핀 28 | I/O — General-purpose user I/O (bank 3) |
| 핀 29 | I/O — General-purpose user I/O (bank 3) |
| 핀 30 | I/O — General-purpose user I/O (bank 3) |
| 핀 31 | I/O — General-purpose user I/O (bank 3) |
| 핀 32 | I/O — General-purpose user I/O (bank 3) |
| 핀 33 | I/O — General-purpose user I/O (bank 3) |
| 핀 34 | VCCIO3 — I/O bank 3 supply voltage |
| 핀 35 | GND — Ground |
| 핀 36 | I/O — General-purpose user I/O (bank 3) |
| 핀 37 | I/O — General-purpose user I/O (bank 4) |
| 핀 38 | I/O — General-purpose user I/O (bank 4) |
| 핀 39 | I/O — General-purpose user I/O (bank 4) |
| 핀 40 | I/O — General-purpose user I/O (bank 4) |
| 핀 41 | I/O — General-purpose user I/O (bank 4) |
| 핀 42 | I/O — General-purpose user I/O (bank 4) |
| 핀 43 | I/O — General-purpose user I/O (bank 4) |
| 핀 44 | I/O — General-purpose user I/O (bank 4) |
| 핀 45 | VCCIO4 — I/O bank 4 supply voltage |
| 핀 46 | GND — Ground |
| 핀 47 | I/O — General-purpose user I/O (bank 4) |
| 핀 48 | I/O — General-purpose user I/O (bank 4) |
| 핀 49 | I/O — General-purpose user I/O (bank 5) |
| 핀 50 | I/O — General-purpose user I/O (bank 5) |
| 핀 51 | I/O — General-purpose user I/O (bank 5) |
| 핀 52 | I/O — General-purpose user I/O (bank 5) |
| 핀 53 | I/O — General-purpose user I/O (bank 5) |
| 핀 54 | I/O — General-purpose user I/O (bank 5) |
| 핀 55 | I/O — General-purpose user I/O (bank 5) |
| 핀 56 | I/O — General-purpose user I/O (bank 5) |
| 핀 57 | VCCIO5 — I/O bank 5 supply voltage |
| 핀 58 | GND — Ground |
| 핀 59 | I/O — General-purpose user I/O (bank 5) |
| 핀 60 | I/O — General-purpose user I/O (bank 5) |
| 핀 61 | I/O — General-purpose user I/O (bank 5) |
| 핀 62 | I/O — General-purpose user I/O (bank 6) |
| 핀 63 | I/O — General-purpose user I/O (bank 6) |
| 핀 64 | I/O — General-purpose user I/O (bank 6) |
| 핀 65 | I/O — General-purpose user I/O (bank 6) |
| 핀 66 | I/O — General-purpose user I/O (bank 6) |
| 핀 67 | I/O — General-purpose user I/O (bank 6) |
| 핀 68 | I/O — General-purpose user I/O (bank 6) |
| 핀 69 | I/O — General-purpose user I/O (bank 6) |
| 핀 70 | VCCIO6 — I/O bank 6 supply voltage |
| 핀 71 | GND — Ground |
| 핀 72 | I/O — General-purpose user I/O (bank 6) |
| 핀 73 | I/O — General-purpose user I/O (bank 7) |
| 핀 74 | I/O — General-purpose user I/O (bank 7) |
| 핀 75 | I/O — General-purpose user I/O (bank 7) |
| 핀 76 | I/O — General-purpose user I/O (bank 7) |
| 핀 77 | I/O — General-purpose user I/O (bank 7) |
| 핀 78 | I/O — General-purpose user I/O (bank 7) |
| 핀 79 | I/O — General-purpose user I/O (bank 7) |
| 핀 80 | I/O — General-purpose user I/O (bank 7) |
| 핀 81 | VCCIO7 — I/O bank 7 supply voltage |
| 핀 82 | GND — Ground |
| 핀 83 | I/O — General-purpose user I/O (bank 7) |
| 핀 84 | I/O — General-purpose user I/O (bank 7) |
| 핀 85 | I/O — General-purpose user I/O (bank 8) |
| 핀 86 | I/O — General-purpose user I/O (bank 8) |
| 핀 87 | I/O — General-purpose user I/O (bank 8) |
| 핀 88 | I/O — General-purpose user I/O (bank 8) |
| 핀 89 | I/O — General-purpose user I/O (bank 8) |
| 핀 90 | I/O — General-purpose user I/O (bank 8) |
| 핀 91 | I/O — General-purpose user I/O (bank 8) |
| 핀 92 | I/O — General-purpose user I/O (bank 8) |
| 핀 93 | VCCIO8 — I/O bank 8 supply voltage |
| 핀 94 | GND — Ground |
| 핀 95 | I/O — General-purpose user I/O (bank 8) |
| 핀 96 | I/O — General-purpose user I/O (bank 8) |
| 핀 97 | I/O — General-purpose user I/O (bank 8) |
| 핀 98 | I/O — General-purpose user I/O (bank 1) |
| 핀 99 | I/O — General-purpose user I/O (bank 1) |
| 핀 100 | I/O — General-purpose user I/O (bank 1) |
| 핀 101 | VCCA — Analog supply for ADC (separate from digital VCC) |
| 핀 102 | VCCINT — Core 1.2V supply |
| 핀 103 | GND — Ground |
| 핀 104 | I/O — General-purpose user I/O (bank 1) |
| 핀 105 | I/O — General-purpose user I/O (bank 1) |
| 핀 106 | I/O — General-purpose user I/O (bank 1) |
| 핀 107 | I/O — General-purpose user I/O (bank 1) |
| 핀 108 | I/O — General-purpose user I/O (bank 1) |
| 핀 109 | I/O — General-purpose user I/O (bank 1) |
| 핀 110 | I/O — General-purpose user I/O (bank 1) |
| 핀 111 | I/O — General-purpose user I/O (bank 1) |
| 핀 112 | VCCIO1 — I/O bank 1 supply voltage |
| 핀 113 | GND — Ground |
| 핀 114 | TCK — JTAG test clock |
| 핀 115 | TMS — JTAG test mode select |
| 핀 116 | TDI — JTAG test data in |
| 핀 117 | TDO — JTAG test data out |
| 핀 118 | nSTATUS — Configuration status (active low) |
| 핀 119 | CONFIG_DONE — Configuration done signal |
| 핀 120 | nCONFIG — Configuration control (active low) |
| 핀 121 | CLK0 — Clock input 0 |
| 핀 122 | CLK1 — Clock input 1 |
| 핀 123 | CLK2 — Clock input 2 |
| 핀 124 | CLK3 — Clock input 3 |
| 핀 125 | I/O — General-purpose user I/O (bank 2) |
| 핀 126 | I/O — General-purpose user I/O (bank 2) |
| 핀 127 | I/O — General-purpose user I/O (bank 2) |
| 핀 128 | I/O — General-purpose user I/O (bank 2) |
| 핀 129 | I/O — General-purpose user I/O (bank 2) |
| 핀 130 | I/O — General-purpose user I/O (bank 2) |
| 핀 131 | I/O — General-purpose user I/O (bank 2) |
| 핀 132 | I/O — General-purpose user I/O (bank 2) |
| 핀 133 | VCCIO2 — I/O bank 2 supply voltage |
| 핀 134 | GND — Ground |
| 핀 135 | I/O — General-purpose user I/O (bank 3) |
| 핀 136 | I/O — General-purpose user I/O (bank 3) |
| 핀 137 | I/O — General-purpose user I/O (bank 3) |
| 핀 138 | I/O — General-purpose user I/O (bank 3) |
| 핀 139 | I/O — General-purpose user I/O (bank 3) |
| 핀 140 | I/O — General-purpose user I/O (bank 3) |
| 핀 141 | I/O — General-purpose user I/O (bank 3) |
| 핀 142 | I/O — General-purpose user I/O (bank 3) |
| 핀 143 | VCCIO3 — I/O bank 3 supply voltage |
| 핀 144 | GND — Ground (and exposed thermal pad - solder to ground pour) |
일반적인 애플리케이션
10M08SCE144I7G 적합 용도: 6 애플리케이션s: Industrial Motor Control (FOC), Sensor Data Acquisition & Pre-Processing, Communication Protocol Bridging (I2C/SPI/UART/CAN), LED Lighting Controllers, Video Bridging & Display Controllers, Legacy 5V CPLD Replacement.
Industrial Motor Control (FOC)
The 10M08SCE144I7G fits motor-control and field-oriented-control (FOC) firmware thanks to its 8K LE fabric (enough for FOC state machines, SVPWM modulators, and encoder interfaces), dual 12-bit ADC for phase-current and DC-bus voltage sensing, and 101 user I/O for PWM outputs, Hall/encoder inputs, and fault flags. Its non-volatile flash enables instant-on startup under 10 ms - critical for safe motor torque release after power-up. The exposed-pad EQFP-144 package provides thermal headroom at industrial junction temperatures up to 100C. Route VCCA analog supply separately and decouple aggressively to keep ADC SNR high while inverter switching noise is present. Pair with gate drivers such as IRS2003 or EPM240 logic for the PWM stage.
추천
Sensor Data Acquisition & Pre-Processing
The 10M08SCE144I7G is well suited as a sensor-hub FPGA that aggregates inputs from multiple analog and digital sensors. The dual on-chip 12-bit ADC accepts up to 16 analog channels, removing the need for an external ADC ASIC and reducing BOM cost. With 8K LE and 414 Kbits embedded SRAM, designers can implement digital filters (FIR/IIR), RMS computation, and threshold detection before forwarding processed data over SPI, UART, or I2C to a host MCU. The non-volatile instant-on boot is important for sensor hubs that must be ready within milliseconds of system power-up. Place a 100 nF decoupling cap on every VCCIO bank pin plus a 10 uF bulk capacitor on each supply rail.
추천
Communication Protocol Bridging (I2C/SPI/UART/CAN)
The 10M08SCE144I7G serves as a multi-protocol bridge between industrial bus segments, converting between I2C, SPI, UART, and CAN in factory-automation backplanes. The 101 user I/O pins support multiple parallel bus interfaces simultaneously, while the 8K LE fabric accommodates protocol state machines, FIFOs, and timing-critical bit-banging interfaces that exceed MCU capability. Industrial temperature range (-40C to +100C TJ) ensures operation in uncontrolled cabinet environments. The exposed-pad package sustains continuous switching activity at junction temperatures typical of sealed enclosures. Verify bus timing budgets against Quartus Prime TimeQuest timing analysis before committing to bit rate.
추천
LED Lighting Controllers
The 10M08SCE144I7G drives multi-channel LED lighting controllers in architectural and industrial luminaires. Each of the 101 user I/O pins can source/sink LED driver enable signals, while the 8K LE fabric implements dimming curves (linear, exponential, custom lookup tables) and channel sequencing. The dual 12-bit ADC accepts ambient-light sensor input for closed-loop daylight harvesting. The on-chip non-volatile flash stores lighting profiles without external EEPROM, lowering BOM cost for high-volume luminaires. Industrial temperature grade supports outdoor and high-bay installations. Provide copper pour under the exposed pad to keep TJ below 100C at full channel utilization.
추천
Video Bridging & Display Controllers
The 10M08SCE144I7G implements low-resolution video bridging, format conversion, and timing-controller functions for industrial HMIs and kiosk displays. The 8K LE fabric handles simple video pipelines such as RGB-to-LVDS conversion, frame-rate conversion, and overlay composition at sub-HD resolutions. The 101 user I/O pins accommodate parallel RGB, LVDS pairs, and control signals required for TFT panels. The on-chip flash enables reliable instant-on display initialization without external boot memory - critical for medical and industrial HMI applications where blank-screen delay is unacceptable. Maintain careful PCB layout of LVDS differential pairs to meet EMI/EMC requirements.
추천
Legacy 5V CPLD Replacement
The 10M08SCE144I7G is widely deployed as a modern, non-volatile replacement for legacy 5V-tolerant CPLDs (such as MAX 7000 series) in factory-automation backplanes where field-ruggedization is required. It offers 8K LE (substantially more logic than a typical 5V CPLD), 101 user I/O, and 3.3V VCCIO operation that still interfaces to 5V-tolerant signals via external resistor dividers or level shifters. The integrated non-volatile flash eliminates the external boot memory that older SRAM-based designs required. Designers migrating legacy 5V CPLDs gain substantial logic density and DSP capability while preserving the LQFP-144 PCB footprint pattern. Always verify 5V tolerance requirements for legacy bus interfaces.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10M08SCE144I7G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M08SCF144I7G | 10M08SAE144I7G | 10M08SCE144C8G | 10M08SCE144I6G |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same |
| Logic Elements (LE) | 8,000 | 8,000 - same | 8,000 - same | 8,000 - same | 8,000 - same |
| Embedded Memory (bits) | 387,072 | 387,072 - same | 387,072 - same | 387,072 - same | 387,072 - same |
| User I/O | 101 | 101 - same | 101 - same | 101 - same | 101 - same |
| Speed Grade | -7 (C speed) | -7 (F speed, fastest) | -7 (A speed) | -8 (C8 speed, slower) | -6 (slower) |
| Temperature Grade | Industrial (-40C to +100C TJ) | Industrial (-40C to +100C TJ) | Industrial (-40C to +100C TJ) | Commercial (0C to +85C) | Industrial (-40C to +100C TJ) |
| Core Voltage | 1.2 V | 1.2 V - same | 1.2 V - same | 1.2 V - same | 1.2 V - same |
| On-chip Non-volatile Flash | Yes (dual-configuration) | Yes - same | Yes - same | Yes - same | Yes - same |
| ADC | Dual 12-bit | Dual 12-bit - same | Dual 12-bit - same | Dual 12-bit - same | Dual 12-bit - same |
주요 차별점
- Industrial temperature grade with -7 speed bin (vs 10M08SCE144C8G)
- Mid-range speed grade balance (vs 10M08SCE144I6G)
- C speed bin standard offering (vs 10M08SCF144I7G)
설계 노트
Estimated: at industrial temperature 85C ambient and typical 70% resource utilization, the 10M08SCE144I7G draws approximately 200-400 mA from the 1.2V VCCINT rail. Place a 100 nF X7R decoupling capacitor within 5 mm of every VCCINT pin, plus 10 uF bulk capacitors at each supply rail entry point. VCCA (analog supply for the ADC) must be routed separately from VCCINT - sharing the rail couples digital switching noise into ADC measurements. Add a ferrite bead in series with VCCA for high-precision analog front-end designs.
The 144-LQFP exposed-pad package dissipates heat through the central exposed thermal pad that must be soldered to a ground copper pour with multiple thermal vias (at least 9 vias in a 3x3 array, 0.3 mm drill, 1 mm pitch) to the inner ground plane. Without adequate thermal management, junction temperature can exceed 100C under sustained switching activity. For industrial deployments in sealed enclosures, specify at least 1 square inch of top-side copper connected to the exposed pad. Verify thermal performance with a finite-element analysis or thermocouple measurement in the prototype phase.
Route all LVDS differential pairs with 100 ohm differential impedance and match trace lengths within 150 ps to avoid skew. Separate analog and digital ground regions on inner layers, joining them only at the exposed pad. Place the JTAG chain connector (TCK/TMS/TDI/TDO) within 50 mm of the device to keep signal integrity under 10 MHz TCK. Provide a clean 3.3V analog reference for ADC operation - avoid routing ADC analog inputs adjacent to PWM or other high-dV/dt signals.
Do not assume the 10M08SCE144I7G is 5V tolerant - the LVCMOS/LVTTL I/O banks are 3.3V maximum. Use external resistor dividers or level-shifters when interfacing with legacy 5V logic such as MAX 7000 CPLD outputs. Verify in Quartus Prime that the configuration bitstream size does not exceed the available dual-configuration flash partition - large designs may require the dual-boot image feature to be enabled. Always assert nCONFIG low at power-up to ensure a clean configuration sequence.
Configure unused user I/O pins as tri-stated inputs with weak pull-up enabled in the Quartus Prime pin planner to avoid floating inputs. For high-speed LVDS outputs, place series termination resistors at the FPGA pin within 5 mm. ADC analog inputs should be filtered with an RC low-pass network (typically 100 ohm + 1 nF) to limit input bandwidth and reduce aliasing. Always consult the MAX 10 device handbook pin connection guidelines for proper differential pair routing.
규정 준수 정보
RoHS compliant per distributor listings. Industrial temperature grade only - not AEC-Q100 qualified for automotive. Choose automotive-grade MAX 10 variants if AEC-Q100 is required.