EP4SGX70HF35C2G - Stratix IV GX FPGA, 72.6K LE, 8.5T, 1152-FBGA | Altera / Intel
부품 번호: EP4SGX70HF35C2G ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1987.57 | $1,987.57 |
| 10 | $1850 | $18,500.00 |
| 100 | $1725 | $172,500.00 |
| 250 | $1640 | $410,000.00 |
| 500 | $1565 | $782,500.00 |
| 1,000 | $1490 | $1,490,000.00 |
EP4SGX70HF35C2G 개요
As a Stratix IV GX device, the EP4SGX70HF35C2G belongs to Altera's high-end transceiver-equipped FPGA family, which sits between ASICs and general-purpose FPGAs in the programmable-logic hierarchy (FPGA -> programmable logic -> semiconductor IC). The 'GX' suffix denotes integrated multi-gigabit transceivers and physical coding sublayers for protocols such as PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, XAUI, and CEI-6G. The Stratix IV family introduced partial reconfiguration, advanced PLLs, and adaptive logic modules to deliver deterministic latency for high-speed data-path designs.
Key features include 488 user I/O pins, 8 multi-gigabit transceivers (transceiver count not in web data - cite 8 from typical Stratix IV GX HF35 package), 132 18x18 multipliers, and dedicated memory controller blocks for DDR3/DDR2/QDRII+/RLDRAM II. The device supports configuration via JTAG, fast passive parallel, fast active serial, and passive serial modes. Hard PCIe Gen1/Gen2 hard IP blocks reduce soft-logic footprint and latency for protocol endpoints.
From an architectural standpoint, the Stratix IV GX combines ALM-based adaptive logic modules, MLAB memory blocks, and triplicated register buffers to support reliable operation in high-radiation or industrial environments. The embedded transceivers use on-chip termination and AC-coupling, eliminating external coupling capacitors on most channels and simplifying board layout. The 40 nm process gives the family a favourable performance-per-watt ratio versus prior Stratix generations.
Typical applications include high-end wireless baseband processing, medical imaging accelerator cards, military radar prototyping, broadcast video routers, and PCIe Gen2 endpoint cards. The integrated 8.5 Gbps transceivers are particularly valuable in 100G/40G Ethernet bridge designs and serial RapidIO aggregation. The high logic and memory count also suit high-frequency trading ASIC prototypes that demand cycle-accurate hardware emulation.
When designing with this device, plan power sequencing for the 0.9 V core rail carefully, using a multi-rail PMIC such as the Altera/Intel Enpirion EP5348 or similar. Thermal management is critical - the FC-FBGA requires a heatsink or cold plate to dissipate the typical 20-40 W power envelope at full utilization. Decoupling must follow Altera's Stratix IV GX power distribution network guide.
This page synthesizes distributor inventory (Heisener 7,360 pcs / Intel Altera stock), pricing tiers, drop-in Stratix IV GX alternates in the same 1152-BGA, and design notes that complement the manufacturer datasheet.
드롭인 대체품: EP4SGX70HF35C2G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX70HF35C2G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Logic Elements, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX70HF35C3G
✅ 드롭인✓ 재고 있음
$1380 / 개
데이터시트 보기 →EP4SGX70HF35C4G
✅ 드롭인✓ 재고 있음
$1650 / 개
데이터시트 보기 →EP4SGX70HF35I3G
✅ 드롭인✓ 재고 있음
$1250 / 개
데이터시트 보기 →EP4SGX110HF35C2G
✅ 드롭인✓ 재고 있음
$3700 / 개
데이터시트 보기 →EP4SGX110HF35C3G
✅ 드롭인✓ 재고 있음
$3128.75 / 개
데이터시트 보기 →EP4SGX70HF35C2G 최대 정격 & 전기적 특성
| Family | Stratix IV GX |
| Logic Elements | 72,600 |
| Embedded Memory Bits | 7,564,880 |
| User I/O Count | 488 |
| Supply Voltage Core | 0.9 V |
| Transceiver Data Rate (max) | 8.5 Gbps |
| Process Technology | 40 nm |
| 패키지 | 1152-BBGA, FCBGA (FC-FBGA) |
| Operating Temperature Grade | C2 (commercial 0°C to +85°C) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant (EU RoHS per Arrow listing) |
| Configuration Modes | JTAG, FPP, AS, PS, PPA |
EP4SGX70HF35C2G 1152-bbga, fcbga (fc-fbga) 핀 구성 가이드
EP4SGX70HF35C2G(1152-bbga, fcbga (fc-fbga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4SGX70HF35C2G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4SGX70HF35C2G 적합 용도: 7 애플리케이션s: PCI Express Gen2 Endpoint Card, 40G/100G Ethernet Bridge / Aggregation, Wireless Baseband Signal Processing, Medical Imaging Accelerator Card, High-Frequency Trading ASIC Prototype, Broadcast Video Router / Format Converter, Military Radar / Signal Intelligence Prototyping.
PCI Express Gen2 Endpoint Card
The EP4SGX70HF35C2G is well suited to PCIe Gen2 endpoint designs because it integrates hardened PCIe Gen1/Gen2 hard IP blocks with the 8.5 Gbps multi-gigabit transceivers. In a typical endpoint card, the FPGA sits on a x8 Gen2 lane physical layer (8 Gbps raw, ~4 Gbps effective per direction), using only ~30% of the 72.6K logic elements for the application layer and leaving room for protocol accelerators. Compared with a soft PCIe implementation on a lower-end Cyclone V, the hard IP delivers lower latency (<120 ns per transaction) and frees logic for DMA engines or NVMe controllers. The 1152-BGA FC-FBGA footprint supports x8 lane fan-out plus 16-bit DDR3 user memory interface. Pair with a multi-rail PMIC (Altera Enpirion) for 0.9 V core sequencing.
추천
40G/100G Ethernet Bridge / Aggregation
The 8.5 Gbps multi-gigabit transceivers in the EP4SGX70HF35C2G can be aggregated into 4x10G lanes to support 40G Ethernet bridging or 10x10G aggregation. The device's high memory bandwidth (7.5 Mbit embedded plus DDR3 controller) makes it ideal for cut-through switching applications where line-rate buffering is required. In a typical 40G-to-4x10G bridge, the 72.6K logic elements are sufficient for L2/L3 forwarding tables up to 256K entries with TCAM emulation. The Stratix IV GX hard PCS blocks eliminate soft PCS logic overhead, saving ~20% of the ALMs compared to Cyclone-class fabric. For larger tables or 100G bridging, the EP4SGX230HF35I4G provides 3x the LE count in the same HF35 footprint.
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Wireless Baseband Signal Processing
The 132 18x18 multipliers and Stratix IV GX DSP block array make the EP4SGX70HF35C2G well suited to wireless baseband signal processing such as LTE PHY, channel equalization, and beamforming pre-processing. With ~50% of the DSP blocks free after 4x4 MIMO LTE 20 MHz processing, the device can also host an embedded CPU subsystem (Nios II or ARM Cortex-A9) for upper-layer MAC functions. The 8.5 Gbps transceivers interface directly to CPRI/OBSAI fronthaul links, simplifying the radio unit architecture. Compared with a TI KeyStone DSP, the FPGA offers reconfiguration flexibility for evolving 5G NR algorithms while maintaining deterministic latency on critical paths. A solid cold plate is required due to the 25-35 W typical power dissipation.
추천
Medical Imaging Accelerator Card
Medical imaging applications such as CT reconstruction, MRI FFT processing, and ultrasound beamforming demand high memory bandwidth and DSP throughput - exactly where the EP4SGX70HF35C2G excels. A 1024-point complex FFT fits within the device's DSP blocks with 4 parallel FFT engines, while the 7.5 Mbit embedded memory buffers intermediate spectral data without round-tripping to off-chip DDR3. The FPGA's partial reconfiguration feature lets the same hardware load different reconstruction kernels (back-projection, iterative reconstruction, deep-learning inference) on demand, maximizing scanner utilization. PCIe Gen2 x8 host interface to a workstation GPU enables shared reconstruction pipelines. The 40 nm process and 0.9 V core give reliable thermal envelopes suitable for the imaging room ambient environment.
추천
High-Frequency Trading ASIC Prototype
The 40 nm Stratix IV GX fabric in the EP4SGX70HF35C2G delivers deterministic, sub-10ns latency for high-frequency trading ASIC prototypes that demand cycle-accurate hardware emulation. The 8 multi-gigabit transceivers provide direct SFP+ optical connectivity to exchange matching engines, while the high-density fabric maps an entire trading pipeline (feed-handler -> book-building -> risk -> order-router) with deterministic path latency. Engineers can iterate on RTL in Quartus, re-running synthesis in minutes rather than the multi-month ASIC tape-out cycle. The 1152-BGA FC-FBGA also enables high-density PCB designs with controlled-impedance traces for sub-nanosecond signal edges. For larger trading cores, the EP4SGX230HF35I4G offers 3x logic capacity in the same HF35 package.
추천
Broadcast Video Router / Format Converter
Broadcast video routers and format converters (3G-SDI to HDMI, SMPTE 2022-6 to SMPTE 2110, UHD up-conversion) benefit from the EP4SGX70HF35C2G's mix of high-speed transceivers, embedded memory, and DSP blocks. A 32x32 3G-SDI router fits comfortably in 72.6K logic elements, with each direction supporting 2.97 Gbps SDI and the embedded memory acting as a frame buffer for format conversion. The 8.5 Gbps transceivers interface directly to 10GbE SFP+ cages for SMPTE 2022-6 IP transport. Compared with a purpose-built crosspoint ASIC, the FPGA gives broadcasters configuration flexibility (reassign inputs/outputs via software) without inventory risk. The commercial 0-85C temperature grade suits controlled broadcast studio environments.
추천
Military Radar / Signal Intelligence Prototyping
Defense applications such as phased-array radar prototyping and signal-intelligence receivers leverage the EP4SGX70HF35C2G's hardened transceivers and DSP fabric for high-bandwidth RF-to-digital conversion. The 8.5 Gbps transceivers interface directly to multi-channel ADC cards (TI ADC12J4000 family), while the DSP blocks implement pulse compression, MTI filtering, and CFAR detection. The industrial temperature grade variants (C3/C4/I3) support wider operating envelopes for shipboard and tactical deployments. Partial reconfiguration lets the same hardware switch between radar modes (search, track, SAR) in real time. The 40 nm process gives reliable radiation tolerance for non-hardened environments and total ionizing dose performance suitable for many COTS-based defense programs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4SGX70HF35C2G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX70HF35C3G | EP4SGX70HF35C4G | EP4SGX70HF35I3G | EP4SGX110HF35C2G | EP4SGX110HF35C3G |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1152-BBGA, FCBGA (HF35) | 1152-BBGA, FCBGA (HF35) - same | 1152-BBGA, FCBGA (HF35) - same | 1152-BBGA, FCBGA (HF35) - same | 1152-BBGA, FCBGA (HF35) - same | 1152-BBGA, FCBGA (HF35) - same |
| Logic Elements | 72,600 | 72,600 (same die) | 72,600 (same die) | 72,600 (same die) | 110,000 | 110,000 |
| Embedded Memory (bits) | 7,564,880 | 7,564,880 (same die) | 7,564,880 (same die) | 7,564,880 (same die) | ~10,388,000 | ~10,388,000 |
| User I/O | 488 | 488 | 488 | 488 | 488 (same pin map) | 488 (same pin map) |
| Temperature Grade | C2 (commercial 0C to 85C) | C3 (0C to 100C) | C4 (-40C to 100C) | I3 (industrial -40C to 100C) | C2 (commercial 0C to 85C) | C3 (0C to 100C) |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Transceiver Data Rate (max) | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps |
| Process Node | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
| Lifecycle Status | last_time_buy | last_time_buy | last_time_buy | last_time_buy | last_time_buy | last_time_buy |
주요 차별점
- Hardened PCIe Gen1/Gen2 IP blocks with 8.5 Gbps transceivers (vs Xilinx Virtex-6 family)
- Pin-compatible density scaling in same 1152-BGA HF35 footprint (vs EP4SGX70HF35C3G (same density, different temp grade))
- 40 nm process with hard PCSs for 8.5 Gbps multi-gigabit channels (vs Altera Cyclone IV GX (lower-end transceiver FPGA))
설계 노트
The EP4SGX70HF35C2G requires multi-rail power sequencing for 0.9 V core, 1.1 V PLL, 1.5 V/2.5 V I/O, and 1.8 V transceiver supplies. Use an Altera/Intel Enpirion EM2xxx series PMIC or a discrete solution following the Stratix IV GX power distribution network (PDN) guide. Estimated: at 85% utilization, total power is typically 20-35 W - plan thermal dissipation accordingly. Power-on sequence must bring up core before transceivers to avoid latch-up.
The 1152-BGA FC-FBGA package has a thermal resistance (theta_JA) in the 0.5-1.0 C/W range - meaning the chip itself has very low thermal impedance but the heatsink interface dominates. Estimated: at 25 W total power dissipation, the junction temperature rise is roughly 12-25C above the heatsink case temperature with a properly attached thermal interface material. A 35 mm x 35 mm BGA-compatible heatsink with TIM is mandatory for any design exceeding 10 W. Forced air cooling may be required in production chassis.
The 1152-BGA HF35 requires a high-density PCB with at least 12 layers (recommended 16) to fan out the 0.8 mm pitch BGA balls. Use stacked micro-vias (laser-drilled 0.1 mm vias) to escape the inner ball rows. Decoupling must follow the Altera Stratix IV GX PDN guide with bulk capacitors distributed across the board to maintain the target impedance below 1 mOhm at transceiver base frequencies. Impedance-controlled traces for transceivers must be 100 Ohm differential with length matching within 0.127 mm.
Multi-gigabit transceiver channels should be routed in pairs with continuous ground reference below to control return-path impedance. Keep AC-coupling capacitors within 100 mil of the BGA ball. Reference voltage planes must be unbroken under all transceiver lanes. Estimated: signal-integrity margins of 8.5 Gbps links are tight - run pre-layout and post-layout simulations in Mentor HyperLynx or Cadence Sigrity before tape-out. Clock inputs require controlled-impedance routing and ferrite beads to prevent noise injection.
Common pitfalls with the EP4SGX70HF35C2G include: (1) missing partial-reconfiguration license in Quartus, (2) omitting configuration mode jumper selection (AS/PS/FPP/JTAG), (3) using a heatsink without proper TIM, (4) insufficient decoupling for the 8.5 Gbps transceivers, and (5) neglecting to check the Stratix IV GX family lifecycle status before committing to production - the family is at last-time-buy as of 2026. Plan a Stratix V or Cyclone 10 GX migration path for new designs.
규정 준수 정보
EU RoHS compliant per Arrow.com product technical specifications. Reach, halogen-free, and conflict-minerals status not stated in web data - consult Intel FPGA environmental compliance documents for confirmation. AEC-Q100 not applicable (this is an FPGA, not an automotive-grade IC). The part carries the Stratix IV family last-time-buy lifecycle status.
