EPF10K130EFC672-2X - FLEX 10KE FPGA, 6656 LEs, 672-BGA | Intel
부품 번호: EPF10K130EFC672-2X ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132 | $1,320.00 |
| 100 | $118 | $11,800.00 |
| 250 | $105 | $26,250.00 |
| 500 | $92 | $46,000.00 |
EPF10K130EFC672-2X 개요
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that combines an array of configurable logic blocks (CLBs), programmable interconnect, and configurable I/Os on a single die. Within the broader semiconductor taxonomy, an FPGA sits below custom ASICs in NRE cost and above fixed-function CPLDs in logic capacity. The FLEX 10KE family introduced the industry's first embedded programmable logic device (PLD) family, providing System-on-a-Programmable-Chip (SOPC) integration with an embedded array block (EAB) usable as on-chip RAM, ROM, or product-term logic.
Key features of the EPF10K130EFC672-2X include 832 Logic Array Blocks (LABs) each containing 8 LEs for a total of 6656 LEs, four Delay-Locked Loops (DLLs) for clock skew management, MultiVolt I/O support for interfacing to 5.0 V, 3.3 V, and 2.5 V logic families, and JTAG-compliant IEEE 1149.1 boundary-scan test capability. The 65536-bit embedded array block (EAB) can be configured as RAM, ROM, or FIFO without consuming logic resources.
The 672-FBGA FineLine BGA package provides a 27x27 mm footprint with 1.0 mm ball pitch and a 1.27 mm ball spacing, enabling high-density board routing. The device supports in-system configuration via the serial configuration device interface, allowing field upgrades without removing the board from its system. The FLEX 10KE architecture is widely documented in legacy Altera reference designs and is supported by the legacy MAX+PLUS II and Quartus II design tools.
Typical applications for the EPF10K130EFC672-2X include telecommunications glue logic, industrial control and instrumentation, legacy PCI/ISA bus interface bridges, prototyping and emulation platforms, and replacement of multiple discrete logic devices in legacy telecom and test equipment. The 65536-bit embedded RAM and 413 user I/Os make the part well suited for system-level integration in mid-to-late-1990s and early-2000s equipment designs.
When designing with this device, engineers should note that the FLEX 10KE series is a mature product line. The Intel/Altera Quartus II toolchain (version 13.1 and earlier) and MAX+PLUS II legacy toolchain provide full synthesis and place-and-route support. New designs targeting modern high-speed SERDES, DSP blocks, or transceivers should consider the Cyclone or Arria device families instead.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the manufacturer product page or in the standard datasheet cover page.
드롭인 대체품: EPF10K130EFC672-2X — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K130EFC672-2X (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Logic Array Blocks (LABs), Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K130EFC672-2
✅ 드롭인✓ 재고 있음
$61.75 / 개
데이터시트 보기 →EPF10K130EFC672-1X
✓ 재고 있음
$342.75 / 개
데이터시트 보기 →EPF10K130EFC672-2X 최대 정격 & 전기적 특성
| Series | FLEX 10KE |
| Number of Logic Elements (LEs) | 6656 |
| Number of Logic Array Blocks (LABs) | 832 |
| Total RAM Bits | 65536 |
| Number of User I/Os | 413 |
| Number of DLLs | 4 |
| 패키지 | 672-FBGA (FineLine BGA, 27x27 mm) |
| Ball Pitch | 1.0 mm |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | 3.3 V (MultiVolt I/O supports 5.0 V, 3.3 V, 2.5 V) |
| 동작 온도 | 0C to +70C (commercial) |
| Process Technology | 0.22 μm CMOS SRAM |
| Configuration Method | Serial configuration device, JTAG |
| Logic Family | CMOS, SRAM-based |
| 실장 유형 | Surface Mount (BGA) |
EPF10K130EFC672-2X 672-fbga (fineline bga, 27x27 mm) 핀 구성 가이드
EPF10K130EFC672-2X(672-fbga (fineline bga, 27x27 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF10K130EFC672-2X.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF10K130EFC672-2X 적합 용도: 6 애플리케이션s: Telecommunications Glue Logic, Legacy PCI/ISA Bridge Controllers, Industrial Control and Instrumentation, Prototyping and Emulation Platforms, Replacement of Discrete Logic in Legacy Equipment, Test and Measurement Equipment.
Telecommunications Glue Logic
The EPF10K130EFC672-2X is well suited to telecommunications glue logic in legacy ATM, SONET, and TDM equipment where the design must integrate multiple bus interfaces, custom protocol handlers, and FIFO buffers on a single device. The 6656 logic elements are sufficient for state machines, header parsing, and DMA controllers, while the 65536-bit embedded array block provides on-chip packet buffers without consuming LE resources. MultiVolt I/O support lets the FPGA bridge 5 V bus interfaces to 3.3 V ASICs without external level shifters, simplifying board layout. The 672-FBGA package gives 413 user I/Os, enough for parallel data buses plus JTAG, clock, and configuration pins. Engineers maintaining mid-1990s telecom infrastructure rely on the FLEX 10KE family because the design files, simulation models, and Quartus II bitstreams remain valid decades later.
추천
Legacy PCI/ISA Bridge Controllers
The EPF10K130EFC672-2X was widely deployed as a PCI-to-ISA bridge controller in industrial PCs, embedded single-board computers, and legacy add-in cards of the late 1990s and early 2000s. The 6656 logic elements comfortably fit a 32-bit PCI target interface, an ISA bus master, and a custom register map, while the 65536-bit EAB serves as a shared memory window between the two buses. The 413 user I/Os and 672-FBGA footprint leave room for secondary peripheral buses such as IDE, USB 1.1, or CompactFlash. Operating from a 2.5 V core with 3.3 V PCI-compliant I/O, the part interfaces directly to standard PCI controller ICs without glue logic. Maintenance and repair of installed-base systems continues to drive demand for this FLEX 10KE device into 2026.
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Industrial Control and Instrumentation
Industrial control and instrumentation systems benefit from the EPF10K130EFC672-2X's combination of 6656 logic elements, 413 user I/Os, and embedded RAM for control loop implementation. The device handles encoder input processing, stepper and servo motor control pulse trains, ADC/DAC interfacing, and HMI display multiplexing without external logic. The 4 on-chip Delay-Locked Loops (DLLs) align multiple clock domains commonly needed when synchronizing to motor feedback, network, and backplane buses. The commercial 0C to +70C operating range covers most factory-floor enclosures; for harsher environments, FLEX 10KE industrial-grade variants are available. Long product lifecycles in industrial automation mean that equipment originally designed around FLEX 10KE continues to need these FPGAs for spares and repairs in 2026.
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Prototyping and Emulation Platforms
The EPF10K130EFC672-2X was a popular target for ASIC prototyping and IP emulation platforms in the late 1990s because the FLEX 10KE family balances logic density with a simple SRAM-based configuration flow. Designers could prototype an entire ASIC design using multiple FLEX 10KE devices connected via their general-purpose I/Os, validating logic functionality before committing to mask-set production. The 6656 logic elements per device, 65536 bits of distributed EAB RAM, and 413 user I/Os allow partitioning of typical mid-complexity ASIC designs across 2 to 4 FPGAs. JTAG-based configuration per IEEE 1149.1 enables fast iterative downloads during bring-up. Legacy emulation platforms based on FLEX 10KE devices remain in service at universities, research labs, and government test ranges into 2026, sustaining demand for spare parts.
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Replacement of Discrete Logic in Legacy Equipment
A common design pattern in the FLEX 10KE era was replacing dozens of discrete 74-series TTL logic devices, PAL/GAL chips, and small PLDs with a single EPF10K130EFC672-2X to reduce board area, power consumption, and BOM cost. The 6656 logic elements provide roughly the equivalent of 10,000 to 15,000 gates of discrete TTL, with the 65536-bit EAB replacing separate FIFO/RAM chips. The 413 user I/Os consolidate the multiple bus and control signals that previously required board-level routing across many small packages. For legacy equipment manufacturers still shipping product designed in 1998-2002, the EPF10K130EFC672-2X remains a strategic long-life component. The 672-FBGA package's 27x27 mm footprint requires careful PCB layout but allows extreme component density for systems where board real estate is at a premium.
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Test and Measurement Equipment
Test and measurement instrument designers used the EPF10K130EFC672-2X as a flexible pattern generator, protocol analyzer, and DSP pre-processor in bench-top and modular instrumentation. The 6656 logic elements implement custom stimulus patterns, the 65536-bit EAB stores captured waveforms, and the 413 user I/Os interface to analog front ends, DACs, and high-speed ADCs. The 4 on-chip DLLs synchronize the FPGA logic to external sample clocks and reference oscillators, critical for coherent acquisition. JTAG boundary-scan support simplifies board-level test coverage in production. With test equipment lifecycle measured in decades, oscilloscopes, logic analyzers, and protocol testers built around FLEX 10KE devices continue to require these FPGAs for repair and calibration through 2026 and beyond.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF10K130EFC672-2X — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K130EFC672-2 | EPF10K130EFC672-1X | EPF10K130EFC484-3N |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-FBGA (27x27 mm) | 672-FBGA (27x27 mm) - same | 672-FBGA (27x27 mm) - same | 484-FBGA - different |
| Series | FLEX 10KE | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KE - same |
| Logic Elements | 6656 | 6656 | 6656 | 6656 |
| Total RAM Bits | 65536 | 65536 | 65536 | 65536 |
| Speed Grade | -2X | -2 | -1 (slower) | -3N (faster) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
주요 차별점
- Highest-density FLEX 10KE member in 672-FBGA package (vs EPF10K100EFC484-3N)
- Industrial temperature -2X speed grade option (vs EPF10K130EFC672-1X)
- Mature, well-documented FLEX 10KE architecture (vs Cyclone family)
설계 노트
Estimated: The EPF10K130EFC672-2X in a 672-FBGA package has a typical theta_JA in the range of 8-12 C/W with adequate PCB thermal vias and ground-plane copper under the package. At a typical FLEX 10KE utilization of 50-70% LEs switching at 50 MHz, the part dissipates approximately 1.5-2.5 W. Designers should provide a solid ground plane and thermal vias to the BGA balls to keep junction temperature within the 0C to +70C commercial operating range.
Route all 672-FBGA signals on inner PCB layers with microvias or via-in-pad for high-density escape routing. Use a 4-layer minimum stack-up with continuous VCC and GND planes adjacent to the BGA. Decouple every VCCINT and VCCIO pin with a 0.1 μF X7R ceramic capacitor placed within 100 mils of the ball, and add bulk 47-100 μF tantalum or polymer capacitors near the supply pins. JTAG signals (TCK, TMS, TDI, TDO) require series 33 Ω damping resistors to reduce ringing on long board traces.
Do not confuse FLEX 10KE devices with original FLEX 10K devices - the FLEX 10K family uses 5.0 V core and is NOT pin-compatible with FLEX 10KE. Use Quartus II 13.1 or MAX+PLUS II 10.23 for design compilation; Quartus Prime does not support FLEX 10KE. When ordering, note that the -2X suffix historically denotes specific lead-finish or tape-and-reel variants; verify against the manufacturer's part marking decoder before substituting -2, -2N, or -2X parts in production.
규정 준수 정보
RoHS and lead-free status for the -2X variant is not confirmed in the verified web data. Legacy FLEX 10KE devices typically predate RoHS mandates; the -N suffix variants are lead-free while the bare numeric and -X suffix variants may be lead-bearing. Confirm compliance with the distributor's lot certificate before use in RoHS-restricted products.
