EPF10K70RC240-3 - 70K FLEX-10K FPGA, 189 I/O, 240-BFQFP | Intel / Altera
부품 번호: EPF10K70RC240-3 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $32.75 | $327.50 |
| 100 | $27.4 | $2,740.00 |
| 500 | $23.1 | $11,550.00 |
| 1,000 | $19.85 | $19,850.00 |
EPF10K70RC240-3 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and configurable I/O cells, all of which can be re-programmed by the designer after manufacturing. FPGAs sit at the top of the programmable logic hierarchy: PLD -> CPLD -> FPGA -> SoC FPGA. Within that taxonomy, the FLEX-10K family pioneered the embedded array block (EAB) concept, allowing megafunctions such as RAM, ROM, and DSP blocks to be embedded alongside general-purpose logic, giving designers System-on-a-Programmable-Chip (SOPC) capability long before modern SoC FPGAs.
Key features include 189 user I/O pins (the largest in the FLEX-10K RC240 footprint class), 468 Logic Array Blocks (LABs), embedded EABs for memory and DSP primitives, JTAG-compliant boundary-scan test support, and built-in configuration circuitry supporting serial and parallel configuration modes. The exposed thermal pad on the 240-BFQFP package allows direct heat extraction to a PCB copper pour, critical for industrial-temperature operation.
Architecturally, the EPF10K70 uses a unique combination of a fine-grained logic fabric for random logic and coarse-grained EABs for wide-word functions, allowing efficient implementation of FIFOs, dual-port RAM, and arithmetic accumulators without consuming general-purpose logic. The -3 speed grade is the mid-band of the family (between -2 and -4), offering the best balance of timing margin and cost.
Typical applications include telecom line-card glue logic, industrial control and factory automation backplanes, military/aerospace avionics systems, prototype ASIC emulation, and legacy replacement for EOL Altera APEX / FLEX-10K designs. Designers frequently use the EPF10K70RC240-3 as the last-time-buy or NRE-prototype FPGA when migrating from older SRAM-based programmable logic.
When designing with this device, ensure 5 V tolerance at the I/O banks is matched to your signal environment, and follow the FLEX-10K configuration guide for JTAG chain ordering when multiple devices share the same TCK/TMS lines. The exposed pad must be soldered to a sufficient copper area to meet the datasheet thermal resistance, typically a 9 x 9 array of thermal vias under the die.
This page synthesizes distributor inventory, drop-in compatible FLEX-10K family alternatives, and practical design notes not consolidated in any single manufacturer datasheet, giving procurement and design engineers a single reference for sourcing and migrating EPF10K70RC240-3 designs.
드롭인 대체품: EPF10K70RC240-3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K70RC240-3 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Process Technology, Configuration Method, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K70RC240-3N
✅ 드롭인✓ 재고 있음
$95 / 개
데이터시트 보기 →EPF10K70RC240-2
✅ 드롭인✓ 재고 있음
$52.8 / 개
데이터시트 보기 →EPF10K70RC240-2N
✅ 드롭인✓ 재고 있음
$65 / 개
데이터시트 보기 →EPF10K70RC240-3GZ
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPF10K70RC240-3 최대 정격 & 전기적 특성
| Series | FLEX-10K |
| Family | FLEX-10K (Classic) |
| Typical Gates | 70,000 |
| Logic Cells | 3,744 |
| Logic Array Blocks (LABs) | 468 |
| Embedded Array Blocks (EABs) | 9 (per family datasheet) |
| Maximum User I/O | 189 |
| Total RAM Bits | 18,432 (typical) |
| Speed Grade | -3 |
| Process Technology | 0.42 µm CMOS |
| 공급 전압 | 5 V |
| 동작 온도 | 0°C to 70°C (Commercial) |
| 패키지 | 240-BFQFP Exposed Pad (RQFP-240) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Check distributor page (original part is non-RoHS) |
| Logic Family | CMOS, SRAM-based |
| Configuration Method | Serial or Parallel, JTAG-supported |
| Propagation Delay (typical) | 0.4 ns |
EPF10K70RC240-3 240-bfqfp exposed pad (rqfp-240) 핀 구성 가이드
EPF10K70RC240-3(240-bfqfp exposed pad (rqfp-240) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF10K70RC240-3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF10K70RC240-3 적합 용도: 6 애플리케이션s: Telecom Line-Card Glue Logic, Industrial Control and Factory Automation, Military and Aerospace Avionics, ASIC Emulation and Prototyping, Legacy EOL Replacement Designs, Test and Measurement Instrumentation.
Telecom Line-Card Glue Logic
The EPF10K70RC240-3 fits telecom line-card glue-logic roles because its 189 user I/Os handle the wide parallel buses between network processors, framers, and PHYs while its 468 LABs absorb address decoding, FIFO control, and timing-recovery state machines. The 5 V I/O tolerance is critical because legacy telecom backplanes still use 5 V TTL signaling, and the embedded array blocks (EABs) implement dual-port RAM and lookup-table-based protocol headers in a single device. Compared with a CPLD approach, the FLEX-10K EAB architecture integrates memory primitives that would otherwise require external SRAM. The exposed pad on the 240-BFQFP package allows adequate thermal dissipation for industrial-temperature telecom environments where forced-air cooling is limited.
추천
Industrial Control and Factory Automation
The EPF10K70RC240-3 suits industrial PLC and factory-automation backplane controllers because its 189 I/Os accept the wide parallel field-bus interfaces (Profibus, DeviceNet, CANopen gateways) without external bus transceivers in many cases, and the 0.42 µm CMOS process is robust against the electrical noise found on factory floors. Per the FLEX-10K family datasheet, the 5 V I/O tolerance interfaces directly to 24 V isolated digital inputs via standard logic-level shifters. The 468 LABs and 9 EABs together implement ladder-logic-to-state-machine translation and motion-control loops in a single device. The exposed pad maintains junction temperature within the commercial 0°C to 70°C range even in sealed control cabinets where ambient can reach 65°C.
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Military and Aerospace Avionics
The EPF10K70RC240-3 has historically been used in military avionics and aerospace systems that require 189 I/Os and 5 V tolerance for ARINC 429, MIL-STD-1553, and discrete interfaces. The FLEX-10K architecture supports triple-module-redundancy (TMR) voting at the LAB level when configured for fault-tolerant operation, a key benefit for radiation-tolerant designs where single-event upsets must be mitigated. Per Altera's legacy aerospace literature, EPF10K70 designs were qualified to military temperature ranges (-55°C to +125°C) under specific ordering codes. The exposed pad on the 240-BFQFP package supports the thermal performance needed for conduction-cooled enclosures in avionics bays.
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ASIC Emulation and Prototyping
The EPF10K70RC240-3 fits ASIC prototyping and emulation roles because its 3,744 logic cells, 9 EABs, and 18,432 RAM bits let designers map blocks of an ASIC design into reconfigurable logic for in-system verification before committing to silicon. Designers use multiple EPF10K70 devices in a chain to emulate larger ASICs, sharing the JTAG bus per the FLEX-10K configuration guide. The 125 MHz internal Fmax at -3 speed grade approaches typical ASIC clock rates, giving reasonable functional validation. The exposed pad keeps the device cool during the long compile-test-debug cycles typical of emulation work, where devices run continuously under stress patterns.
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Legacy EOL Replacement Designs
The EPF10K70RC240-3 is increasingly used to keep legacy Altera APEX / FLEX-10K designs in production when an alternative FPGA family would require full PCB redesign. According to the FLEX-10K family datasheet, the 240-pin RQFP pinout is shared across 10K30, 10K50, 10K70, and 10K100 variants with different density codes, so a design originally built around EPF10K70 can sometimes be migrated to 10K50 if logic is unused. The exposed pad ensures thermal compatibility across the family. Where the 240-BFQFP footprint is hardwired into a long-lifecycle system (industrial, military), keeping the same package avoids costly re-qualification of the PCB.
추천
Test and Measurement Instrumentation
The EPF10K70RC240-3 fits test and measurement equipment because the 189 I/Os handle dense parallel display and front-panel interfaces while the EABs implement hardware-accelerated DSP primitives such as FIR filters and FFT butterflies. The 5 V I/O tolerance interfaces to legacy TTL control logic common in bench instruments. Per the FLEX-10K family datasheet, the 9 EABs can be configured as 2048-bit RAM blocks for sample buffering at full acquisition rate. The exposed pad on the 240-BFQFP package keeps the junction temperature within spec even when the device is densely packed with custom measurement logic running at near-maximum toggle rates.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF10K70RC240-3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K70RC240-3N | EPF10K70RC240-2 | EPF10K70RC240-2N | EPF10K70RC240-3GZ |
|---|---|---|---|---|---|
| Package | 240-BFQFP Exposed Pad | 240-BFQFP Exposed Pad - same | 240-BFQFP Exposed Pad - same | 240-BFQFP Exposed Pad - same | 240-BFQFP Exposed Pad - same |
| Brand | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) |
| Speed Grade | -3 (mid-band, ~125 MHz) | -3 (mid-band) | -2 (faster) | -2 (faster) | -3 (mid-band) |
| RoHS / Pb-Free | Non-RoHS (original) | RoHS / Pb-Free | Non-RoHS (original) | RoHS / Pb-Free | RoHS / Pb-Free (GZ suffix) |
| Typical Gates | 70,000 | 70,000 | 70,000 | 70,000 | 70,000 |
| Logic Cells | 3,744 | 3,744 | 3,744 | 3,744 | 3,744 |
| User I/O | 189 | 189 | 189 | 189 | 189 |
| LABs | 468 | 468 | 468 | 468 | 468 |
| Operating Temperature | 0°C to 70°C (Commercial) | 0°C to 70°C (Commercial) | 0°C to 70°C (Commercial) | 0°C to 70°C (Commercial) | 0°C to 70°C (Commercial) |
주요 차별점
- Highest I/O density in FLEX-10K RC240 footprint (vs EPF10K50RC240-3N)
- Embedded Array Blocks (EABs) for memory-intensive logic (vs Discrete SRAM + CPLD)
- Mid-band -3 speed grade balances cost and performance (vs EPF10K70RC240-2)
설계 노트
The 240-BFQFP package on the EPF10K70RC240-3 carries an exposed thermal pad that must be soldered to a PCB copper pour for reliable thermal performance. Per the FLEX-10K family datasheet, the package thermal resistance theta_JA drops by ~30% with a properly soldered exposed pad connected to a 1 square inch copper pour. Estimated: at maximum toggle activity with all 189 I/Os driving 20 pF loads, expect 1.5-2 W of dynamic dissipation. Without the exposed pad soldered, junction temperature can exceed 100°C in still-air environments, violating the 0°C to 70°C commercial spec at room temperature + 30°C ambient.
Place decoupling capacitors on every VCC and VCCIO pin pair within 100 mils of the EPF10K70RC240-3 package. Recommended: 0.1 µF X7R ceramic on every VCCIO bank plus 10 µF bulk tantalum or polymer near the package. The exposed pad requires at least a 9 x 9 thermal-via array connecting to an internal ground plane. JTAG chain layout must follow the daisy-chain rules in the FLEX-10K configuration guide: TCK/TMS buffered to all devices, TDO of one driving TDI of the next. Without this, configuration failures occur during multi-device programming.
On the EPF10K70RC240-3, configure all unused I/O pins as outputs driving low or as tri-stated inputs with bus-hold enabled, never as floating inputs. Per the FLEX-10K datasheet family, floating inputs on unused I/Os draw additional quiescent current and may oscillate, injecting noise into adjacent signal traces. Enable the internal bus-hold circuit on critical bidirectional signals during configuration to prevent high-impedance glitches during power-up. The 5 V tolerance and 5 V supply make the device sensitive to ground bounce; use multiple ground pins and stitch vias along the perimeter of the package.
Three pitfalls on the EPF10K70RC240-3: (1) Do not confuse the -2, -3, and -4 speed grades — they are not interchangeable in timing-constrained designs; the -2 grade is ~15% faster. (2) Configuration mode pins (MSEL0-3) must be tied to the correct logic levels before power-up; floating MSEL pins cause configuration errors. (3) Per the FLEX-10K datasheet, the device requires a minimum of 4 ms after power-up before CONFIG_DONE is sampled; design your reset logic accordingly. The non-RoHS EPF10K70RC240-3 cannot ship to RoHS-mandated regions — order the -3N or -3GZ suffix instead.
규정 준수 정보
Original EPF10K70RC240-3 is non-RoHS (SnPb finish). Order the -3N or -3GZ suffix for RoHS-compliant lead-free packaging. AEC-Q100 not applicable (FPGA is not an automotive-grade IC). REACH and conflict-minerals compliance per Altera/Intel documentation.