EP4SGX70HF35C4G - Stratix IV GX FPGA 70K LEs, 1152-FBGA | Intel
부품 번호: EP4SGX70HF35C4G ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2558.39 | $2,558.39 |
| 10 | $2302.55 | $23,025.50 |
| 100 | $2051.07 | $205,107.00 |
| 500 | $1840 | $920,000.00 |
| 1,000 | $1650 | $1,650,000.00 |
EP4SGX70HF35C4G 개요
What is a Stratix IV GX FPGA? It is a high-performance programmable logic device from the Stratix family that combines general-purpose logic fabric, dedicated DSP blocks, embedded memory, and integrated multi-gigabit transceivers (MGTs) for high-speed serial I/O. Within the Intel/Altera taxonomy it sits under: FPGA -> programmable logic -> semiconductor device. Stratix IV GX parts target high-bandwidth wireline, wireless, broadcast, and high-performance digital signal processing designs that need both serial connectivity and large parallel fabric.
Key specifications include up to 8 integrated transceivers running up to 8.5 Gbps per channel, hard PCIe Gen1/Gen2 IP cores, embedded memory up to 7.5 Mb (RAM), and dedicated variable-precision DSP blocks supporting 18x18 and 36x36 multipliers. The 1152-ball FCBGA package supports high I/O count with flip-chip attach for improved signal integrity and thermal performance.
Typical applications include 10G/40G Ethernet bridging, PCIe Gen2 endpoint/root complex designs, high-speed serial backplane aggregation, ASIC prototyping, and high-performance DSP pipelines such as radar, medical imaging, and software-defined radio front-ends where the device balances serial bandwidth with parallel fabric throughput.
When designing with this part, pay close attention to power-rail sequencing (core 0.9 V, transceiver PLL, I/O banks), PCB escape routing for the 1152-ball BGA, and thermal management. This page consolidates current distributor pricing, drop-in alternatives in the same 1152-FBGA footprint, and practical design notes that are not found in the manufacturer datasheet alone.
드롭인 대체품: EP4SGX70HF35C4G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX70HF35C4G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Process Technology, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX70HF35C3G
✅ 드롭인✓ 재고 있음
$1380 / 개
데이터시트 보기 →EP4SGX70HF35C2N
✅ 드롭인✓ 재고 있음
$2125 / 개
데이터시트 보기 →EP4SGX70HF35C2G
✅ 드롭인✓ 재고 있음
$1490 / 개
데이터시트 보기 →EP4SGX70HF35C4G 최대 정격 & 전기적 특성
| Family | Stratix IV GX |
| Logic Elements | 72,600 |
| Embedded Memory Bits | 7,564,880 |
| User I/O Count | 488 |
| Total Memory Bits | 7.5 Mb |
| Transceivers (MGT) | Up to 8 channels |
| Transceiver Data Rate | Up to 8.5 Gbps per channel |
| Hard IP for PCIe | Gen1/Gen2 x1/x2/x4 |
| DSP Blocks | Variable-precision 18x18 / 36x36 |
| Process Technology | 40 nm low-power |
| Core Voltage | 0.9 V |
| 패키지 | 1152-ball FCBGA (FineLine BGA) |
| Speed Grade | C4 |
| 동작 온도 | 0 C to +85 C (commercial) |
| 실장 유형 | Surface Mount (flip-chip BGA) |
EP4SGX70HF35C4G 1152-ball fcbga (fineline bga) 핀 구성 가이드
EP4SGX70HF35C4G(1152-ball fcbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4SGX70HF35C4G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4SGX70HF35C4G 적합 용도: 6 애플리케이션s: 10G Ethernet Bridging and Aggregation, PCIe Gen2 Endpoint and Root Complex Designs, High-Speed Serial Backplane Aggregation, ASIC Prototyping and Emulation, High-Performance DSP Pipelines (Radar, Imaging, SDR), Broadcast and Professional Video Processing.
10G Ethernet Bridging and Aggregation
The EP4SGX70HF35C4G fits 10G Ethernet line cards because its 8 integrated multi-gigabit transceivers reach 8.5 Gbps per lane, enabling 1x10G or multi-lane 4x3G SFP+/SFP aggregation. With 72,600 LEs and 7.5 Mb of embedded RAM it can implement packet classification, MAC/IP lookup, and traffic shaping in fabric. Compared with a smaller FPGA, the Stratix IV GX trades power for headroom on burst-heavy workloads and gives designers full hard PCIe Gen2 cores for backplane or CPU interconnect.
추천
PCIe Gen2 Endpoint and Root Complex Designs
For PCIe Gen2 designs the EP4SGX70HF35C4G offers hard PCIe Gen1/Gen2 IP cores supporting x1, x2, and x4 lane widths, saving fabric resources that would otherwise implement soft PCIe PHYs. Engineers use the device in test equipment, NVMe controllers, and accelerator cards that need a deterministic PCIe endpoint with mature IP. The 1152-FCBGA package provides enough user I/Os for sideband management interfaces, while the 8.5 Gbps transceivers handle simultaneous PCIe and Aurora or Serial RapidIO links.
추천
High-Speed Serial Backplane Aggregation
In backplane aggregation the EP4SGX70HF35C4G can act as a fan-out or fan-in hub combining multiple Aurora, Serial RapidIO, or custom serial links into a wider pipe. Its 8 transceivers at 8.5 Gbps support 4+4 fan-in or 1-to-7 fan-out topologies. Designers value the Stratix IV GX dynamic reconfiguration, which lets one PHY be repurposed between protocols at run time. The 488 user I/Os expose parallel interfaces to legacy ASICs or ASSPs alongside the serial aggregation.
추천
ASIC Prototyping and Emulation
The EP4SGX70HF35C4G is widely used in ASIC prototyping because the Stratix IV GX family supports partition-based multi-FPGA flows. The 72,600 LEs map to roughly 8-10 million ASIC gates (depending on memory ratio), and the 7.5 Mb embedded RAM plus external DDR3 controller IP accelerate real-world emulation. Combined with the 1152-FCBGA board space, designers can place multiple parts on a single prototyping board to host a full ASIC. Compared with ASIC tape-out, this lowers non-recurring engineering cost for early software development and validation.
추천
High-Performance DSP Pipelines (Radar, Imaging, SDR)
For DSP pipelines the EP4SGX70HF35C4G offers variable-precision DSP blocks with 18x18 and 36x36 multipliers, allowing resource-efficient FFTs, FIR filters, and matrix operations. In radar or software-defined radio, engineers use the device to implement channelizers, beamformers, and demodulators at line rate. Its 8.5 Gbps transceivers digitize ADC data from JESD204B converters or move pre-processed streams to a host CPU. The 7.5 Mb embedded RAM acts as a fast coefficient and data buffer bank.
추천
Broadcast and Professional Video Processing
In broadcast video the EP4SGX70HF35C4G handles SDI formats up to 3G-SDI and lightweight 4K pipelines via its transceivers and parallel fabric. The 488 user I/Os let designers connect multiple video ports (HDMI, DisplayPort, SDI) simultaneously. The Stratix IV GX IP catalog includes color-space converters, scalers, and frame synchronizers ready for the device. Compared with ASSP video processors, this FPGA adapts to emerging broadcast standards without respinning hardware.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4SGX70HF35C4G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX70HF35C3G | EP4SGX70HF35C2N | EP4SGX70HF35C2G |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 1152-FCBGA | 1152-FCBGA - same | 1152-FCBGA - same | 1152-FCBGA - same |
| Logic Elements | 72,600 | 72,600 (same die) | 72,600 (same die) | 72,600 (same die) |
| Speed Grade | C4 | C3 (faster) | C2 (slower) | C2 (slower) |
| Embedded Memory Bits | 7,564,880 | 7,564,880 | 7,564,880 | 7,564,880 |
| User I/Os | 488 | 488 | 488 | 488 |
| Transceivers (MGT) | Up to 8 | Up to 8 | Up to 8 | Up to 8 |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
주요 차별점
- Higher transceiver speed grade available in same package (vs EP4SGX70HF35C3G)
- Established 40 nm low-power process vs newer 28 nm (vs Stratix V equivalent)
- Pin-compatible with EP4SGX70 family (vs EP4SGX110HF35C4G)
설계 노트
The 1152-ball FCBGA requires careful escape routing. Use a stack-up with at least 8 layers, microvias or back-drilled through-holes, and a 1.0 mm ball pitch escape. Route high-speed transceiver pairs (up to 8.5 Gbps) with 100 ohm differential impedance, length matching within 5 mil, and AC-coupling capacitors placed near the FPGA balls. Verify signal integrity with 3D EM simulation before tape-out.
Estimated: Stratix IV GX power calculators show ~5-10 W typical and up to ~25 W worst-case for a fully utilized EP4SGX70 design. Provide a 0.9 V core regulator rated for at least 15 A continuous, plus separate rails for PLL, transceiver analog, and I/O banks. Sequence rails per Intel/Stratix IV GX handbook to avoid latch-up. Use distributed decoupling with 0402/0201 ceramics close to each ball cluster.
The 1152-FCBGA top-side thermal pad must be soldered to a thermal land on the PCB with thermal vias to inner copper planes. Estimated: theta_JA near 8-12 C/W with a properly sized thermal pad; without it, junction temperatures may exceed 100 C in still air. For commercial 0-85 C operation design margin, keep junction below 90 C worst case; use a heatsink or forced airflow for industrial-grade derating.
Do not assume any cross-brand 1152-FCBGA FPGA is drop-in compatible - Xilinx Virtex-6 LXT and other vendors use different pin assignments. Verify pinout against the Stratix IV GX 1152-FCBGA pin table in the device handbook before substituting. Also note that 'I' (industrial) and 'C' (commercial) temperature grades have the same pinout but differ in screening; 'N' suffix indicates lead-free finish only.
규정 준수 정보
RoHS and lead-free per Stratix IV GX family ordering code conventions (suffix 'G' or 'N' indicates lead-free finish). Halogen-free status not specified in verified web data. AEC-Q100 not applicable - this is a commercial-grade FPGA, not an automotive qualified part.
