EPF10K200SRC240-1N - 200K FLEX 10KE FPGA, 240-BFQFP | Intel
부품 번호: EPF10K200SRC240-1N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $88.5 | $885.00 |
| 100 | $79.2 | $7,920.00 |
| 500 | $72.8 | $36,400.00 |
| 1,000 | $68.4 | $68,400.00 |
EPF10K200SRC240-1N 개요
An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs / LABs), programmable interconnect, and I/O cells that engineers can customize via a hardware description language (HDL). Within the broader hierarchy, an FPGA belongs to programmable logic devices -> digital logic ICs -> integrated circuits -> semiconductors. FPGAs fill the gap between fixed-function ASICs (high NRE, high volume) and discrete glue logic (low density, fixed function), enabling rapid prototyping, low-volume production, and field upgradability.
Key features include 9,984 logic elements (cells), 1,248 LABs, 182 I/O pins, embedded array blocks for memory, and a maximum internal operating frequency of 250 MHz. The device is built on SRAM-based configuration cells, supporting in-system reprogrammability via the Altera/Intel Quartus or MAX+PLUS II design flows. It is rated for commercial operating temperature grades and uses the 240-pin BQFP exposed-pad package for improved thermal dissipation in surface-mount reflow processes.
The FLEX 10KE architecture combines a fine-grained logic fabric with coarse-grained EABs, allowing efficient implementation of wide multiplexers, arithmetic functions, and small FIFOs without consuming general-purpose routing. Configuration data is stored in an SRAM cell, requiring a configuration device or microcontroller for in-system programming. The exposed pad on the BQFP package provides a low-thermal-resistance path to the PCB, important for the high toggle rates typical of 200K-gate designs.
Typical applications include industrial control glue logic, legacy telecommunications interface cards, low-volume prototyping adapters, custom peripheral bridges, and educational digital-design platforms. The wide I/O count and embedded memory make it suitable for systems that require parallel datapath processing combined with control logic. Because the silicon is older and the family is in obsolescence transition, it is most commonly deployed as a long-life replacement for installed equipment rather than for green-field designs.
When designing with this device, allocate sufficient PCB area for the exposed thermal pad and follow Intel/Altera application notes for JTAG chain configuration and in-system programming. Because the EPF10K200SRC240-1N is a mature part approaching end-of-life, designers should validate long-term supply and consider newer Cyclone or MAX families for new programs.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping procurement and design engineers evaluate the EPF10K200SRC240-1N against modern substitutes.
드롭인 대체품: EPF10K200SRC240-1N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K200SRC240-1N (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Family, Operating Temperature, Package, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K200SRC240-1X
✅ 드롭인✓ 재고 있음
$540 / 개
데이터시트 보기 →EPF10K200SRC240-2
✅ 드롭인✓ 재고 있음
$62.5 / 개
데이터시트 보기 →EPF10K200SRC240-1
✅ 드롭인✓ 재고 있음
$112 / 개
데이터시트 보기 →EPF10K200SRC240-3N
✅ 드롭인✓ 재고 있음
$162 / 개
데이터시트 보기 →EPF10K200SRC240-2N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPF10K200SRC240-1N 최대 정격 & 전기적 특성
| Family | FLEX 10KE |
| Series | EPF10K200 |
| Logic Elements / Cells | 9,984 |
| Equivalent Gates | 200,000 |
| Logic Array Blocks (LABs) | 1,248 |
| Number of I/Os | 182 |
| Supply Voltage (Core) | 2.5 V |
| Maximum Operating Frequency | 250 MHz |
| Process Technology | 0.22 µm CMOS |
| 패키지 | 240-BFQFP Exposed Pad (RQFP-240) |
| 실장 유형 | Surface Mount |
| Configuration Memory | SRAM-based |
| Embedded Array Blocks (EABs) | Yes |
| Operating Temperature Grade | Commercial |
| RoHS 상태 | Compliant |
EPF10K200SRC240-1N 240-bfqfp exposed pad (rqfp-240) 핀 구성 가이드
EPF10K200SRC240-1N(240-bfqfp exposed pad (rqfp-240) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF10K200SRC240-1N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF10K200SRC240-1N 적합 용도: 6 애플리케이션s: Industrial Glue Logic Replacement, Legacy Telecom Interface Cards, Datapath and Arithmetic Accelerators, Custom Peripheral Bridge Adapters, Test & Measurement Instrumentation, Education and HDL Training Platforms.
Industrial Glue Logic Replacement
The EPF10K200SRC240-1N fits legacy industrial control boards that historically used multiple discrete PAL/GAL devices and 74-series glue logic. With 9,984 logic elements, 182 user I/Os, and embedded array blocks, it can replace many small PLDs while integrating timing, handshaking, and bus arbitration functions onto one reprogrammable device. Designers can keep the existing 240-BFQFP footprint and surface-mount reflow profile, avoiding PCB rework. Because the silicon is mature, deterministic behavior simplifies verification in safety-conscious industrial settings.
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Legacy Telecom Interface Cards
Telecom line cards, multiplexing backplanes, and TDM/E1 converters frequently used FLEX 10KE 200K-gate FPGAs in the early 2000s. The EPF10K200SRC240-1N provides 182 I/Os, abundant logic for parallel bus interfaces, and embedded array blocks for small FIFOs and elastic buffers needed in serial-protocol adaptation. Maintaining these cards with the original pin-compatible part avoids costly board redesigns and preserves vendor-qualified timing margins. The SRAM-based configuration also supports field firmware updates via JTAG or a small EPC configuration device.
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Datapath and Arithmetic Accelerators
The 1,248 Logic Array Blocks combined with embedded array blocks make the EPF10K200SRC240-1N well suited for parallel datapath and arithmetic functions such as CRC engines, scramblers, and bus-width converters. Its 250 MHz internal frequency supports multi-gigabit datapath throughput, while the wide 182-I/O count accommodates 32- to 64-bit buses without external multiplexing. Designers can implement wide adders, multipliers, and barrel shifters using dedicated carry-chain paths inside the LABs, saving general-purpose routing resources and improving timing closure on legacy code paths.
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Custom Peripheral Bridge Adapters
Custom peripheral bridges that translate between processor buses (PCI, VME, ISA, custom) and external peripherals often used FLEX 10KE 200K FPGAs as the central glue device. The EPF10K200SRC240-1N's 182 I/Os support multiple parallel interfaces simultaneously, while embedded array blocks implement FIFOs and addressable registers. Designers can keep the same part across multiple adapter SKUs by changing only the bitstream, simplifying inventory. The exposed-pad 240-BFQFP package offers thermal headroom for continuous bidirectional bus traffic.
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Test & Measurement Instrumentation
Test and measurement instruments often require custom timing generators, parallel pattern generators, and protocol analyzers. The EPF10K200SRC240-1N delivers 9,984 logic elements plus embedded array blocks for compact waveform memories, pattern FIFOs, and counters. The 240-BFQFP package provides 182 I/Os to drive multi-channel parallel stimulus or capture buses. Reusing the original part in legacy instruments preserves factory calibration tables and avoids re-characterizing new silicon, which would invalidate ISO/IEC 17025 traceability records.
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Education and HDL Training Platforms
Universities and engineering schools commonly use FLEX 10KE 200K-gate FPGAs on FPGA trainer boards to teach HDL design, synthesis, and timing closure. The EPF10K200SRC240-1N provides enough logic for student projects ranging from UART cores to VGA controllers to simple RISC-V soft CPUs. The mature Altera/Intel Quartus and MAX+PLUS II toolchains offer free or low-cost licenses ideal for academic environments. Used boards with this part are widely available on the secondary market at low cost, making labs affordable.
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추천 제품 요약
엔지니어링 참조 데이터: EPF10K200SRC240-1N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K200SRC240-1X | EPF10K200SRC240-2 | EPF10K200SRC240-1 | EPF10K200SRC240-3N | EPF10K200SRC240-2N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 240-BFQFP Exposed Pad | 240-BFQFP Exposed Pad | 240-BFQFP Exposed Pad | 240-BFQFP | 240-BFQFP Exposed Pad | 240-BFQFP Exposed Pad |
| Logic Elements | 9,984 | 9,984 | 9,984 | 9,984 | 9,984 | 9,984 |
| Speed Grade | 1 (commercial) | 1 (commercial) | 2 (faster) | 1 (commercial) | 3 (slower) | 2 (faster) |
| Terminal Finish | Lead-free (NiPdAu) | SnPb (non-RoHS) | Lead-free | Lead-free | Lead-free | Lead-free |
| Number of I/Os | 182 | 182 | 182 | 182 | 182 | 182 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
주요 차별점
- Lead-free terminal finish (vs EPF10K200SRC240-1X)
- Exposed-pad thermal dissipation (vs EPF10K200SRC240-1)
- Speed-grade 1 timing margin (vs EPF10K200SRC240-2)
설계 노트
Estimated: With 9,984 logic elements running at 250 MHz, the EPF10K200SRC240-1N can dissipate up to 1-2 W under full toggle activity. The 240-BFQFP exposed-pad package provides a direct thermal path to the PCB. Designers should attach the exposed pad to a copper pour of at least 1 square inch with multiple thermal vias to keep junction temperatures within the commercial range. Without proper thermal management, hotspots can reduce long-term reliability even at moderate ambient temperatures.
Follow Intel/Altera layout guidelines for 240-BFQFP packages: use a 0.5 mm pitch land pattern with NSMD pads, fan out signals on inner layers with via-in-pad only when required for signal integrity, and place decoupling capacitors as close to the VCCINT/VCCIO pins as possible. Decoupling values per the FLEX 10KE datasheet include 0.1 µF ceramic near each VCCINT pin and 10 µF bulk tantalum or ceramic at the supply rail entry. Ground bounce on the wide I/O buses is mitigated by keeping the VCCIO and GND plane pair intact across the package.
Because the EPF10K200SRC240-1N is SRAM-based, configuration data is volatile and must be reloaded on every power-up. Always pair the FPGA with an EPC2 or EPC4 configuration device, or drive configuration via a microcontroller. A common mistake is assuming the FPGA retains its bitstream after power-down. Also verify JTAG chain integrity before production: open JTAG pins (TCK, TMS, TDI, TDO) or wrong order in the chain will prevent programming and fail silently during factory test.
규정 준수 정보
RoHS-compliant lead-free finish per the 'N' suffix in the MPN. Lifecycle is obsolete; refer to Intel/Altera PCN database for last-time-buy and obsolescence history.